Martin Kalfus

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic assembly for removing heat from a semiconductor device
- Patent number 6,154,369
- Issue date Nov 28, 2000
- Motorola, Inc.
- Joe Luis Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic encapsulated microelectronic device and method
- Patent number 5,535,510
- Issue date Jul 16, 1996
- Motorola Inc.
- Samuel J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic encapsulated microelectronic device
- Patent number 5,523,629
- Issue date Jun 4, 1996
- Motorola, Inc.
- Samuel J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic encapsulated microelectronic device and method
- Patent number 5,378,928
- Issue date Jan 3, 1995
- Motorola, Inc.
- Samuel J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formed top contact for non-flat semiconductor devices
- Patent number 5,110,761
- Issue date May 5, 1992
- Motorola, Inc.
- Martin Kalfus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formed top contact for non-flat semiconductor devices
- Patent number 5,001,545
- Issue date Mar 19, 1991
- Motorola, Inc.
- Martin Kalfus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-centering electrode for power devices
- Patent number 4,994,412
- Issue date Feb 19, 1991
- Motorola Inc.
- Martin Kalfus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-centering electrode for power devices
- Patent number 4,935,803
- Issue date Jun 19, 1990
- Motorola, Inc.
- Martin Kalfus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a thermogenetic semiconductor device
- Patent number 4,783,428
- Issue date Nov 8, 1988
- Motorola Inc.
- Martin A. Kalfus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic encapsulated semiconductor power device means and method
- Patent number 4,568,962
- Issue date Feb 4, 1986
- Motorola, Inc.
- Martin A. Kalfus
- H01 - BASIC ELECTRIC ELEMENTS

Martin Kalfus

Person

Patents Grantslast 30 patents

Electronic assembly for removing heat from a semiconductor device

Plastic encapsulated microelectronic device and method

Plastic encapsulated microelectronic device

Plastic encapsulated microelectronic device and method

Formed top contact for non-flat semiconductor devices

Formed top contact for non-flat semiconductor devices

Self-centering electrode for power devices

Self-centering electrode for power devices

Method of producing a thermogenetic semiconductor device

Plastic encapsulated semiconductor power device means and method