Marko Swoboda

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Solid body and multi-component arrangement
- Patent number 12,211,702
- Issue date Jan 28, 2025
- Siltectra GmbH
- Wolfram Drescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing wafers with modification lines of defined orie...
- Patent number 12,159,805
- Issue date Dec 3, 2024
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for applying pressure to stress-producing layers...
- Patent number 12,151,314
- Issue date Nov 26, 2024
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for producing at least one modification in a s...
- Patent number 12,107,017
- Issue date Oct 1, 2024
- Infineon Technologies AG
- Ralf Rieske
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a crack in an edge region of a donor substrate
- Patent number 12,097,641
- Issue date Sep 24, 2024
- Siltectra GmbH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating wafers from donor substrates
- Patent number 12,030,216
- Issue date Jul 9, 2024
- Siltectra GmbH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for reducing the thickness of solid-state layers provided wi...
- Patent number 11,869,810
- Issue date Jan 9, 2024
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser conditioning of solid bodies using prior knowledge from previ...
- Patent number 11,822,307
- Issue date Nov 21, 2023
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production facility for separating wafers from donor substrates
- Patent number 11,787,083
- Issue date Oct 17, 2023
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating solid body layers from composite structures m...
- Patent number 11,772,201
- Issue date Oct 3, 2023
- Siltectra GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Parent substrate, wafer composite and methods of manufacturing crys...
- Patent number 11,712,749
- Issue date Aug 1, 2023
- Infineon Technologies AG
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for thinning solid-body layers provided with components
- Patent number 11,664,277
- Issue date May 30, 2023
- Siltectra GmbH
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for processing a semiconductor substrate
- Patent number 11,557,506
- Issue date Jan 17, 2023
- Infineon Technologies AG
- Werner Schustereder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for producing at least one modification in a s...
- Patent number 11,551,981
- Issue date Jan 10, 2023
- Infineon Technologies AG
- Ralf Rieske
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for modifying substrates based on crystal lattice dislocatio...
- Patent number 11,309,191
- Issue date Apr 19, 2022
- Siltectra GmbH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined laser treatment of a solid body to be split
- Patent number 11,130,200
- Issue date Sep 28, 2021
- Siltectra GmbH
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for splitting semiconductor wafers
- Patent number 11,081,393
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing planar modifications in solid bodies
- Patent number 11,059,202
- Issue date Jul 13, 2021
- Siltectra GmbH
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a crack in the edge region of a donor substrate,...
- Patent number 10,994,442
- Issue date May 4, 2021
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for thinning solid body layers provided with components
- Patent number 10,978,311
- Issue date Apr 13, 2021
- Siltectra GmbH
- Wolfram Drescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer hybrid material for use in a splitting method
- Patent number 10,858,495
- Issue date Dec 8, 2020
- Siltectra GmbH
- Christian Beyer
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for guiding a crack in the peripheral region of a donor subs...
- Patent number 10,676,386
- Issue date Jun 9, 2020
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for guiding a crack in the peripheral region of a donor subs...
- Patent number 10,280,107
- Issue date May 7, 2019
- Siltectra, GmbH
- Marko Swoboda
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...
- Publication number 20240413023
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Ralf RIESKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Separating Wafers from Donor Substrates
- Publication number 20230390961
- Publication date Dec 7, 2023
- SILTECTRA GMBH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...
- Publication number 20230330769
- Publication date Oct 19, 2023
- INFINEON TECHNOLOGIES AG
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...
- Publication number 20230093945
- Publication date Mar 30, 2023
- INFINEON TECHNOLOGIES AG
- Ralf RIESKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Device Including an Absorption Layer
- Publication number 20230092013
- Publication date Mar 23, 2023
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SPLITTING SEMICONDUCTOR WAFERS
- Publication number 20230005794
- Publication date Jan 5, 2023
- INFINEON TECHNOLOGIES AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEPARATING A SOLID-STATE LAYER FROM A SOLID-STATE MATERIAL
- Publication number 20210299910
- Publication date Sep 30, 2021
- SILTECTRA GMBH
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Thinning Solid-Body Layers Provided with Components
- Publication number 20210225709
- Publication date Jul 22, 2021
- SILTECTRA GMBH
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solid Body and Multi-Component Arrangement
- Publication number 20210225659
- Publication date Jul 22, 2021
- Wolfram Drescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A CRACK IN AN EDGE REGION OF A DONOR SUBSTRATE
- Publication number 20210213643
- Publication date Jul 15, 2021
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Reducing the Thickness of Solid-State Layers Provided wi...
- Publication number 20210197314
- Publication date Jul 1, 2021
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Splitting Semiconductor Wafers
- Publication number 20210175123
- Publication date Jun 10, 2021
- INFINEON TECHNOLOGIES AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
- Publication number 20210159115
- Publication date May 27, 2021
- INFINEON TECHNOLOGIES AG
- Werner SCHUSTEREDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...
- Publication number 20210053148
- Publication date Feb 25, 2021
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing Short Subcritical Cracks in Solid Bodies
- Publication number 20200398381
- Publication date Dec 24, 2020
- SILTECTRA GMBH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing Wafers with Modification Lines of Defined Orie...
- Publication number 20200388538
- Publication date Dec 10, 2020
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...
- Publication number 20200343147
- Publication date Oct 29, 2020
- INFINEON TECHNOLOGIES AG
- Ralf RIESKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production Facility for Separating Wafers from Donor Substrates
- Publication number 20200254650
- Publication date Aug 13, 2020
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device and Method for Applying Pressure to Stress-Producing Layers...
- Publication number 20200215648
- Publication date Jul 9, 2020
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Thinning Solid Body Layers Provided with Components
- Publication number 20200066542
- Publication date Feb 27, 2020
- SILTECTRA GMBH
- Wolfram Drescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Modifying Substrates Based on Crystal Lattice Dislocatio...
- Publication number 20200051831
- Publication date Feb 13, 2020
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR PRODUCING PLANAR MODIFICATIONS IN SOLID BODIES
- Publication number 20190366586
- Publication date Dec 5, 2019
- SILTECTRA GMBH
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Separating Solid Body Layers from Composite Structures M...
- Publication number 20190337100
- Publication date Nov 7, 2019
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser Conditioning of Solid Bodies Using Prior Knowledge from Previ...
- Publication number 20190302725
- Publication date Oct 3, 2019
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...
- Publication number 20190218131
- Publication date Jul 18, 2019
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED LASER TREATMENT OF A SOLID BODY TO BE SPLIT
- Publication number 20190099838
- Publication date Apr 4, 2019
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYMER HYBRID MATERIAL FOR USE IN A SPLITTING METHOD
- Publication number 20190071552
- Publication date Mar 7, 2019
- SILTECTRA GMBH
- Christian BEYER
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR FORMING A CRACK IN THE EDGE REGION OF A DONOR SUBSTRATE,...
- Publication number 20180370073
- Publication date Dec 27, 2018
- SILTECTRA GMBH
- Marko Swoboda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...
- Publication number 20180185957
- Publication date Jul 5, 2018
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR CONTINUOUS TREATMENT OF A SOLID BODY BY ME...
- Publication number 20180154572
- Publication date Jun 7, 2018
- SILTECTRA GMBH
- Jan Richter
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Marko Swoboda

Person

Patents Grantslast 30 patents

Solid body and multi-component arrangement

Method for producing wafers with modification lines of defined orie...

Device and method for applying pressure to stress-producing layers...

Method and apparatus for producing at least one modification in a s...

Method for forming a crack in an edge region of a donor substrate

Method for separating wafers from donor substrates

Method for reducing the thickness of solid-state layers provided wi...

Laser conditioning of solid bodies using prior knowledge from previ...

Production facility for separating wafers from donor substrates

Method for separating solid body layers from composite structures m...

Parent substrate, wafer composite and methods of manufacturing crys...

Method for thinning solid-body layers provided with components

Methods for processing a semiconductor substrate

Method and apparatus for producing at least one modification in a s...

Method for modifying substrates based on crystal lattice dislocatio...

Combined laser treatment of a solid body to be split

Method for splitting semiconductor wafers

Method and device for producing planar modifications in solid bodies

Method for forming a crack in the edge region of a donor substrate,...

Method for thinning solid body layers provided with components

Polymer hybrid material for use in a splitting method

Method for guiding a crack in the peripheral region of a donor subs...

Method for guiding a crack in the peripheral region of a donor subs...

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...

Method for Separating Wafers from Donor Substrates

Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...

METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...

Method of Forming a Semiconductor Device Including an Absorption Layer

METHOD FOR SPLITTING SEMICONDUCTOR WAFERS

METHOD FOR SEPARATING A SOLID-STATE LAYER FROM A SOLID-STATE MATERIAL

Method for Thinning Solid-Body Layers Provided with Components

Solid Body and Multi-Component Arrangement

METHOD FOR FORMING A CRACK IN AN EDGE REGION OF A DONOR SUBSTRATE

Method for Reducing the Thickness of Solid-State Layers Provided wi...

Method for Splitting Semiconductor Wafers

METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE

Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...

Method for Producing Short Subcritical Cracks in Solid Bodies

Method for Producing Wafers with Modification Lines of Defined Orie...

METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...

Production Facility for Separating Wafers from Donor Substrates

Device and Method for Applying Pressure to Stress-Producing Layers...

Method for Thinning Solid Body Layers Provided with Components

Method for Modifying Substrates Based on Crystal Lattice Dislocatio...

METHOD AND DEVICE FOR PRODUCING PLANAR MODIFICATIONS IN SOLID BODIES

Method for Separating Solid Body Layers from Composite Structures M...

Laser Conditioning of Solid Bodies Using Prior Knowledge from Previ...

METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...

COMBINED LASER TREATMENT OF A SOLID BODY TO BE SPLIT

POLYMER HYBRID MATERIAL FOR USE IN A SPLITTING METHOD

METHOD FOR FORMING A CRACK IN THE EDGE REGION OF A DONOR SUBSTRATE,...

METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...

APPARATUS AND METHOD FOR CONTINUOUS TREATMENT OF A SOLID BODY BY ME...