Marlies Kleinfeld

Person

Wuppertal, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Tin-silver solder bumping in electronics manufacture
- Patent number 7,713,859
- Issue date May 11, 2010
- Enthone Inc.
- Thomas B. Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the non-galvanic tin plating of copper or copper alloys
- Patent number 6,821,323
- Issue date Nov 23, 2004
- Enthone Inc.
- Jane Bell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Slightly water-soluble metal salts, a process for the preparation t...
- Patent number 5,981,793
- Issue date Nov 9, 1999
- Blasberg Oberflachentechnik GmbH
- Eberhard Knaak
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
WATER SOLUBLE AND AIR STABLE PHOSPHAADAMANTANES AS STABILIZERS FOR...
- Publication number 20190085461
- Publication date Mar 21, 2019
- MacDermid Enthone Inc.
- Stefan Schafer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR ELECTROCHEMICAL DEPOSITION OF A METAL
- Publication number 20140158545
- Publication date Jun 12, 2014
- Enthone Inc.
- Stefan Schäfer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Preserving Solderability and Inhibiting Whisker Growth in Tin Surfa...
- Publication number 20080261071
- Publication date Oct 23, 2008
- Chen Xu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE
- Publication number 20070037377
- Publication date Feb 15, 2007
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR ELECTRODEPOSITION OF BRONZES
- Publication number 20060260948
- Publication date Nov 23, 2006
- Enthone Inc.
- Katrin Zschintzsch
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for bronze galvanic coating
- Publication number 20060137991
- Publication date Jun 29, 2006
- Enthone Inc.
- Katrin Zschintzsch
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for the electrolytic deposition of metals
- Publication number 20060049058
- Publication date Mar 9, 2006
- Enthone Inc.
- Christel van Wijngaarden
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for electrodeposition of bronzes
- Publication number 20050263403
- Publication date Dec 1, 2005
- Enthone Inc.
- Katrin Zschintzsch
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Preserving solderability and inhibiting whisker growth in tin surfa...
- Publication number 20050249969
- Publication date Nov 10, 2005
- Enthone Inc.
- Chen Xu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Non-reactive coatings for inertization
- Publication number 20050034996
- Publication date Feb 17, 2005
- Helmut Horsthemke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Marlies Kleinfeld

Person

Patents Grantslast 30 patents

Tin-silver solder bumping in electronics manufacture

Process for the non-galvanic tin plating of copper or copper alloys

Slightly water-soluble metal salts, a process for the preparation t...

Patents Applicationslast 30 patents

WATER SOLUBLE AND AIR STABLE PHOSPHAADAMANTANES AS STABILIZERS FOR...

APPARATUS FOR ELECTROCHEMICAL DEPOSITION OF A METAL

Preserving Solderability and Inhibiting Whisker Growth in Tin Surfa...

TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE

METHOD FOR ELECTRODEPOSITION OF BRONZES

Method for bronze galvanic coating

Method for the electrolytic deposition of metals

Method for electrodeposition of bronzes

Preserving solderability and inhibiting whisker growth in tin surfa...

Non-reactive coatings for inertization