Marshall Maple

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit package with internal and external shielding
- Patent number 10,141,268
- Issue date Nov 27, 2018
- Avago Technologies International Sales Pte. Limited
- Domingo Figueredo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via structures for thermal dissipation
- Patent number 9,997,428
- Issue date Jun 12, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Marshall Maple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid power amplifier having electrical and thermal conduction path
- Patent number 9,553,549
- Issue date Jan 24, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Young Kwon
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Hybrid power amplifier comprising heterojunction bipolar transistor...
- Patent number 9,306,514
- Issue date Apr 5, 2016
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Young Kwon
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor structure comprising moisture barrier and conductive...
- Patent number 8,536,707
- Issue date Sep 17, 2013
- Avago Technologies General IP (Singapore) Pte. Ltd.
- James Wholey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT PACKAGE WITH INTERNAL AND EXTERNAL SHIELDING
- Publication number 20170127581
- Publication date May 4, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Domingo Figueredo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA STRUCTURES FOR THERMAL DISSIPATION
- Publication number 20170018501
- Publication date Jan 19, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Marshall Maple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURES FOR THERMAL DISSIPATION
- Publication number 20170018478
- Publication date Jan 19, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Marshall Maple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID POWER AMPLIFIER HAVING ELECTRICAL AND THERMAL CONDUCTION PATH
- Publication number 20150349723
- Publication date Dec 3, 2015
- Avago Technologies General IP (Singapore) PTE. LTD.
- Young Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID POWER AMPLIFIER COMPRISING HETEROJUNCTION BIPOLAR TRANSISTOR...
- Publication number 20150349731
- Publication date Dec 3, 2015
- Avago Technologies General IP (Singapore) PTE. LTD.
- Young Kwon
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR STRUCTURE COMPRISING MOISTURE BARRIER AND CONDUCTIVE...
- Publication number 20130134560
- Publication date May 30, 2013
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- James Wholey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Increased interconnect density electronic package and method of fab...
- Publication number 20070257375
- Publication date Nov 8, 2007
- James P. Roland
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Marshall Maple

Person

Patents Grantslast 30 patents

Circuit package with internal and external shielding

Via structures for thermal dissipation

Hybrid power amplifier having electrical and thermal conduction path

Hybrid power amplifier comprising heterojunction bipolar transistor...

Semiconductor structure comprising moisture barrier and conductive...

Patents Applicationslast 30 patents

CIRCUIT PACKAGE WITH INTERNAL AND EXTERNAL SHIELDING

VIA STRUCTURES FOR THERMAL DISSIPATION

VIA STRUCTURES FOR THERMAL DISSIPATION

HYBRID POWER AMPLIFIER HAVING ELECTRICAL AND THERMAL CONDUCTION PATH

HYBRID POWER AMPLIFIER COMPRISING HETEROJUNCTION BIPOLAR TRANSISTOR...

SEMICONDUCTOR STRUCTURE COMPRISING MOISTURE BARRIER AND CONDUCTIVE...

Increased interconnect density electronic package and method of fab...