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Marni Nabors
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Portland, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Device layer interconnects
Patent number
11,881,452
Issue date
Jan 23, 2024
Intel Corporation
Mark Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Standard cell architecture with power tracks completely inside a cell
Patent number
11,682,664
Issue date
Jun 20, 2023
Intel Corporation
Srinivasa Chaitanya Gadigatla
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Device layer interconnects
Patent number
11,410,928
Issue date
Aug 9, 2022
Intel Corporation
Mark Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Deep trench via for three-dimensional integrated circuit
Patent number
11,373,999
Issue date
Jun 28, 2022
Intel Corporation
Yih Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power shared cell architecture
Patent number
11,068,640
Issue date
Jul 20, 2021
Intel Corporation
Ranjith Kumar
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
STACKED SOURCE OR DRAIN CONTACT FLYOVER
Publication number
20240113177
Publication date
Apr 4, 2024
Intel Corporation
Sukru Yemenicioglu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GATE CUT, WITH ASYMMETRICAL CHANNEL TO GATE CUT SPACING
Publication number
20240113107
Publication date
Apr 4, 2024
Intel Corporation
Sukru Yemenicioglu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE LAYER INTERCONNECTS
Publication number
20240096791
Publication date
Mar 21, 2024
Intel Corporation
Mark Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING CONDUCTIVE STRUCTURES IN FIN I...
Publication number
20230317731
Publication date
Oct 5, 2023
Intel Corporation
Leonard P. GULER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE GATE TIE-DOWN
Publication number
20230317787
Publication date
Oct 5, 2023
Intel Corporation
Leonard P. GULER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECTILINEAR SEAMS BETWEEN ADJACENT FIELDS OF A DIE FOR IMPROVED LAY...
Publication number
20230207491
Publication date
Jun 29, 2023
Intel Corporation
Kimberly Pierce
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY
Publication number
20230197779
Publication date
Jun 22, 2023
Intel Corporation
Marni NABORS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE LAYER INTERCONNECTS
Publication number
20220319978
Publication date
Oct 6, 2022
Intel Corporation
Mark Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEEP TRENCH VIA FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT
Publication number
20220285342
Publication date
Sep 8, 2022
Intel Corporation
Yih WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH FRONT SIDE SIGNAL LINES AND BACKS...
Publication number
20220262791
Publication date
Aug 18, 2022
Intel Corporation
Quan SHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SHARED CELL ARCHITECTURE
Publication number
20200279069
Publication date
Sep 3, 2020
Intel Corporation
Ranjith KUMAR
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
STANDARD CELL ARCHITECTURE WITH POWER TRACKS COMPLETELY INSIDE A CELL
Publication number
20200251464
Publication date
Aug 6, 2020
Intel Corporation
Srinivasa Chaitanya GADIGATLA
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
DEEP TRENCH VIA FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT
Publication number
20190378836
Publication date
Dec 12, 2019
Intel Corporation
Yih WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE LAYER INTERCONNECTS
Publication number
20190378790
Publication date
Dec 12, 2019
Intel Corporation
Mark Bohr
H01 - BASIC ELECTRIC ELEMENTS