Martin Gutsche

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Poughkeepsie, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Dual damascene structure
- Patent number 6,033,977
- Issue date Mar 7, 2000
- Siemens Aktiengesellschaft
- Martin Gutsche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of post-RIE polymer on Al/Cu metal line
- Patent number 5,980,770
- Issue date Nov 9, 1999
- Siemens Aktiengesellschaft
- Ravikumar Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of carbon into nitride layer for improved selectivity of...
- Patent number 5,935,873
- Issue date Aug 10, 1999
- Siemens Aktiengesellschaft
- Bruno Spuler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming metallization in semiconductor devices with a se...
- Patent number 5,854,126
- Issue date Dec 29, 1998
- Siemens Aktiengesellschaft
- Dirk Tobben
- H01 - BASIC ELECTRIC ELEMENTS