Markus Wimplinger

Person

Ried am Innkreis, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for bonding chips
- Patent number 11,990,463
- Issue date May 21, 2024
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of two substrates
- Patent number 11,862,487
- Issue date Jan 2, 2024
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for surface treatment of substrates
- Patent number 11,776,842
- Issue date Oct 3, 2023
- EV Group E. Thallner GmbH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and device for bonding of chips
- Patent number 11,764,198
- Issue date Sep 19, 2023
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Accommodating device for retaining wafers
- Patent number 11,756,818
- Issue date Sep 12, 2023
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,697,281
- Issue date Jul 11, 2023
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method for bonding of two substrates
- Patent number 11,562,912
- Issue date Jan 24, 2023
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Accommodating device for retaining wafers
- Patent number 11,355,374
- Issue date Jun 7, 2022
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for surface treatment of substrates
- Patent number 11,348,825
- Issue date May 31, 2022
- EV Group E. Thallner GmbH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 11,282,801
- Issue date Mar 22, 2022
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of two substrates
- Patent number 11,276,589
- Issue date Mar 15, 2022
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for bonding substrates
- Patent number 11,139,170
- Issue date Oct 5, 2021
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,059,280
- Issue date Jul 13, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,950
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,953
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,952
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,951
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of two substrates
- Patent number 10,964,562
- Issue date Mar 30, 2021
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Accomodating device for retaining wafers
- Patent number 10,886,156
- Issue date Jan 5, 2021
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers
- Patent number 10,825,793
- Issue date Nov 3, 2020
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for surface treatment of substrates
- Patent number 10,796,944
- Issue date Oct 6, 2020
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for surface treatment of substrates
- Patent number 10,490,439
- Issue date Nov 26, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for bonding substrates
- Patent number 10,438,798
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Accommodating device for retaining wafers
- Patent number 10,325,798
- Issue date Jun 18, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a microlens
- Patent number 10,279,551
- Issue date May 7, 2019
- EV Group GmbH
- Erich Thallner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Device and method for bonding substrates
- Patent number 10,279,575
- Issue date May 7, 2019
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for embossing of substrates
- Patent number 10,239,253
- Issue date Mar 26, 2019
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for permanently bonding wafers by a connecting layer by mean...
- Patent number 10,163,681
- Issue date Dec 25, 2018
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND DEVICE FOR BONDING OF CHIPS
- Publication number 20240170474
- Publication date May 23, 2024
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20230294390
- Publication date Sep 21, 2023
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR INJECTION MOLDING
- Publication number 20230150180
- Publication date May 18, 2023
- EV GROUP E. THALLNER GMBH
- Gerald MITTENDORFER
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES
- Publication number 20230117625
- Publication date Apr 20, 2023
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR MEASURING A SUBSTRATE
- Publication number 20220390356
- Publication date Dec 8, 2022
- EV GROUP E. THALLNER GMBH
- Jacek GASIOROWSKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ACCOMMODATING DEVICE FOR RETAINING WAFERS
- Publication number 20220262663
- Publication date Aug 18, 2022
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR SURFACE TREATMENT OF SUBSTRATES
- Publication number 20220216098
- Publication date Jul 7, 2022
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20220165690
- Publication date May 26, 2022
- EV GROUP E. THALLNER GMBH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES
- Publication number 20220139735
- Publication date May 5, 2022
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20210291504
- Publication date Sep 23, 2021
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STAMP AND METHOD FOR EMBOSSING
- Publication number 20210240075
- Publication date Aug 5, 2021
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES
- Publication number 20210183665
- Publication date Jun 17, 2021
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR BONDING OF CHIPS
- Publication number 20210134782
- Publication date May 6, 2021
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCOMMODATING DEVICE FOR RETAINING WAFERS
- Publication number 20210104425
- Publication date Apr 8, 2021
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR SURFACE TREATMENT OF SUBSTRATES
- Publication number 20200402840
- Publication date Dec 24, 2020
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND DEVICE FOR BONDING OF CHIPS
- Publication number 20200176437
- Publication date Jun 4, 2020
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR SURFACE TREATMENT OF SUBSTRATES
- Publication number 20200020572
- Publication date Jan 16, 2020
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190371607
- Publication date Dec 5, 2019
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES
- Publication number 20190228995
- Publication date Jul 25, 2019
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190217594
- Publication date Jul 18, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190217595
- Publication date Jul 18, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190210348
- Publication date Jul 11, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190210349
- Publication date Jul 11, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190210350
- Publication date Jul 11, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCOMODATING DEVICE FOR RETAINING WAFERS
- Publication number 20190206711
- Publication date Jul 4, 2019
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20190006313
- Publication date Jan 3, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR SURFACE TREATMENT OF SUBSTRATES
- Publication number 20180366366
- Publication date Dec 20, 2018
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING A MICROLENS
- Publication number 20180229458
- Publication date Aug 16, 2018
- EV Group GmbH
- Erich Thallner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20180145048
- Publication date May 24, 2018
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20180130658
- Publication date May 10, 2018
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- H01 - BASIC ELECTRIC ELEMENTS

Markus Wimplinger

Person

Patents Grantslast 30 patents

Method for permanent connection of two metal surfaces

Device for bonding chips

Device and method for bonding of two substrates

Method and device for surface treatment of substrates

Method and device for bonding of chips

Accommodating device for retaining wafers

Device and method for bonding substrates

Device and method for bonding of two substrates

Accommodating device for retaining wafers

Method and device for surface treatment of substrates

Method for permanent connection of two metal surfaces

Device and method for bonding of two substrates

Apparatus and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding of two substrates

Accomodating device for retaining wafers

Method for permanently bonding wafers

Method and device for surface treatment of substrates

Method and device for surface treatment of substrates

Apparatus and method for bonding substrates

Method for applying a bonding layer

Accommodating device for retaining wafers

Method for producing a microlens

Device and method for bonding substrates

Method for embossing of substrates

Method for permanently bonding wafers by a connecting layer by mean...

Patents Applicationslast 30 patents

METHOD AND DEVICE FOR BONDING OF CHIPS

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR INJECTION MOLDING

DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES

DEVICE AND METHOD FOR MEASURING A SUBSTRATE

ACCOMMODATING DEVICE FOR RETAINING WAFERS

METHOD AND DEVICE FOR SURFACE TREATMENT OF SUBSTRATES

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

STAMP AND METHOD FOR EMBOSSING

DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES

METHOD AND DEVICE FOR BONDING OF CHIPS

ACCOMMODATING DEVICE FOR RETAINING WAFERS

METHOD AND DEVICE FOR SURFACE TREATMENT OF SUBSTRATES

METHOD AND DEVICE FOR BONDING OF CHIPS

METHOD AND DEVICE FOR SURFACE TREATMENT OF SUBSTRATES

APPARATUS AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

ACCOMODATING DEVICE FOR RETAINING WAFERS

METHOD FOR PERMANENT BONDING OF WAFERS

METHOD AND DEVICE FOR SURFACE TREATMENT OF SUBSTRATES

METHOD FOR PRODUCING A MICROLENS

METHOD FOR APPLYING A BONDING LAYER

APPARATUS AND METHOD FOR BONDING SUBSTRATES