Markus Kahn

Person

Rangersdorf, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with first and second portions that include si...
- Patent number 11,804,415
- Issue date Oct 31, 2023
- Infineon Technologies AG
- Markus Kahn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer chuck and processing arrangement
- Patent number 11,387,081
- Issue date Jul 12, 2022
- Infineon Technologies AG
- Rudolf Kogler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device, microphone and methods for forming a semicond...
- Patent number 11,352,253
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Markus Kahn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with a portion including silicon and nitrogen...
- Patent number 11,075,134
- Issue date Jul 27, 2021
- Infineon Technologies AG
- Markus Kahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, microphone and methods for forming a semicond...
- Patent number 10,858,246
- Issue date Dec 8, 2020
- Infineon Technologies AG
- Markus Kahn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical structure and method for manufacturing the same
- Patent number 10,710,874
- Issue date Jul 14, 2020
- Infineon Technologies AG
- Tobias Frischmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer chuck and processing arrangement
- Patent number 10,629,416
- Issue date Apr 21, 2020
- Infineon Technologies AG
- Rudolf Kogler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor wafer and method for processing a semiconductor wafer
- Patent number 10,325,803
- Issue date Jun 18, 2019
- Infineon Technologies AG
- Matthias Kuenle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Micromechanical structure comprising carbon material and method for...
- Patent number 10,106,398
- Issue date Oct 23, 2018
- Infineon Technologies AG
- Ulrich Schmid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical structure and method for fabricating the same
- Patent number 10,081,533
- Issue date Sep 25, 2018
- Infineon Technologies AG
- Ulrich Schmid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Self aligned silicon carbide contact formation using protective layer
- Patent number 10,049,879
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method for processing a semiconductor wafer
- Patent number 9,984,915
- Issue date May 29, 2018
- Infineon Technologies AG
- Matthias Kuenle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for processing a semiconductor layer, method for processing...
- Patent number 9,941,111
- Issue date Apr 10, 2018
- Infineon Technologies AG
- Gerhard Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon based contact structure for silicon carbide device technical...
- Patent number 9,917,170
- Issue date Mar 13, 2018
- Infineon Technologies AG
- Ravi Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices
- Patent number 9,741,618
- Issue date Aug 22, 2017
- Infineon Technologies AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer and method of making a passivation layer
- Patent number 9,728,480
- Issue date Aug 8, 2017
- Infineon Technologies AG
- Kurt Matoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned silicon carbide contact formation using protective layer
- Patent number 9,666,482
- Issue date May 30, 2017
- Infineon Technologies AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing a sacrificial material during manufacture of a microfabr...
- Patent number 9,511,560
- Issue date Dec 6, 2016
- Infineon Technologies AG
- Guenter Denifl
- B44 - DECORATIVE ARTS
Information Patent Grant
Method for coating a workpiece
- Patent number 9,478,409
- Issue date Oct 25, 2016
- Infineon Technologies AG
- Juergen Steinbrenner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controlling the reflow behaviour of BPSG films and devices made the...
- Patent number 9,455,136
- Issue date Sep 27, 2016
- Infineon Technologies Austria AG
- Juergen Steinbrenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of singulating substrates to form semiconductor devices usi...
- Patent number 9,257,342
- Issue date Feb 9, 2016
- Infineon Technologies AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro mechanical structure and method for fabricating the same
- Patent number 9,212,045
- Issue date Dec 15, 2015
- Infineon Technologies AG
- Ulrich Schmid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of forming semiconductor devices by singulating a substrate...
- Patent number 8,748,297
- Issue date Jun 10, 2014
- Infineon Technologies AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THEREOF
- Publication number 20240194779
- Publication date Jun 13, 2024
- Infineon Technologies Austria AG
- Christian Zmölnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Semiconductor Device with Step Topography Passivation...
- Publication number 20230343726
- Publication date Oct 26, 2023
- INFINEON TECHNOLOGIES AG
- Angelika Koprowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIRST AND SECOND PORTIONS THAT INCLUDE SI...
- Publication number 20210287954
- Publication date Sep 16, 2021
- Markus Kahn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
High Voltage Semiconductor Device with Step Topography Passivation...
- Publication number 20210151391
- Publication date May 20, 2021
- INFINEON TECHNOLOGIES AG
- Angelika Koprowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Microphone and Methods for Forming a Semicond...
- Publication number 20210002132
- Publication date Jan 7, 2021
- INFINEON TECHNOLOGIES AG
- Markus Kahn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER CHUCK AND PROCESSING ARRANGEMENT
- Publication number 20200251314
- Publication date Aug 6, 2020
- INFINEON TECHNOLOGIES AG
- Rudolf Kogler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Device with a Portion Including Silicon and Nitrogen...
- Publication number 20200083133
- Publication date Mar 12, 2020
- Markus Kahn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Device and Manufacturing
- Publication number 20190333765
- Publication date Oct 31, 2019
- Markus Kahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlling the Reflow Behaviour of BPSG Films and Devices Made The...
- Publication number 20180247820
- Publication date Aug 30, 2018
- Infineon Technologies Austria AG
- Juergen Steinbrenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER
- Publication number 20180247857
- Publication date Aug 30, 2018
- INFINEON TECHNOLOGIES AG
- Matthias Kuenle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE, MICROPHONE AND METHODS FOR FORMING A SEMICOND...
- Publication number 20180237292
- Publication date Aug 23, 2018
- INFINEON TECHNOLOGIES AG
- Markus Kahn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER CHUCK AND PROCESSING ARRANGEMENT
- Publication number 20180211821
- Publication date Jul 26, 2018
- Infineon Technologies AG
- Rudolf Kogler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self Aligned Silicon Carbide Contact Formation Using Protective Layer
- Publication number 20180076036
- Publication date Mar 15, 2018
- INFINEON TECHNOLOGIES AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROMECHANICAL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180002167
- Publication date Jan 4, 2018
- INFINEON TECHNOLOGIES AG
- Tobias Frischmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Carbon Based Contact Structure for Silicon Carbide Device Technical...
- Publication number 20170309720
- Publication date Oct 26, 2017
- INFINEON TECHNOLOGIES AG
- Ravi Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD, METHOD FOR PRODUCING A MOLD, AND METHOD FOR FORMING A MOLD AR...
- Publication number 20170197865
- Publication date Jul 13, 2017
- Infineon Technologies Austria AG
- Guenter Denifl
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Methods of Forming Semiconductor Devices
- Publication number 20170194205
- Publication date Jul 6, 2017
- INFINEON TECHNOLOGIES AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlling the Reflow Behaviour of BPSG Films and Devices Made The...
- Publication number 20170011927
- Publication date Jan 12, 2017
- Infineon Technologies Austria AG
- Juergen Steinbrenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR LAYER, METHOD FOR PROCESSING...
- Publication number 20160351413
- Publication date Dec 1, 2016
- INFINEON TECHNOLOGIES AG
- Gerhard SCHMIDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Structure and Method for Fabricating the Same
- Publication number 20160353210
- Publication date Dec 1, 2016
- INFINEON TECHNOLOGIES AG
- Ulrich Schmid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONTROLLING THE REFLOW BEHAVIOUR OF BPSG FILMS AND DEVICES MADE THE...
- Publication number 20160218002
- Publication date Jul 28, 2016
- Infineon Technologies Austria AG
- Juergen Steinbrenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Structure and Method for Fabricating the Same
- Publication number 20160031701
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Ulrich Schmid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER
- Publication number 20150348824
- Publication date Dec 3, 2015
- INFINEON TECHNOLOGIES AG
- Matthias Kuenle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR COATING A WORKPIECE
- Publication number 20150340224
- Publication date Nov 26, 2015
- INFINEON TECHNOLOGIES AG
- Juergen Steinbrenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Layer and Method of Making a Passivation Layer
- Publication number 20150235917
- Publication date Aug 20, 2015
- INFINEON TECHNOLOGIES AG
- Kurt Matoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD, METHOD FOR PRODUCING A MOLD, AND METHOD FOR FORMING A MOLD AR...
- Publication number 20150175467
- Publication date Jun 25, 2015
- Infineon Technologies Austria AG
- Guenter Denifl
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Carbon Layers for High Temperature Processes
- Publication number 20140335700
- Publication date Nov 13, 2014
- Guenter Denifl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods of Forming Semiconductor Devices
- Publication number 20140235035
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Layer and Method of Making a Passivation Layer
- Publication number 20140117511
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Kurt Matoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Devices
- Publication number 20130280888
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS

Markus Kahn

Person

Patents Grantslast 30 patents

Semiconductor device with first and second portions that include si...

Wafer chuck and processing arrangement

Semiconductor device, microphone and methods for forming a semicond...

Semiconductor device with a portion including silicon and nitrogen...

Semiconductor device, microphone and methods for forming a semicond...

Micromechanical structure and method for manufacturing the same

Wafer chuck and processing arrangement

Semiconductor wafer and method for processing a semiconductor wafer

Micromechanical structure comprising carbon material and method for...

Micromechanical structure and method for fabricating the same

Self aligned silicon carbide contact formation using protective layer

Semiconductor wafer and method for processing a semiconductor wafer

Method for processing a semiconductor layer, method for processing...

Carbon based contact structure for silicon carbide device technical...

Methods of forming semiconductor devices

Passivation layer and method of making a passivation layer

Self aligned silicon carbide contact formation using protective layer

Processing a sacrificial material during manufacture of a microfabr...

Method for coating a workpiece

Controlling the reflow behaviour of BPSG films and devices made the...

Methods of singulating substrates to form semiconductor devices usi...

Micro mechanical structure and method for fabricating the same

Methods of forming semiconductor devices by singulating a substrate...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THEREOF

High Voltage Semiconductor Device with Step Topography Passivation...

SEMICONDUCTOR DEVICE WITH FIRST AND SECOND PORTIONS THAT INCLUDE SI...

High Voltage Semiconductor Device with Step Topography Passivation...

Semiconductor Device, Microphone and Methods for Forming a Semicond...

WAFER CHUCK AND PROCESSING ARRANGEMENT

Semiconductor Device with a Portion Including Silicon and Nitrogen...

Semiconductor Device and Manufacturing

Controlling the Reflow Behaviour of BPSG Films and Devices Made The...

SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER

SEMICONDUCTOR DEVICE, MICROPHONE AND METHODS FOR FORMING A SEMICOND...

WAFER CHUCK AND PROCESSING ARRANGEMENT

Self Aligned Silicon Carbide Contact Formation Using Protective Layer

MICROMECHANICAL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Carbon Based Contact Structure for Silicon Carbide Device Technical...

MOLD, METHOD FOR PRODUCING A MOLD, AND METHOD FOR FORMING A MOLD AR...

Methods of Forming Semiconductor Devices

Controlling the Reflow Behaviour of BPSG Films and Devices Made The...

METHOD FOR PROCESSING A SEMICONDUCTOR LAYER, METHOD FOR PROCESSING...

Micromechanical Structure and Method for Fabricating the Same

CONTROLLING THE REFLOW BEHAVIOUR OF BPSG FILMS AND DEVICES MADE THE...

Micromechanical Structure and Method for Fabricating the Same

SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER

METHOD FOR COATING A WORKPIECE

Passivation Layer and Method of Making a Passivation Layer

MOLD, METHOD FOR PRODUCING A MOLD, AND METHOD FOR FORMING A MOLD AR...

Carbon Layers for High Temperature Processes

Methods of Forming Semiconductor Devices

Passivation Layer and Method of Making a Passivation Layer

Methods of Forming Semiconductor Devices