Markus M. Kirchhoff

Person

Ottendorf-Obrilla, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Photolithographic patterning process using a carbon hard mask layer...
- Patent number 7,368,390
- Issue date May 6, 2008
- Infineon Technologies AG
- Guenther Czech
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for production of a semiconductor structure
- Patent number 7,141,507
- Issue date Nov 28, 2006
- Infineon Technologies AG
- Oliver Genz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an integrated semiconductor circuit to preve...
- Patent number 7,078,313
- Issue date Jul 18, 2006
- Infineon Technologies AG
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling depressions in a surface of a semiconductor stru...
- Patent number 6,759,323
- Issue date Jul 6, 2004
- Infineon Technologies AG
- Markus Kirchhoff
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming an insulator having a low dielectric constant on...
- Patent number 6,713,364
- Issue date Mar 30, 2004
- Infineon Technologies AG
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling trenches in integrated semiconductor circuits
- Patent number 6,677,218
- Issue date Jan 13, 2004
- Infineon Technologies AG
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a trench in a semiconductor substrate
- Patent number 6,673,693
- Issue date Jan 6, 2004
- Infineon Technologies AG
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of filling gaps on a semiconductor wafer
- Patent number 6,562,734
- Issue date May 13, 2003
- Semiconductor 300 GmbH & Co. KG
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with hydrogen-rich layer for facilit...
- Patent number 6,483,172
- Issue date Nov 19, 2002
- Siemens Aktiengesellschaft
- Donna Rizzone Cote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of various base layers for selective layer growth in sem...
- Patent number 6,380,074
- Issue date Apr 30, 2002
- Infineon Technologies AG
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric filling of electrical wiring planes
- Patent number 6,380,076
- Issue date Apr 30, 2002
- Infineon Technologies AG
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gapfill of semiconductor structure using doped silicate glasses
- Patent number 6,096,654
- Issue date Aug 1, 2000
- Siemens Aktiengesellschaft
- Markus M. Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature reflow dielectric-fluorinated BPSG
- Patent number 6,057,250
- Issue date May 2, 2000
- International Business Machines Corporation
- Markus Kirchhoff
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gapfill of semiconductor structure using doped silicate glasses
- Patent number 6,048,475
- Issue date Apr 11, 2000
- Siemens Aktiengesellschaft
- Markus M. Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for etching a silicon dioxide-containing layer
- Patent number 5,866,485
- Issue date Feb 2, 1999
- Siemens Aktiengesellschaft
- Markus M. Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for production of a semiconductor structure
- Publication number 20050196952
- Publication date Sep 8, 2005
- Infineon Technologies AG
- Oliver Genz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photolithographic method for forming a structure in a semiconductor...
- Publication number 20050148193
- Publication date Jul 7, 2005
- Infineon Technologies AG
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of filling substrate depressions with silicon oxide by high-...
- Publication number 20030087506
- Publication date May 8, 2003
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating an integrated semiconductor circuit
- Publication number 20030054630
- Publication date Mar 20, 2003
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for filling trenches in integrated semiconductor circuits
- Publication number 20030032259
- Publication date Feb 13, 2003
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating an integrated circuit with a dynamic memory...
- Publication number 20020137333
- Publication date Sep 26, 2002
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of filling gaps on a semiconductor wafer
- Publication number 20020042186
- Publication date Apr 11, 2002
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a trench in a semiconductor substrate
- Publication number 20020022338
- Publication date Feb 21, 2002
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming an insulator having a low dielectric constant on...
- Publication number 20020022339
- Publication date Feb 21, 2002
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for filling depressions in a surface of a semiconductor stru...
- Publication number 20010054749
- Publication date Dec 27, 2001
- Markus Kirchhoff
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Dielectric filling of electrical wiring planes
- Publication number 20010004539
- Publication date Jun 21, 2001
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS

Markus M. Kirchhoff

Person

Patents Grantslast 30 patents

Photolithographic patterning process using a carbon hard mask layer...

Method for production of a semiconductor structure

Method for fabricating an integrated semiconductor circuit to preve...

Method for filling depressions in a surface of a semiconductor stru...

Method for forming an insulator having a low dielectric constant on...

Method for filling trenches in integrated semiconductor circuits

Method for forming a trench in a semiconductor substrate

Method of filling gaps on a semiconductor wafer

Semiconductor device structure with hydrogen-rich layer for facilit...

Deposition of various base layers for selective layer growth in sem...

Dielectric filling of electrical wiring planes

Gapfill of semiconductor structure using doped silicate glasses

Low temperature reflow dielectric-fluorinated BPSG

Gapfill of semiconductor structure using doped silicate glasses

Techniques for etching a silicon dioxide-containing layer

Patents Applicationslast 30 patents

Method for production of a semiconductor structure

Photolithographic method for forming a structure in a semiconductor...

Method of filling substrate depressions with silicon oxide by high-...

Method for fabricating an integrated semiconductor circuit

Method for filling trenches in integrated semiconductor circuits

Method for fabricating an integrated circuit with a dynamic memory...

Method of filling gaps on a semiconductor wafer

Method for forming a trench in a semiconductor substrate

Method for forming an insulator having a low dielectric constant on...

Method for filling depressions in a surface of a semiconductor stru...

Dielectric filling of electrical wiring planes