Markus Naujok

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Hsin- Chu City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Passivated copper chip pads
- Patent number 9,373,596
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene structure and method
- Patent number 7,091,612
- Issue date Aug 15, 2006
- Infineon Technologies AG
- Kaushik Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite intermetal dielectric structure including low-k dielectri...
- Patent number 7,041,574
- Issue date May 9, 2006
- Infineon Technologies AG
- Sun-Oo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Passivated Copper Chip Pads
- Publication number 20140295661
- Publication date Oct 2, 2014
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual damascene structure and method
- Publication number 20050077628
- Publication date Apr 14, 2005
- Kaushik Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite intermetal dielectric structure including low-k dielectri...
- Publication number 20040259273
- Publication date Dec 23, 2004
- Sun-Oo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite low-k dielectric structure
- Publication number 20040248400
- Publication date Dec 9, 2004
- Sun-Oo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer polishing with counteraction of centrifugal forces on polishi...
- Publication number 20040152402
- Publication date Aug 5, 2004
- Markus Naujok
- B24 - GRINDING POLISHING