Markus Brunnbauer

Person

Lappersdorf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier arrangement and method for processing a carrier by generati...
- Patent number 10,748,801
- Issue date Aug 18, 2020
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating semiconductor dies from a semiconductor substr...
- Patent number 10,373,871
- Issue date Aug 6, 2019
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating semiconductor dies from a semiconductor substr...
- Patent number 9,972,535
- Issue date May 15, 2018
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dicing a wafer and semiconductor chip
- Patent number 9,911,655
- Issue date Mar 6, 2018
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece with semiconductor chips, semiconductor device and method...
- Patent number 9,601,475
- Issue date Mar 21, 2017
- INTEL DEUTSCHLAND GMBH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dicing a wafer and semiconductor chip
- Patent number 9,570,352
- Issue date Feb 14, 2017
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Article and panel comprising semiconductor chips, casting mold and...
- Patent number 9,362,144
- Issue date Jun 7, 2016
- INTEL DEUTSCHLAND GMBH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece with semiconductor chips, semiconductor device and method...
- Patent number 9,293,423
- Issue date Mar 22, 2016
- INTEL DEUTSCHLAND GMBH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,093,322
- Issue date Jul 28, 2015
- Intel Mobile Communications GmbH
- Thorsten Meyer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stackable semiconductor package with encapsulant and electrically c...
- Patent number 8,829,663
- Issue date Sep 9, 2014
- Infineon Technologies AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with chip having low-k-layers
- Patent number 8,786,105
- Issue date Jul 22, 2014
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece with semiconductor chips, semiconductor device and method...
- Patent number 8,779,563
- Issue date Jul 15, 2014
- Intel Mobile Communications GmbH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component and method for producing a component
- Patent number 8,742,563
- Issue date Jun 3, 2014
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-Chip RF shields with front side redistribution lines
- Patent number 8,617,929
- Issue date Dec 31, 2013
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package, semiconductor chip assembly, and method...
- Patent number 8,604,622
- Issue date Dec 10, 2013
- Infineon Technologies AG
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module having a semiconductor chip stack and method
- Patent number 8,587,110
- Issue date Nov 19, 2013
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blank including a composite panel with semiconductor chips and plas...
- Patent number 8,524,542
- Issue date Sep 3, 2013
- Intel Mobile Communications GmbH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing chip packages, and chip package produced in th...
- Patent number 8,487,448
- Issue date Jul 16, 2013
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component including a semiconductor chip and a passiv...
- Patent number 8,471,393
- Issue date Jun 25, 2013
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat treatment for a panel and apparatus for carrying out the heat...
- Patent number 8,431,063
- Issue date Apr 30, 2013
- Intel Mobile Communications GmbH
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold method
- Patent number 8,394,308
- Issue date Mar 12, 2013
- Infineon Technologies AG
- Markus Brunnbauer
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device including molding compound layer forms a commo...
- Patent number 8,330,273
- Issue date Dec 11, 2012
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for electrostatic discharge in embedded wafer level packages
- Patent number 8,309,454
- Issue date Nov 13, 2012
- Intel Mobile Communications GmbH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blank including a composite panel with semiconductor chips and plas...
- Patent number 8,247,897
- Issue date Aug 21, 2012
- Intel Mobile Communications GmbH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Article and panel comprising semiconductor chips, casting mold and...
- Patent number 8,217,504
- Issue date Jul 10, 2012
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package, semiconductor chip assembly, and method...
- Patent number 8,202,763
- Issue date Jun 19, 2012
- Infineon Technologies AG
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for producing a device
- Patent number 8,188,585
- Issue date May 29, 2012
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip RF shields with front side redistribution lines
- Patent number 8,178,953
- Issue date May 15, 2012
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold apparatus and method
- Patent number 8,158,046
- Issue date Apr 17, 2012
- Infineon Technologies AG
- Markus Brunnbauer
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor module having a semiconductor chip stack and method
- Patent number 8,106,497
- Issue date Jan 31, 2012
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Carrier Arrangement and Method for Processing a Carrier
- Publication number 20180286735
- Publication date Oct 4, 2018
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEPARATING SEMICONDUCTOR DIES FROM A SEMICONDUCTOR SUBSTR...
- Publication number 20180247872
- Publication date Aug 30, 2018
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING THIN WAFER DURING CHIP MANUFACTURE
- Publication number 20180233470
- Publication date Aug 16, 2018
- INFINEON TECHNOLOGIES AG
- Thomas Killer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Separating Semiconductor Dies from a Semiconductor Substr...
- Publication number 20170345716
- Publication date Nov 30, 2017
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20170309577
- Publication date Oct 26, 2017
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DICING A WAFER AND SEMICONDUCTOR CHIP
- Publication number 20170110371
- Publication date Apr 20, 2017
- INFINEON TECHNOLOGIES AG
- Markus BRUNNBAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DICING A WAFER AND SEMICONDUCTOR CHIP
- Publication number 20160211178
- Publication date Jul 21, 2016
- INFINEON TECHNOLOGIES AG
- Markus BRUNNBAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...
- Publication number 20160163682
- Publication date Jun 9, 2016
- Intel Deutschland GmbH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140357075
- Publication date Dec 4, 2014
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...
- Publication number 20140332937
- Publication date Nov 13, 2014
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CHIP HAVING LOW-K-LAYERS
- Publication number 20140197530
- Publication date Jul 17, 2014
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140151700
- Publication date Jun 5, 2014
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Workpiece with Semiconductor Chips, Semiconductor Device and Method...
- Publication number 20130228904
- Publication date Sep 5, 2013
- Intel Mobile Communications GmbH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLANK INCLUDING A COMPOSITE PANEL WITH SEMICONDUCTOR CHIPS AND PLAS...
- Publication number 20120286434
- Publication date Nov 15, 2012
- INTEL COMMUNICATIONS GMBH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Article and Panel Comprising Semiconductor Chips, Casting Mold and...
- Publication number 20120261841
- Publication date Oct 18, 2012
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR CHIP ASSEMBLY, AND METHOD...
- Publication number 20120256315
- Publication date Oct 11, 2012
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PRODUCING A DEVICE
- Publication number 20120235298
- Publication date Sep 20, 2012
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip RF Shields with Front Side Redistribution Lines
- Publication number 20120208320
- Publication date Aug 16, 2012
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD APPARATUS AND METHOD
- Publication number 20120202319
- Publication date Aug 9, 2012
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR MODULE HAVING A SEMICONDUCTOR CHIP STACK AND METHOD
- Publication number 20120104592
- Publication date May 3, 2012
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING CHIP PACKAGES, AND CHIP PACKAGE PRODUCED IN TH...
- Publication number 20110285030
- Publication date Nov 24, 2011
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT AND METHOD FOR PRODUCING A COMPONENT
- Publication number 20110068485
- Publication date Mar 24, 2011
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR CHIP ASSEMBLY, AND METHOD...
- Publication number 20110024906
- Publication date Feb 3, 2011
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110024915
- Publication date Feb 3, 2011
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR CHIPS
- Publication number 20110024918
- Publication date Feb 3, 2011
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100237506
- Publication date Sep 23, 2010
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONFIGURED WAFER ALIGNMENT
- Publication number 20100233831
- Publication date Sep 16, 2010
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE ELEMENT
- Publication number 20100207272
- Publication date Aug 19, 2010
- INFINEON TECHNOLOGIES AG
- Rainer Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100193928
- Publication date Aug 5, 2010
- INFINEON TECHNOLOGIES AG
- Frank Zudock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip Radio Frequency Shield with Interconnect Metallization
- Publication number 20100078777
- Publication date Apr 1, 2010
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS

Markus Brunnbauer

Person

Patents Grantslast 30 patents

Carrier arrangement and method for processing a carrier by generati...

Method of separating semiconductor dies from a semiconductor substr...

Method of separating semiconductor dies from a semiconductor substr...

Method of dicing a wafer and semiconductor chip

Workpiece with semiconductor chips, semiconductor device and method...

Method of dicing a wafer and semiconductor chip

Article and panel comprising semiconductor chips, casting mold and...

Workpiece with semiconductor chips, semiconductor device and method...

Semiconductor device

Stackable semiconductor package with encapsulant and electrically c...

Semiconductor device with chip having low-k-layers

Workpiece with semiconductor chips, semiconductor device and method...

Component and method for producing a component

On-Chip RF shields with front side redistribution lines

Semiconductor chip package, semiconductor chip assembly, and method...

Semiconductor module having a semiconductor chip stack and method

Blank including a composite panel with semiconductor chips and plas...

Method for producing chip packages, and chip package produced in th...

Semiconductor component including a semiconductor chip and a passiv...

Heat treatment for a panel and apparatus for carrying out the heat...

Mold method

Semiconductor device including molding compound layer forms a commo...

Structure for electrostatic discharge in embedded wafer level packages

Blank including a composite panel with semiconductor chips and plas...

Article and panel comprising semiconductor chips, casting mold and...

Semiconductor chip package, semiconductor chip assembly, and method...

Electronic device and method for producing a device

On-chip RF shields with front side redistribution lines

Mold apparatus and method

Semiconductor module having a semiconductor chip stack and method

Patents Applicationslast 30 patents

Carrier Arrangement and Method for Processing a Carrier

METHOD OF SEPARATING SEMICONDUCTOR DIES FROM A SEMICONDUCTOR SUBSTR...

HANDLING THIN WAFER DURING CHIP MANUFACTURE

Method of Separating Semiconductor Dies from a Semiconductor Substr...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

METHOD OF DICING A WAFER AND SEMICONDUCTOR CHIP

METHOD OF DICING A WAFER AND SEMICONDUCTOR CHIP

WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...

SEMICONDUCTOR DEVICE

WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...

SEMICONDUCTOR DEVICE WITH CHIP HAVING LOW-K-LAYERS

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

Workpiece with Semiconductor Chips, Semiconductor Device and Method...

BLANK INCLUDING A COMPOSITE PANEL WITH SEMICONDUCTOR CHIPS AND PLAS...

Article and Panel Comprising Semiconductor Chips, Casting Mold and...

SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR CHIP ASSEMBLY, AND METHOD...

ELECTRONIC DEVICE AND METHOD FOR PRODUCING A DEVICE

On-Chip RF Shields with Front Side Redistribution Lines

MOLD APPARATUS AND METHOD

SEMICONDUCTOR MODULE HAVING A SEMICONDUCTOR CHIP STACK AND METHOD

METHOD FOR PRODUCING CHIP PACKAGES, AND CHIP PACKAGE PRODUCED IN TH...

COMPONENT AND METHOD FOR PRODUCING A COMPONENT

SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR CHIP ASSEMBLY, AND METHOD...

SEMICONDUCTOR DEVICE

STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

RECONFIGURED WAFER ALIGNMENT

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE ELEMENT

SEMICONDUCTOR DEVICE

On-Chip Radio Frequency Shield with Interconnect Metallization