Martin Beaumier

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Quebec, CA

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Patents Grantslast 30 patents

Information Patent Grant
Laminate peripheral clamping to control microelectronic module BSM...
- Patent number 9,219,051
- Issue date Dec 22, 2015
- GLOBALFOUNDRIES Inc.
- Stephanie Allard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grounded lid for micro-electronic assemblies
- Patent number 9,042,120
- Issue date May 26, 2015
- International Business Machines Corporation
- Martin Beaumier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 8,906,809
- Issue date Dec 9, 2014
- International Business Machines Corporation
- Martin M. Beaumier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 8,900,927
- Issue date Dec 2, 2014
- International Business Machines Corporation
- Martin M. Beaumier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounded lid for micro-electronic assemblies
- Patent number 8,614,900
- Issue date Dec 24, 2013
- International Business Machines Corporation
- Martin Beaumier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lid edge capping load
- Patent number 7,733,655
- Issue date Jun 8, 2010
- International Business Machines Corporation
- Martin Beaumier
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAMINATE PERIPHERAL CLAMPING TO CONTROL MICROELECTRONIC MODULE BSM...
- Publication number 20140359996
- Publication date Dec 11, 2014
- Stephanie Allard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDED LID FOR MICRO-ELECTRONIC ASSEMBLIES
- Publication number 20140016283
- Publication date Jan 16, 2014
- International Business Machines Corporation
- Martin Beaumier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20120241944
- Publication date Sep 27, 2012
- International Business Machines Corporation
- Martin M. BEAUMIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20120039046
- Publication date Feb 16, 2012
- International Business Machines Corporation
- Martin M. BEAUMIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDED LID FOR MICRO-ELECTRONIC ASSEMBLIES
- Publication number 20110292621
- Publication date Dec 1, 2011
- International Business Machines Corporation
- Martin Beaumier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LID EDGE CAPPING LOAD
- Publication number 20100020503
- Publication date Jan 28, 2010
- International Business Machines Corporation
- MARTIN BEAUMIER
- H01 - BASIC ELECTRIC ELEMENTS