Mark Wendell Schwarz

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Soldering relief method and semiconductor device employing same
- Patent number 8,841,168
- Issue date Sep 23, 2014
- QUALCOMM Incorporated
- Mark Wendell Schwarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering relief method and semiconductor device employing same
- Patent number 8,461,676
- Issue date Jun 11, 2013
- QUALCOMM Incorporated
- Mark Wendell Schwarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDERING RELIEF METHOD AND SEMICONDUCTOR DEVICE EMPLOYING SAME
- Publication number 20130244384
- Publication date Sep 19, 2013
- QUALCOMM Incorporated
- Mark Wendell Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Soldering Relief Method and Semiconductor Device Employing Same
- Publication number 20130062746
- Publication date Mar 14, 2013
- QUALCOMM Incorporated
- Mark Wendell Schwarz
- H01 - BASIC ELECTRIC ELEMENTS