Markus Liebhard

Person

Oakland, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Lead-frame method and assembly for interconnecting circuits within...
- Patent number 7,176,062
- Issue date Feb 13, 2007
- Amkor Technology, Inc.
- Jeffrey Alan Miks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-frame method and assembly for interconnecting circuits within...
- Patent number 6,900,527
- Issue date May 31, 2005
- Amkor Technology, Inc.
- Jeffrey Alan Miks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-frame method and circuit module assembly including edge stiffener
- Patent number 6,717,822
- Issue date Apr 6, 2004
- Amkor Technology, Inc.
- Jeffrey Alan Miks
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip size image sensor bumped package fabrication method
- Patent number 6,629,633
- Issue date Oct 7, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip size image sensor wirebond package fabrication method
- Patent number 6,620,646
- Issue date Sep 16, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-scale production of chip-scale semiconductor packages using w...
- Patent number 6,589,801
- Issue date Jul 8, 2003
- Amkor Technology, Inc.
- Ju-Hoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip size image sensor bumped package
- Patent number 6,528,857
- Issue date Mar 4, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile mounting of thick integrated circuit packages within lo...
- Patent number 6,509,637
- Issue date Jan 21, 2003
- Amkor Technology, Inc.
- Markus Karl Liebhard
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip size image sensor in wirebond package with step-up ring for el...
- Patent number 6,509,560
- Issue date Jan 21, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with warpage resistant substrate
- Patent number 6,486,537
- Issue date Nov 26, 2002
- Amkor Technology, Inc.
- Markus K. Liebhard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground ring for a metal electronic package
- Patent number 5,764,484
- Issue date Jun 9, 1998
- Olin Corporation
- Paul R. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Surface mountable antenna
- Publication number 20040222927
- Publication date Nov 11, 2004
- Paul Robert Hoffman
- H01 - BASIC ELECTRIC ELEMENTS

Markus Liebhard

Person

Patents Grantslast 30 patents

Lead-frame method and assembly for interconnecting circuits within...

Lead-frame method and assembly for interconnecting circuits within...

Lead-frame method and circuit module assembly including edge stiffener

Chip size image sensor bumped package fabrication method

Chip size image sensor wirebond package fabrication method

Wafer-scale production of chip-scale semiconductor packages using w...

Chip size image sensor bumped package

Low profile mounting of thick integrated circuit packages within lo...

Chip size image sensor in wirebond package with step-up ring for el...

Semiconductor package with warpage resistant substrate

Ground ring for a metal electronic package

Patents Applicationslast 30 patents

Surface mountable antenna