Martin Lim

Person

Redwood City, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Venting device, manufacturing method of venting device, venting met...
- Patent number 12,157,663
- Issue date Dec 3, 2024
- xMEMS Labs, Inc.
- Chun-I Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Venting device
- Patent number 12,022,253
- Issue date Jun 25, 2024
- xMEMS Labs, Inc.
- Chiung C. Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Device, package structure and manufacturing method of device
- Patent number 11,884,535
- Issue date Jan 30, 2024
- xMEMS Labs, Inc.
- Jemm Yue Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sound producing package structure and manufacturing method thereof
- Patent number 11,805,342
- Issue date Oct 31, 2023
- xMEMS Labs, Inc.
- Chiung C. Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Sound producing device
- Patent number 11,438,705
- Issue date Sep 6, 2022
- xMEMS Labs, Inc.
- Jemm Yue Liang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Acoustic transducer, wearable sound device and manufacturing method...
- Patent number 11,399,228
- Issue date Jul 26, 2022
- xMEMS Labs, Inc.
- Jemm Yue Liang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Acoustic transducer, wearable sound device and manufacturing method...
- Patent number 11,323,797
- Issue date May 3, 2022
- xMEMS Labs, Inc.
- Jemm Yue Liang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package structure and methods of manufacturing sound producing chip...
- Patent number 11,252,511
- Issue date Feb 15, 2022
- xMEMS Labs, Inc.
- Chiung C. Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods for CMOS-MEMS integrated devices with multiple sealed cavit...
- Patent number 10,850,973
- Issue date Dec 1, 2020
- Invensense, Inc.
- Michael Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sound producing device
- Patent number 10,783,866
- Issue date Sep 22, 2020
- xMEMS Labs, Inc.
- Jemm Yue Liang
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Methods for CMOS-MEMS integrated devices with multiple sealed cavit...
- Patent number 10,532,926
- Issue date Jan 14, 2020
- Invensense, Inc.
- Michael Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and process for RF and low resistance applications
- Patent number 10,508,022
- Issue date Dec 17, 2019
- Invensense, Inc.
- Michael J. Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acoustic ambient temperature and humidity sensing
- Patent number 10,488,274
- Issue date Nov 26, 2019
- Invensense, Inc.
- Xiang Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated package containing MEMS acoustic sensor and environmenta...
- Patent number 10,343,897
- Issue date Jul 9, 2019
- Invensense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integrated device including multiple cavities at differen...
- Patent number 10,221,065
- Issue date Mar 5, 2019
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and process for RF and low resistance applications
- Patent number 10,160,635
- Issue date Dec 25, 2018
- Invensense, Inc.
- Michael J. Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS-CMOS platform
- Patent number 10,093,533
- Issue date Oct 9, 2018
- Invensense, Inc.
- Peter Smeys
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acoustic ambient temperature and humidity sensing
- Patent number 9,933,319
- Issue date Apr 3, 2018
- Invensense, Inc.
- Xiang Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Cavity pressure modification using local heating with a laser
- Patent number 9,878,902
- Issue date Jan 30, 2018
- Invensense, Inc.
- Michael Dueweke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive sensing structure with embedded acoustic channels
- Patent number 9,809,451
- Issue date Nov 7, 2017
- Invensense, Inc.
- Mei-Lin Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for MEMS structure with dual-level structural layer and acou...
- Patent number 9,802,815
- Issue date Oct 31, 2017
- Invensense, Inc.
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS-CMOS platform
- Patent number 9,796,580
- Issue date Oct 24, 2017
- Invensense, Inc.
- Peter Smeys
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integrated device including multiple cavities at differen...
- Patent number 9,738,512
- Issue date Aug 22, 2017
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of increasing MEMS enclosure pressure using outgassing material
- Patent number 9,731,963
- Issue date Aug 15, 2017
- Invensense, Inc.
- Cerina Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated heater for gettering or outgassing activation
- Patent number 9,718,679
- Issue date Aug 1, 2017
- Invensense, Inc.
- Martin Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with electrodes permeable to outgassing species
- Patent number 9,663,349
- Issue date May 30, 2017
- Invensense, Inc.
- Jongwoo Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for providing a MEMS device with a plurality of sealed enclo...
- Patent number 9,650,241
- Issue date May 16, 2017
- Invensense, Inc.
- Cerina Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated package containing MEMS acoustic sensor and environmenta...
- Patent number 9,617,144
- Issue date Apr 11, 2017
- Invensense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and apparatus having top port integrated back cavity micro...
- Patent number 9,621,975
- Issue date Apr 11, 2017
- Invensense, Inc.
- Fang Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
MEMS device and process for RF and low resistance applications
- Patent number 9,617,141
- Issue date Apr 11, 2017
- Invensense, Inc.
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
VENTING DEVICE, MANUFACTURING METHOD OF VENTING DEVICE, VENTING MET...
- Publication number 20240262679
- Publication date Aug 8, 2024
- xMEMS Labs, Inc.
- Chun-I Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VENTING DEVICE
- Publication number 20230209241
- Publication date Jun 29, 2023
- xMEMS Labs, Inc.
- Chiung C. Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOUND PRODUCING CELL, ACOUSTIC TRANSDUCER AND MANUFACTURING METHOD...
- Publication number 20230209269
- Publication date Jun 29, 2023
- xMEMS Labs, Inc.
- Chun-I Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MANUFACTURING METHOD OF DEVICE
- Publication number 20230023306
- Publication date Jan 26, 2023
- xMEMS Labs, Inc.
- Jemm Yue Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF DEVICE
- Publication number 20220315412
- Publication date Oct 6, 2022
- xMEMS Labs, Inc.
- Jemm Yue Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC TRANSDUCER, WEARABLE SOUND DEVICE AND MANUFACTURING METHOD...
- Publication number 20220014836
- Publication date Jan 13, 2022
- xMEMS Labs, Inc.
- Jemm Yue Liang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ACOUSTIC TRANSDUCER, WEARABLE SOUND DEVICE AND MANUFACTURING METHOD...
- Publication number 20220014838
- Publication date Jan 13, 2022
- xMEMS Labs, Inc.
- Jemm Yue Liang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOUND PRODUCING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210314688
- Publication date Oct 7, 2021
- xMEMS Labs, Inc.
- Chiung C. Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING SOUND PRODUCING CHIP...
- Publication number 20210297787
- Publication date Sep 23, 2021
- xMEMS Labs, Inc.
- Chiung C. Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Sound Producing Device
- Publication number 20210250702
- Publication date Aug 12, 2021
- xMEMS Labs, Inc.
- Jemm Yue Liang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHODS FOR CMOS-MEMS INTEGRATED DEVICES WITH MULTIPLE SEALED CAVIT...
- Publication number 20200109045
- Publication date Apr 9, 2020
- InvenSense, Inc.
- Michael DANEMAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GAS SENSOR PLATFORM AND THE METHOD OF MAKING THE SAME
- Publication number 20180340901
- Publication date Nov 29, 2018
- InvenSense, Inc.
- Fang Liu
- G01 - MEASURING TESTING
Information Patent Application
MEMS DEVICE AND PROCESS FOR RF AND LOW RESISTANCE APPLICATIONS
- Publication number 20180312394
- Publication date Nov 1, 2018
- InvenSense, Inc.
- Michael J. DANEMAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC AMBIENT TEMPERATURE AND HUMIDITY SENSING
- Publication number 20180217008
- Publication date Aug 2, 2018
- InvenSense, Inc.
- Xiang Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CMOS-MEMS-CMOS PLATFORM
- Publication number 20180009654
- Publication date Jan 11, 2018
- InvenSense, Inc.
- Peter SMEYS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR CMOS-MEMS INTEGRATED DEVICES WITH MULTIPLE SEALED CAVIT...
- Publication number 20170297907
- Publication date Oct 19, 2017
- InvenSense, Inc.
- Michael DANEMAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND PROCESS FOR RF AND LOW RESISTANCE APPLICATIONS
- Publication number 20170297900
- Publication date Oct 19, 2017
- InvenSense, Inc.
- Michael J. DANEMAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND ENVIRONMENTA...
- Publication number 20170190571
- Publication date Jul 6, 2017
- InvenSense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS INTEGRATED DEVICE INCLUDING MULTIPLE CAVITIES AT DIFFEREN...
- Publication number 20170183225
- Publication date Jun 29, 2017
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAVITY PRESSURE MODIFICATION USING LOCAL HEATING WITH A LASER
- Publication number 20170096330
- Publication date Apr 6, 2017
- InvenSense, Inc.
- Michael DUEWEKE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PROVIDING A MEMS DEVICE WITH A PLURALITY OF SEALED ENCLO...
- Publication number 20170081181
- Publication date Mar 23, 2017
- InvenSense, Inc.
- Cerina ZHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GAS SENSOR PLATFORM AND THE METHOD OF MAKING THE SAME
- Publication number 20170067841
- Publication date Mar 9, 2017
- InvenSense, Inc.
- Fang Liu
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF INCREASING MEMS ENCLOSURE PRESSURE USING OUTGASSING MATERIAL
- Publication number 20170001861
- Publication date Jan 5, 2017
- InvenSense, Inc.
- Cerina Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH ELECTRODES PERMEABLE TO OUTGASSING SPECIES
- Publication number 20160376143
- Publication date Dec 29, 2016
- InvenSense, Inc.
- Jongwoo SHIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS-CMOS PLATFORM
- Publication number 20160362293
- Publication date Dec 15, 2016
- InvenSense, Inc.
- Peter SMEYS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAVITY PRESSURE MODIFICATION USING LOCAL HEATING WITH A LASER
- Publication number 20160325985
- Publication date Nov 10, 2016
- InvenSense, Inc.
- Michael DUEWEKE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC AMBIENT TEMPERATURE AND HUMIDITY SENSING
- Publication number 20160299014
- Publication date Oct 13, 2016
- InvenSense, Inc.
- Xiang Li
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND APPARATUS HAVING TOP PORT INTEGRATED BACK CAVITY MICRO...
- Publication number 20160165331
- Publication date Jun 9, 2016
- InvenSense, Inc.
- Fang Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FILM INDUCED INTERFACE ROUGHENING AND METHOD OF PRODUCING THE SAME
- Publication number 20160115016
- Publication date Apr 28, 2016
- InvenSense, Inc.
- Fang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MEMS STRUCTURE WITH DUAL-LEVEL STRUCTURAL LAYER AND ACOU...
- Publication number 20160083247
- Publication date Mar 24, 2016
- InvenSense, Inc.
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Person

Patents Grantslast 30 patents

Venting device, manufacturing method of venting device, venting met...

Venting device

Device, package structure and manufacturing method of device

Sound producing package structure and manufacturing method thereof

Sound producing device

Acoustic transducer, wearable sound device and manufacturing method...

Acoustic transducer, wearable sound device and manufacturing method...

Package structure and methods of manufacturing sound producing chip...

Methods for CMOS-MEMS integrated devices with multiple sealed cavit...

Sound producing device

Methods for CMOS-MEMS integrated devices with multiple sealed cavit...

MEMS device and process for RF and low resistance applications

Acoustic ambient temperature and humidity sensing

Integrated package containing MEMS acoustic sensor and environmenta...

CMOS-MEMS integrated device including multiple cavities at differen...

MEMS device and process for RF and low resistance applications

CMOS-MEMS-CMOS platform

Acoustic ambient temperature and humidity sensing

Cavity pressure modification using local heating with a laser

Capacitive sensing structure with embedded acoustic channels

Method for MEMS structure with dual-level structural layer and acou...

CMOS-MEMS-CMOS platform

CMOS-MEMS integrated device including multiple cavities at differen...

Method of increasing MEMS enclosure pressure using outgassing material

Integrated heater for gettering or outgassing activation

MEMS device with electrodes permeable to outgassing species

Method for providing a MEMS device with a plurality of sealed enclo...

Integrated package containing MEMS acoustic sensor and environmenta...

Systems and apparatus having top port integrated back cavity micro...

MEMS device and process for RF and low resistance applications

Patents Applicationslast 30 patents

VENTING DEVICE, MANUFACTURING METHOD OF VENTING DEVICE, VENTING MET...

VENTING DEVICE

SOUND PRODUCING CELL, ACOUSTIC TRANSDUCER AND MANUFACTURING METHOD...

MANUFACTURING METHOD OF DEVICE

DEVICE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF DEVICE

ACOUSTIC TRANSDUCER, WEARABLE SOUND DEVICE AND MANUFACTURING METHOD...

ACOUSTIC TRANSDUCER, WEARABLE SOUND DEVICE AND MANUFACTURING METHOD...

SOUND PRODUCING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHODS OF MANUFACTURING SOUND PRODUCING CHIP...

Sound Producing Device

METHODS FOR CMOS-MEMS INTEGRATED DEVICES WITH MULTIPLE SEALED CAVIT...

GAS SENSOR PLATFORM AND THE METHOD OF MAKING THE SAME

MEMS DEVICE AND PROCESS FOR RF AND LOW RESISTANCE APPLICATIONS

ACOUSTIC AMBIENT TEMPERATURE AND HUMIDITY SENSING

CMOS-MEMS-CMOS PLATFORM

METHODS FOR CMOS-MEMS INTEGRATED DEVICES WITH MULTIPLE SEALED CAVIT...

MEMS DEVICE AND PROCESS FOR RF AND LOW RESISTANCE APPLICATIONS

INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND ENVIRONMENTA...

CMOS-MEMS INTEGRATED DEVICE INCLUDING MULTIPLE CAVITIES AT DIFFEREN...

CAVITY PRESSURE MODIFICATION USING LOCAL HEATING WITH A LASER

METHOD FOR PROVIDING A MEMS DEVICE WITH A PLURALITY OF SEALED ENCLO...

GAS SENSOR PLATFORM AND THE METHOD OF MAKING THE SAME

METHOD OF INCREASING MEMS ENCLOSURE PRESSURE USING OUTGASSING MATERIAL

MEMS DEVICE WITH ELECTRODES PERMEABLE TO OUTGASSING SPECIES

CMOS-MEMS-CMOS PLATFORM

CAVITY PRESSURE MODIFICATION USING LOCAL HEATING WITH A LASER

ACOUSTIC AMBIENT TEMPERATURE AND HUMIDITY SENSING

SYSTEMS AND APPARATUS HAVING TOP PORT INTEGRATED BACK CAVITY MICRO...

FILM INDUCED INTERFACE ROUGHENING AND METHOD OF PRODUCING THE SAME

METHOD FOR MEMS STRUCTURE WITH DUAL-LEVEL STRUCTURAL LAYER AND ACOU...