Markus Juch Heinrici

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Viktring, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming a silicon-insulator layer and semiconductor devi...
- Patent number 11,195,713
- Issue date Dec 7, 2021
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slicing SiC material by wire electrical discharge machining
- Patent number 10,967,450
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Nirdesh Ojha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming semiconductor devices and semiconductor device
- Patent number 10,453,806
- Issue date Oct 22, 2019
- Infineon Teohnologies Austria AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a porous conductive structure in connection to...
- Patent number 10,373,868
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a layer structure having partially sealed p...
- Patent number 9,929,111
- Issue date Mar 27, 2018
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a metallization layer and method of manufacturing...
- Patent number 9,844,134
- Issue date Dec 12, 2017
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing a resin material on a semiconductor body with...
- Patent number 9,818,602
- Issue date Nov 14, 2017
- Infineon Technologies AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for structuring a substrate using a protection layer as a mask
- Patent number 9,793,119
- Issue date Oct 17, 2017
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for structuring a substrate
- Patent number 9,768,023
- Issue date Sep 19, 2017
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor substrate and a method for pr...
- Patent number 9,673,096
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device having a contact pad w...
- Patent number 9,620,466
- Issue date Apr 11, 2017
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a copper layer on a semiconductor body using a...
- Patent number 9,190,322
- Issue date Nov 17, 2015
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of Forming a Silicon-Insulator Layer and Semiconductor Devi...
- Publication number 20190385842
- Publication date Dec 19, 2019
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slicing SiC Material by Wire Electrical Discharge Machining
- Publication number 20190337069
- Publication date Nov 7, 2019
- INFINEON TECHNOLOGIES AG
- Nirdesh Ojha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE
- Publication number 20180145038
- Publication date May 24, 2018
- Infineon Technologies Austria AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SUBSTRATE AND AN ELECTRONIC DEVICE
- Publication number 20170207123
- Publication date Jul 20, 2017
- Infineon Technologies Austria AG
- Martin MISCHITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A LAYER STRUCTURE HAVING PARTIALLY SEALED P...
- Publication number 20170194272
- Publication date Jul 6, 2017
- INFINEON TECHNOLOGIES AG
- Martin MISCHITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STRUCTURING A SUBSTRATE
- Publication number 20170154767
- Publication date Jun 1, 2017
- INFINEON TECHNOLOGIES AG
- Martin MISCHITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING A METALLIZATION LAYER AND METHOD OF MANUFACTURING...
- Publication number 20160225718
- Publication date Aug 4, 2016
- INFINEON TECHNOLOGIES AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embrittlement device, pick-up system and method of picking up chips
- Publication number 20160204017
- Publication date Jul 14, 2016
- Infineon Technologies Austria AG
- Michael Roesner
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE AND A METHOD FOR PR...
- Publication number 20160141208
- Publication date May 19, 2016
- INFINEON TECHNOLOGIES AG
- Hirschler Joachim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods with Inkjet Processes and Their Application
- Publication number 20160082718
- Publication date Mar 24, 2016
- Infineon Technologies Austria AG
- Stefan Schwab
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method for Producing a Copper Layer on a Semiconductor Body Using a...
- Publication number 20150214095
- Publication date Jul 30, 2015
- INFINEON TECHNOLOGIES AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS

Markus Juch Heinrici

Person

Patents Grantslast 30 patents

Methods of forming a silicon-insulator layer and semiconductor devi...

Slicing SiC material by wire electrical discharge machining

Methods for forming semiconductor devices and semiconductor device

Method of processing a porous conductive structure in connection to...

Method of manufacturing a layer structure having partially sealed p...

Device including a metallization layer and method of manufacturing...

Method of depositing a resin material on a semiconductor body with...

Method for structuring a substrate using a protection layer as a mask

Method for structuring a substrate

Method for processing a semiconductor substrate and a method for pr...

Method of manufacturing an electronic device having a contact pad w...

Method for producing a copper layer on a semiconductor body using a...

Patents Applicationslast 30 patents

Methods of Forming a Silicon-Insulator Layer and Semiconductor Devi...

Slicing SiC Material by Wire Electrical Discharge Machining

METHODS FOR FORMING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE

METHOD FOR PROCESSING A SUBSTRATE AND AN ELECTRONIC DEVICE

METHOD OF MANUFACTURING A LAYER STRUCTURE HAVING PARTIALLY SEALED P...

METHOD FOR STRUCTURING A SUBSTRATE

DEVICE INCLUDING A METALLIZATION LAYER AND METHOD OF MANUFACTURING...

Embrittlement device, pick-up system and method of picking up chips

METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE AND A METHOD FOR PR...

Methods with Inkjet Processes and Their Application

Method for Producing a Copper Layer on a Semiconductor Body Using a...