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Markus Dinkel
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Unterhaching, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device having a carrier, semiconductor chip packages...
Patent number
11,915,999
Issue date
Feb 27, 2024
Infineon Technologies AG
Tomasz Naeve
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating a semiconductor package
Patent number
11,776,882
Issue date
Oct 3, 2023
Infineon Technologies Austria AG
Markus Dinkel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Clip having locking recess for connecting an electronic component w...
Patent number
11,728,309
Issue date
Aug 15, 2023
Infineon Technologies AG
Melvin Levardo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plurality of transistor packages with exposed source and drain cont...
Patent number
11,600,558
Issue date
Mar 7, 2023
Infineon Technologies AG
Tomasz Naeve
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe leads having fully plated end faces
Patent number
11,342,252
Issue date
May 24, 2022
Infineon Technologies AG
Stefan Macheiner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating a semiconductor pac...
Patent number
11,302,610
Issue date
Apr 12, 2022
Infineon Technologies Austria AG
Markus Dinkel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing an SMD package with top side cooling
Patent number
10,903,133
Issue date
Jan 26, 2021
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module having an electrically insulating structure with...
Patent number
10,813,229
Issue date
Oct 20, 2020
Infineon Technologies AG
Toni Salminen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe leads having fully plated end faces
Patent number
10,796,986
Issue date
Oct 6, 2020
Infineon Technologies AG
Stefan Macheiner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
SMD package with flat contacts to prevent bottleneck
Patent number
10,699,987
Issue date
Jun 30, 2020
tInfineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
SMD package with top side cooling
Patent number
10,566,260
Issue date
Feb 18, 2020
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-functional interconnect module and carrier with multi-functio...
Patent number
10,168,391
Issue date
Jan 1, 2019
Infineon Technologies AG
Giuliano Angelo Babulano
G01 - MEASURING TESTING
Information
Patent Grant
Electronic device including a metal substrate and a semiconductor m...
Patent number
9,935,027
Issue date
Apr 3, 2018
Infineon Technologies AG
Markus Dinkel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including lead frames with downset
Patent number
9,922,904
Issue date
Mar 20, 2018
Infineon Technologies AG
Markus Dinkel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having a source-down configured transistor di...
Patent number
9,881,853
Issue date
Jan 30, 2018
Infineon Technologies AG
Dirk Ahlers
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Module with integrated power electronic circuitry and logic circuitry
Patent number
9,681,558
Issue date
Jun 13, 2017
Infineon Technologies AG
Liu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
Patent number
9,570,433
Issue date
Feb 14, 2017
Infineon Technologies AG
Markus Zundel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power package with integrated magnetic field sensor
Patent number
9,564,423
Issue date
Feb 7, 2017
Infineon Technologies AG
Liu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with integrated magnetic field sensor
Patent number
9,564,578
Issue date
Feb 7, 2017
Infineon Technologies AG
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Overmolded substrate-chip arrangement with heat sink
Patent number
9,385,059
Issue date
Jul 5, 2016
Infineon Technologies AG
Peter Ossimitz
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
Patent number
9,171,777
Issue date
Oct 27, 2015
Infineon Technologies AG
Markus Zundel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating a semiconductor package with mold lock opening
Patent number
8,466,009
Issue date
Jun 18, 2013
Infineon Technologies AG
Bernd Goller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module including semiconductor chips coupled to exter...
Patent number
8,120,161
Issue date
Feb 21, 2012
Infineon Technologies AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with mold lock vent
Patent number
7,732,937
Issue date
Jun 8, 2010
Infineon Technologies AG
Bernd Goller
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method Of Manufacturing A Package Using A Clip Having At Least One...
Publication number
20230387068
Publication date
Nov 30, 2023
INFINEON TECHNOLOGIES AG
Melvin Levardo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR...
Publication number
20230230903
Publication date
Jul 20, 2023
INFINEON TECHNOLOGIES AG
Hooi Boon TEOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A CARRIER, SEMICONDUCTOR CHIP PACKAGES...
Publication number
20230187326
Publication date
Jun 15, 2023
Tomasz Naeve
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods for Manufacturing Thereof
Publication number
20230095545
Publication date
Mar 30, 2023
Paul Armand Calo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
Publication number
20220230941
Publication date
Jul 21, 2022
Markus Dinkel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A CAVITY IN ITS PACKAGE BODY
Publication number
20210035876
Publication date
Feb 4, 2021
INFINEON TECHNOLOGIES AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME LEADS HAVING FULLY PLATED END FACES
Publication number
20210020553
Publication date
Jan 21, 2021
INFINEON TECHNOLOGIES AG
Stefan Macheiner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Clip Having Locking Recess
Publication number
20200365549
Publication date
Nov 19, 2020
Melvin Levardo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip Package, Method of Forming a Chip Package, Semiconductor Devic...
Publication number
20200328141
Publication date
Oct 15, 2020
INFINEON TECHNOLOGIES AG
Tomasz Naeve
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Producing an SMD Package with Top Side Cooling
Publication number
20200144150
Publication date
May 7, 2020
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method of Fabricating a Semiconductor Pac...
Publication number
20200135619
Publication date
Apr 30, 2020
Markus Dinkel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SMD Package with Top Side Cooling
Publication number
20190080980
Publication date
Mar 14, 2019
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SMD Package
Publication number
20180301398
Publication date
Oct 18, 2018
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package Having a Source-Down Configured Transistor Di...
Publication number
20170287820
Publication date
Oct 5, 2017
INFINEON TECHNOLOGIES AG
Dirk Ahlers
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
LEADFRAME LEADS HAVING FULLY PLATED END FACES
Publication number
20170271246
Publication date
Sep 21, 2017
INFINEON TECHNOLOGIES AG
Stefan Macheiner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package with Integrated Magnetic Field Sensor
Publication number
20160380181
Publication date
Dec 29, 2016
INFINEON TECHNOLOGIES AG
Thorsten Meyer
G01 - MEASURING TESTING
Information
Patent Application
POWER PACKAGE WITH INTEGRATED MAGNETIC FIELD SENSOR
Publication number
20160379966
Publication date
Dec 29, 2016
INFINEON TECHNOLOGIES AG
Liu Chen
G01 - MEASURING TESTING
Information
Patent Application
Multi-Functional Interconnect Module and Carrier with Multi-Functio...
Publication number
20160377689
Publication date
Dec 29, 2016
INFINEON TECHNOLOGIES AG
Giuliano Angelo Babulano
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING LEAD FRAMES WITH DOWNSET
Publication number
20160351475
Publication date
Dec 1, 2016
INFINEON TECHNOLOGIES AG
Markus Dinkel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE INCLUDING A METAL SUBSTRATE AND A SEMICONDUCTOR M...
Publication number
20160329260
Publication date
Nov 10, 2016
INFINEON TECHNOLOGIES AG
Markus Dinkel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic module having an electrically insulating structure with...
Publication number
20160113127
Publication date
Apr 21, 2016
INFINEON TECHNOLOGIES AG
Toni SALMINEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Module with Integrated Power Electronic Circuitry and Logic Circuitry
Publication number
20160050768
Publication date
Feb 18, 2016
INFINEON TECHNOLOGIES AG
Liu Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
Publication number
20160013176
Publication date
Jan 14, 2016
INFINEON TECHNOLOGIES AG
Markus Zundel
G01 - MEASURING TESTING
Information
Patent Application
Overmolded substrate-chip arrangement with heat sink
Publication number
20150062825
Publication date
Mar 5, 2015
INFINEON TECHNOLOGIES AG
Peter Ossimitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
Publication number
20140167043
Publication date
Jun 19, 2014
INFINEON TECHNOLOGIES AG
Markus Zundel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method for Manufacturing a Semiconductor D...
Publication number
20140167044
Publication date
Jun 19, 2014
INFINEON TECHNOLOGIES AG
Markus Zundel
G01 - MEASURING TESTING
Information
Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE WITH MOLD LOCK OPENING
Publication number
20100227436
Publication date
Sep 9, 2010
INFINEON TECHNOLOGIES AG
Bernd Goller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH MOLD LOCK VENT
Publication number
20090224382
Publication date
Sep 10, 2009
INFINEON TECHNOLOGIES AG
Bernd Goller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Module
Publication number
20080251859
Publication date
Oct 16, 2008
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS