Martha Dudek

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid low metal loading flux
- Patent number 9,950,393
- Issue date Apr 24, 2018
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux materials for heated solder placement and associated technique...
- Patent number 9,283,641
- Issue date Mar 15, 2016
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-solder techniques and configurations for integrated circuit p...
- Patent number 9,257,405
- Issue date Feb 9, 2016
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Functional material systems and processes for package-level interco...
- Patent number 9,024,453
- Issue date May 5, 2015
- Intel Corporation
- Rajen S. Sidhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid solder and filled paste in microelectronic packaging
- Patent number 8,920,934
- Issue date Dec 30, 2014
- Intel Corporation
- Hongjin Jiang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multi-solder techniques and configurations for integrated circuit p...
- Patent number 8,809,181
- Issue date Aug 19, 2014
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Oxidation resistant Pb-free solder alloys
- Patent number 8,530,058
- Issue date Sep 10, 2013
- Arizona Board of Regents, for and on behalf of Arizona State University
- Nikhilesh Chawla
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20180236609
- Publication date Aug 23, 2018
- Intel Corporation
- Rajen S. SIDHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-SOLDER TECHNIQUES AND CONFIGURATIONS FOR INTEGRATED CIRCUIT P...
- Publication number 20140319682
- Publication date Oct 30, 2014
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING
- Publication number 20140291843
- Publication date Oct 2, 2014
- Hongjin Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL MATERIAL SYSTEMS AND PROCESSES FOR PACKAGE-LEVEL INTERCO...
- Publication number 20140225265
- Publication date Aug 14, 2014
- Rajen S. Sidhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE MATERIAL TECHNOLOGY FOR ELIMINATION OF HIGH WARPAGE SU...
- Publication number 20140175160
- Publication date Jun 26, 2014
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-SOLDER TECHNIQUES AND CONFIGURATIONS FOR INTEGRATED CIRCUIT P...
- Publication number 20140124925
- Publication date May 8, 2014
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX MATERIALS FOR HEATED SOLDER PLACEMENT AND ASSOCIATED TECHNIQUE...
- Publication number 20140084461
- Publication date Mar 27, 2014
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20130341379
- Publication date Dec 26, 2013
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Martha Dudek

Person

Patents Grantslast 30 patents

Hybrid low metal loading flux

Flux materials for heated solder placement and associated technique...

Multi-solder techniques and configurations for integrated circuit p...

Functional material systems and processes for package-level interco...

Hybrid solder and filled paste in microelectronic packaging

Multi-solder techniques and configurations for integrated circuit p...

Oxidation resistant Pb-free solder alloys

Patents Applicationslast 30 patents

HYBRID LOW METAL LOADING FLUX

MULTI-SOLDER TECHNIQUES AND CONFIGURATIONS FOR INTEGRATED CIRCUIT P...

HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING

FUNCTIONAL MATERIAL SYSTEMS AND PROCESSES FOR PACKAGE-LEVEL INTERCO...

SOLDER PASTE MATERIAL TECHNOLOGY FOR ELIMINATION OF HIGH WARPAGE SU...

MULTI-SOLDER TECHNIQUES AND CONFIGURATIONS FOR INTEGRATED CIRCUIT P...

FLUX MATERIALS FOR HEATED SOLDER PLACEMENT AND ASSOCIATED TECHNIQUE...

HYBRID LOW METAL LOADING FLUX