TREA

Mark Wolfe

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  • Austin, TX, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Circuit module with thermal casing systems
    • Patent number 7,737,549
    • Issue date Jun 15, 2010
    • Entorian Technologies LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Heat sink for a high capacity thin module system
    • Patent number 7,626,259
    • Issue date Dec 1, 2009
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Optimized mounting area circuit module system and method
    • Patent number 7,542,297
    • Issue date Jun 2, 2009
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Split core circuit module
    • Patent number 7,522,421
    • Issue date Apr 21, 2009
    • Entorian Technologies, LP
    • David L. Roper
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    High capacity thin module system
    • Patent number 7,459,784
    • Issue date Dec 2, 2008
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit module with thermal casing systems
    • Patent number 7,446,410
    • Issue date Nov 4, 2008
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    High capacity thin module system
    • Patent number 7,443,023
    • Issue date Oct 28, 2008
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    THIN CIRCUIT MODULE AND METHOD
    • Publication number 20090073661
    • Publication date Mar 19, 2009
    • Staktek Group L.P.
    • Mark Wolfe
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Circuit Module with Thermal Casing Systems
    • Publication number 20090052124
    • Publication date Feb 26, 2009
    • Entorian Technologies, L.P. (formerly Staktek Group, L.P)
    • James Douglas Wehrly, JR.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    High Capacity Thin Module System
    • Publication number 20090046431
    • Publication date Feb 19, 2009
    • Staktek Group. L.P.
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    High Capacity Thin Module System and Method
    • Publication number 20080094803
    • Publication date Apr 24, 2008
    • Staktek Group. L.P.
    • James Douglas Wehrly
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Split Core Circuit Module
    • Publication number 20070258217
    • Publication date Nov 8, 2007
    • David L. Roper
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    High capacity thin module system and method
    • Publication number 20060091529
    • Publication date May 4, 2006
    • Staktek Group. L.P.
    • James Douglas Wehrly
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Circuit module with thermal casing systems and methods
    • Publication number 20060090102
    • Publication date Apr 27, 2006
    • James Douglas Wehrly
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Optimized mounting area circuit module system and method
    • Publication number 20060050489
    • Publication date Mar 9, 2006
    • Staktek Group. L.P.
    • James Douglas Wehrly
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR