Markus Schieber

Person

Munchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level package and method of manufacture
- Patent number 11,929,729
- Issue date Mar 12, 2024
- RF360 Singapore Pte. Ltd.
- Markus Schieber
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for producing a plurality of measurement regions on a chip,...
- Patent number 10,381,277
- Issue date Aug 13, 2019
- Boehringer Ingelheim Vetmedica GmbH
- Markus Schieber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier having a conducting path and an electric shield
- Patent number 9,999,120
- Issue date Jun 12, 2018
- Siemens Aktiengesellschaft
- Florian Poprawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared sensor, thermal imaging camera and method for producing a...
- Patent number 9,887,339
- Issue date Feb 6, 2018
- Siemens Aktiengesellschaft
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a plurality of measurement regions on a chip,...
- Patent number 9,735,072
- Issue date Aug 15, 2017
- Boehringer Ingelheim Vetmedica GmbH
- Markus Schieber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a microscreen
- Patent number 9,442,379
- Issue date Sep 13, 2016
- Siemens Aktiengesellschaft
- Susanne Kornely
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Method for producing a microscreen
- Patent number 9,421,500
- Issue date Aug 23, 2016
- Siemens Aktiengesellschaft
- Susanne Kornely
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Micromechanical substrate for a diaphragm with a diffusion barrier...
- Patent number 9,170,226
- Issue date Oct 27, 2015
- Siemens Aktiengesellschaft
- Maximilian Fleischer
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20240186980
- Publication date Jun 6, 2024
- RF360 Singapore Pte. Ltd.
- Markus SCHIEBER
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20210226605
- Publication date Jul 22, 2021
- RF360 Europe GmbH
- Markus SCHIEBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A PLURALITY OF MEASUREMENT REGIONS ON A CHIP,...
- Publication number 20170301593
- Publication date Oct 19, 2017
- Boehringer Ingelheim Vetmedica GmbH
- Markus Schieber
- G01 - MEASURING TESTING
Information Patent Application
PRECONCENTRATOR FOR ABSORBING/DESORBING AT LEAST ONE COMPONENT OF GAS
- Publication number 20170189882
- Publication date Jul 6, 2017
- Ignaz EISELE
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD FOR PRODUCING A PLURALITY OF MEASUREMENT REGIONS ON A CHIP,...
- Publication number 20160126151
- Publication date May 5, 2016
- Boehringer Ingelheim Vetmedica GmbH
- Markus SCHIEBER
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PRODUCING A MICROSCREEN
- Publication number 20160001231
- Publication date Jan 7, 2016
- Siemens Aktiengesellschaft
- Susanne KORNELY
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD FOR PRODUCING A MICROSCREEN
- Publication number 20160004162
- Publication date Jan 7, 2016
- Siemens Aktiengesellschaft
- Susanne KORNELY
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INFRARED SENSOR, THERMAL IMAGING CAMERA AND METHOD FOR PRODUCING A...
- Publication number 20150048249
- Publication date Feb 19, 2015
- Siemens Aktiengesellschaft
- Harry Hedler
- G01 - MEASURING TESTING
Information Patent Application
Circuit Carrier Having a Conducting Path and an Electric Shield, an...
- Publication number 20150016073
- Publication date Jan 15, 2015
- Florian Poprawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT WITH ELECTRICAL THROUGH-CONTACT AND METHOD FOR P...
- Publication number 20140084428
- Publication date Mar 27, 2014
- SIEMENS AKTIENGESELLSCHAFT
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROMECHANICAL SUBSTRATE FOR A DIAPHRAGM WITH A DIFFUSION BARRIER...
- Publication number 20130264660
- Publication date Oct 10, 2013
- Siemens Aktiengesellschaft
- Maximilian Fleischer
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Markus Schieber

Person

Patents Grantslast 30 patents

Wafer level package and method of manufacture

Method for producing a plurality of measurement regions on a chip,...

Circuit carrier having a conducting path and an electric shield

Infrared sensor, thermal imaging camera and method for producing a...

Method for producing a plurality of measurement regions on a chip,...

Method for producing a microscreen

Method for producing a microscreen

Micromechanical substrate for a diaphragm with a diffusion barrier...

Patents Applicationslast 30 patents

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE

METHOD FOR PRODUCING A PLURALITY OF MEASUREMENT REGIONS ON A CHIP,...

PRECONCENTRATOR FOR ABSORBING/DESORBING AT LEAST ONE COMPONENT OF GAS

METHOD FOR PRODUCING A PLURALITY OF MEASUREMENT REGIONS ON A CHIP,...

METHOD FOR PRODUCING A MICROSCREEN

METHOD FOR PRODUCING A MICROSCREEN

INFRARED SENSOR, THERMAL IMAGING CAMERA AND METHOD FOR PRODUCING A...

Circuit Carrier Having a Conducting Path and an Electric Shield, an...

INTEGRATED CIRCUIT WITH ELECTRICAL THROUGH-CONTACT AND METHOD FOR P...

MICROMECHANICAL SUBSTRATE FOR A DIAPHRAGM WITH A DIFFUSION BARRIER...