Martin HANICINEC

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Newport, GB

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer dicing process
- Patent number 12,100,619
- Issue date Sep 24, 2024
- SPTS Technologies Limited
- Martin Hanicinec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of plasma etching and plasma dicing
- Patent number 10,872,775
- Issue date Dec 22, 2020
- SPTS Technologies Limited
- Oliver J Ansell
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Wafer Dicing Process
- Publication number 20210175122
- Publication date Jun 10, 2021
- SPTS TECHNOLOGIES LIMITED
- Martin Hanicinec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PLASMA ETCHING AND PLASMA DICING
- Publication number 20180350615
- Publication date Dec 6, 2018
- SPTS TECHNOLOGIES LIMITED
- Oliver J. ANSELL
- H01 - BASIC ELECTRIC ELEMENTS