Markus Menath

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon carbide devices and methods for manufacturing the same
- Patent number 11,282,805
- Issue date Mar 22, 2022
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a silicon carbide containing crystalline subst...
- Patent number 11,077,525
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Michael Roesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for use in manufacturing a semiconductor device die
- Patent number 10,510,626
- Issue date Dec 17, 2019
- Infineon Technologies AG
- Michaela Braun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a conductor line
- Patent number 10,090,192
- Issue date Oct 2, 2018
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method of producing the same
- Patent number 9,981,843
- Issue date May 29, 2018
- Infineon Technologies AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Transformer comprising a rounded coil
- Patent number 9,780,161
- Issue date Oct 3, 2017
- Infineon Technologies AG
- Markus Menath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a chip arrangement, methods for manufactu...
- Patent number 9,576,875
- Issue date Feb 21, 2017
- Infineon Technologies AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for use in manufacturing a semiconductor device die
- Patent number 9,553,022
- Issue date Jan 24, 2017
- Infineon Technologies AG
- Michaela Braun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a wafer and method for dicing a wafer
- Patent number 9,553,021
- Issue date Jan 24, 2017
- Infineon Technologies AG
- Markus Menath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a conductor line
- Patent number 9,214,424
- Issue date Dec 15, 2015
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a coil by way of a rounded trench
- Patent number 9,183,977
- Issue date Nov 10, 2015
- Infineon Technologies AG
- Markus Menath
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods for manufacturing a chip arrangement, methods for manufactu...
- Patent number 8,951,915
- Issue date Feb 10, 2015
- Infineon Technologies AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with coreless transformer
- Patent number 8,665,054
- Issue date Mar 4, 2014
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor chip and semiconductor chip
- Patent number 8,637,967
- Issue date Jan 28, 2014
- Infineon Technologies AG
- Markus Menath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for determining physical properties of a mask...
- Patent number 7,289,231
- Issue date Oct 30, 2007
- Infineon Technologies AG
- Tarek Lutz
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Method of Processing a Silicon Carbide Containing Crystalline Subst...
- Publication number 20190308274
- Publication date Oct 10, 2019
- Michael Roesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon Carbide Devices and Methods for Manufacturing the Same
- Publication number 20190295981
- Publication date Sep 26, 2019
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USE IN MANUFACTURING A SEMICONDUCTOR DEVICE DIE
- Publication number 20170092552
- Publication date Mar 30, 2017
- INFINEON TECHNOLOGIES AG
- Michaela Braun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A WAFER AND METHOD FOR DICING A WAFER
- Publication number 20170084468
- Publication date Mar 23, 2017
- INFINEON TECHNOLOGIES AG
- Markus Menath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USE IN MANUFACTURING A SEMICONDUCTOR DEVICE DIE
- Publication number 20170011963
- Publication date Jan 12, 2017
- INFINEON TECHNOLOGIES AG
- Michaela Braun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package and a Method of Producing the Same
- Publication number 20160311679
- Publication date Oct 27, 2016
- INFINEON TECHNOLOGIES AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Producing a Conductor Line
- Publication number 20160064273
- Publication date Mar 3, 2016
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Vertical Electrical Conductive Connection
- Publication number 20150380306
- Publication date Dec 31, 2015
- INFINEON TECHNOLOGIES AG
- Markus Menath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coil and Method of Manufacturing a Coil
- Publication number 20150372073
- Publication date Dec 24, 2015
- INFINEON TECHNOLOGIES AG
- Markus Menath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING A CHIP ARRANGEMENT, METHODS FOR MANUFACTU...
- Publication number 20150115417
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for manufacturing a chip arrangement, methods for manufactu...
- Publication number 20140070376
- Publication date Mar 13, 2014
- INFINEON TECHNOLOGIES AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A WAFER AND METHOD FOR DICING A WAFER
- Publication number 20140065768
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Markus Menath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component with Coreless Transformer
- Publication number 20130278372
- Publication date Oct 24, 2013
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coil and Method of Manufacturing a Coil
- Publication number 20130277797
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Markus Menath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Conductor Line
- Publication number 20130280879
- Publication date Oct 24, 2013
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Chip and Semiconductor Chip
- Publication number 20120119389
- Publication date May 17, 2012
- Markus Menath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for determining physical properties of a mask...
- Publication number 20040194039
- Publication date Sep 30, 2004
- Infineon Technologies AG
- Tarek Lutz
- G01 - MEASURING TESTING

Markus Menath

Person

Patents Grantslast 30 patents

Silicon carbide devices and methods for manufacturing the same

Method of processing a silicon carbide containing crystalline subst...

Method for use in manufacturing a semiconductor device die

Method for producing a conductor line

Chip package and a method of producing the same

Transformer comprising a rounded coil

Methods for manufacturing a chip arrangement, methods for manufactu...

Method for use in manufacturing a semiconductor device die

Method for processing a wafer and method for dicing a wafer

Method for producing a conductor line

Method for fabricating a coil by way of a rounded trench

Methods for manufacturing a chip arrangement, methods for manufactu...

Semiconductor component with coreless transformer

Method for fabricating a semiconductor chip and semiconductor chip

Apparatus and method for determining physical properties of a mask...

Patents Applicationslast 30 patents

Method of Processing a Silicon Carbide Containing Crystalline Subst...

Silicon Carbide Devices and Methods for Manufacturing the Same

METHOD FOR USE IN MANUFACTURING A SEMICONDUCTOR DEVICE DIE

METHOD FOR PROCESSING A WAFER AND METHOD FOR DICING A WAFER

METHOD FOR USE IN MANUFACTURING A SEMICONDUCTOR DEVICE DIE

Chip Package and a Method of Producing the Same

Method for Producing a Conductor Line

Method for Forming a Vertical Electrical Conductive Connection

Coil and Method of Manufacturing a Coil

METHODS FOR MANUFACTURING A CHIP ARRANGEMENT, METHODS FOR MANUFACTU...

Methods for manufacturing a chip arrangement, methods for manufactu...

METHOD FOR PROCESSING A WAFER AND METHOD FOR DICING A WAFER

Semiconductor Component with Coreless Transformer

Coil and Method of Manufacturing a Coil

Method for Producing a Conductor Line

Method for Fabricating a Semiconductor Chip and Semiconductor Chip

Apparatus and method for determining physical properties of a mask...