Markus Fink

Person

Zell, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module having a semiconductor chip stack and method
- Patent number 8,587,110
- Issue date Nov 19, 2013
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor chip panel
- Patent number 8,148,210
- Issue date Apr 3, 2012
- Infineon Technologies AG
- Edward Fuergut
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor module having a semiconductor chip stack and method
- Patent number 8,106,497
- Issue date Jan 31, 2012
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device comprising conductors made of carbonized plastic,...
- Patent number 7,709,379
- Issue date May 4, 2010
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and semiconductor wafer, and method for produc...
- Patent number 7,420,262
- Issue date Sep 2, 2008
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for surface-mounted semiconductor devices
- Patent number 7,230,831
- Issue date Jun 12, 2007
- Infineon Technologies AG
- Uwe Luckner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE, POWER ELECTRONIC SUBSTRATE AND METHOD FOR FAB...
- Publication number 20240413046
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Frank Sauerland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...
- Publication number 20240347427
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Edward FÜRGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE HAVING A SEMICONDUCTOR CHIP STACK AND METHOD
- Publication number 20120104592
- Publication date May 3, 2012
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR CHIP PANEL
- Publication number 20120064673
- Publication date Mar 15, 2012
- Edward Fuergut
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR MODULE HAVING A SEMICONDUCTOR CHIP STACK AND METHOD
- Publication number 20070176277
- Publication date Aug 2, 2007
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink for surface-mounted semiconductor devices
- Publication number 20060158857
- Publication date Jul 20, 2006
- Uwe Luckner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and semiconductor wafer, and method for produc...
- Publication number 20040207049
- Publication date Oct 21, 2004
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Markus Fink

Person

Patents Grantslast 30 patents

Semiconductor module having a semiconductor chip stack and method

Method for fabricating a semiconductor chip panel

Semiconductor module having a semiconductor chip stack and method

Electrical device comprising conductors made of carbonized plastic,...

Electronic component and semiconductor wafer, and method for produc...

Heat sink for surface-mounted semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE, POWER ELECTRONIC SUBSTRATE AND METHOD FOR FAB...

LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...

SEMICONDUCTOR MODULE HAVING A SEMICONDUCTOR CHIP STACK AND METHOD

METHOD FOR FABRICATING A SEMICONDUCTOR CHIP PANEL

SEMICONDUCTOR MODULE HAVING A SEMICONDUCTOR CHIP STACK AND METHOD

Heat sink for surface-mounted semiconductor devices

Electronic component and semiconductor wafer, and method for produc...