Martial Letourneau

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Granby, CA

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Patents Grantslast 30 patents

Information Patent Grant
Assembly of opto-electronic module with improved heat sink
- Patent number 6,822,875
- Issue date Nov 23, 2004
- International Business Machines Corporation
- Benson Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment systems for subassemblies of overmolded optoelectronic mo...
- Patent number 6,547,452
- Issue date Apr 15, 2003
- International Business Machines Corporation
- Benson Chan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Assembly of opto-electronic module with improved heat sink
- Patent number 6,508,595
- Issue date Jan 21, 2003
- International Business Machines Corporation
- Benson Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer molding method for forming integrated circuit package
- Patent number 6,309,575
- Issue date Oct 30, 2001
- International Business Machines Corporation
- Lynda Boutin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip package
- Patent number 5,939,778
- Issue date Aug 17, 1999
- International Business Machines Corporation
- Lynda Boutin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Assembly of opto-electronic module with improved heat sink
- Publication number 20030059176
- Publication date Mar 27, 2003
- International Business Machines Corporation
- Benson Chan
- G02 - OPTICS