Markus HAMMER

Person

Pielenhofen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacture thereof
- Patent number 9,269,654
- Issue date Feb 23, 2016
- Infineon Technologies AG
- Stefan Willkofer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High voltage resistance coupling structure
- Patent number 8,790,985
- Issue date Jul 29, 2014
- Infineon Technologies Austria AG
- Uwe Wahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicle lighting arrangement
- Patent number 8,736,172
- Issue date May 27, 2014
- Infineon Technologies AG
- Markus Hammer
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and method of manufacture thereof
- Patent number 8,674,800
- Issue date Mar 18, 2014
- Infineon Technologies AG
- Stefan Willkofer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of processing a contact pad, method of manufacturing a conta...
- Patent number 8,669,666
- Issue date Mar 11, 2014
- Infineon Technologies AG
- Markus Hammer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method of manufacture thereof
- Patent number 8,614,616
- Issue date Dec 24, 2013
- Infineon Technologies AG
- Stefan Willkofer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
System for separation of an electrically conductive connection
- Patent number 8,384,132
- Issue date Feb 26, 2013
- Infineon Technologies AG
- Guenther Ruhl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage resistance coupling structure
- Patent number 8,278,730
- Issue date Oct 2, 2012
- Infineon Technologies Austria AG
- Uwe Wahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a contact pad, method of manufacturing a conta...
- Patent number 7,829,450
- Issue date Nov 9, 2010
- Infineon Technologies AG
- Markus Hammer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
System for separation of an electrically conductive connection
- Patent number 7,799,583
- Issue date Sep 21, 2010
- Infineon Technologies AG
- Günther Ruhl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an integrated semiconductor configuration wi...
- Patent number 6,897,112
- Issue date May 24, 2005
- Infineon Technologies AG
- Markus Hammer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Manufacture Thereof
- Publication number 20140159220
- Publication date Jun 12, 2014
- INFINEON TECHNOLOGIES AG
- Stefan Willkofer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture Thereof
- Publication number 20130328166
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Stefan Willkofer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Resistance Coupling Structure
- Publication number 20120273917
- Publication date Nov 1, 2012
- Infineon Technologies Austria AG
- Uwe Wahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VEHICLE LIGHTING ARRANGEMENT
- Publication number 20120256542
- Publication date Oct 11, 2012
- Markus HAMMER
- B60 - VEHICLES IN GENERAL
Information Patent Application
Semiconductor Device and Method of Manufacture Thereof
- Publication number 20120181874
- Publication date Jul 19, 2012
- Stefan Willkofer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE RESISTANCE COUPLING STRUCTURE
- Publication number 20110095392
- Publication date Apr 28, 2011
- Infineon Technologies Austria AG
- Uwe Wahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Processing a Contact Pad, Method of Manufacturing a Conta...
- Publication number 20110031625
- Publication date Feb 10, 2011
- Markus Hammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR SEPARATION OF AN ELECTRICALLY CONDUCTIVE CONNECTION
- Publication number 20100320460
- Publication date Dec 23, 2010
- Infineon Technologies AG
- Gunther Ruhl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Processing a Contact Pad, Method of Manufacturing a Conta...
- Publication number 20090115074
- Publication date May 7, 2009
- Markus Hammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for separation of an electrically conductive connection
- Publication number 20080079160
- Publication date Apr 3, 2008
- Gunther Ruhl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating an integrated semiconductor configuration wi...
- Publication number 20030068873
- Publication date Apr 10, 2003
- Markus Hammer
- H01 - BASIC ELECTRIC ELEMENTS

Markus HAMMER

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacture thereof

High voltage resistance coupling structure

Vehicle lighting arrangement

Semiconductor device and method of manufacture thereof

Method of processing a contact pad, method of manufacturing a conta...

Semiconductor device and method of manufacture thereof

System for separation of an electrically conductive connection

High voltage resistance coupling structure

Method of processing a contact pad, method of manufacturing a conta...

System for separation of an electrically conductive connection

Method for fabricating an integrated semiconductor configuration wi...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Manufacture Thereof

Semiconductor Device and Method of Manufacture Thereof

High Voltage Resistance Coupling Structure

VEHICLE LIGHTING ARRANGEMENT

Semiconductor Device and Method of Manufacture Thereof

HIGH VOLTAGE RESISTANCE COUPLING STRUCTURE

Method of Processing a Contact Pad, Method of Manufacturing a Conta...

SYSTEM FOR SEPARATION OF AN ELECTRICALLY CONDUCTIVE CONNECTION

Method of Processing a Contact Pad, Method of Manufacturing a Conta...

System for separation of an electrically conductive connection

Method for fabricating an integrated semiconductor configuration wi...