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Martin Liu

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  • Yonghe City, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Hermetic wafer level packaging
    • Patent number 9,337,168
    • Issue date May 10, 2016
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Richard Chu
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Method and apparatus of holding a device
    • Patent number 8,851,133
    • Issue date Oct 7, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Martin Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Hermetic wafer level packaging
    • Patent number 8,648,468
    • Issue date Feb 11, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Richard Chu
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Wafer level packaging bond
    • Patent number 8,647,962
    • Issue date Feb 11, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Martin Liu
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Semiconductor having a high aspect ratio via
    • Patent number 8,598,687
    • Issue date Dec 3, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yuan-Chih Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor having a high aspect ratio via
    • Patent number 8,445,380
    • Issue date May 21, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yuan-Chih Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor having a high aspect ratio via
    • Patent number 8,207,595
    • Issue date Jun 26, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yuan-Chih Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of wafer bonding
    • Patent number 8,173,518
    • Issue date May 8, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Martin Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method and apparatus for thinning a substrate
    • Patent number 8,048,807
    • Issue date Nov 1, 2011
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ming Chyi Liu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Hermetic Wafer Level Packaging
    • Publication number 20140154841
    • Publication date Jun 5, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Richard Chu
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    WAFER LEVEL PACKAGING BOND
    • Publication number 20140138853
    • Publication date May 22, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Martin Liu
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    SEMICONDUCTOR HAVING A HIGH ASPECT RATIO VIA
    • Publication number 20120235300
    • Publication date Sep 20, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yuan-Chih Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR HAVING A HIGH ASPECT RATIO VIA
    • Publication number 20120238091
    • Publication date Sep 20, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yuan-Chih Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR HAVING A HIGH ASPECT RATIO VIA
    • Publication number 20120080761
    • Publication date Apr 5, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yuan-Chih Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Hermetic Wafer Level Packaging
    • Publication number 20120025389
    • Publication date Feb 2, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Richard Chu
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    Wafer Level Packaging Bond
    • Publication number 20110233621
    • Publication date Sep 29, 2011
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Martin Liu
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    METHOD AND APPARATUS OF HOLDING A DEVICE
    • Publication number 20100248446
    • Publication date Sep 30, 2010
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Martin Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF WAFER BONDING
    • Publication number 20100248414
    • Publication date Sep 30, 2010
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Martin Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method and Apparatus for Thinning a Substrate
    • Publication number 20100062611
    • Publication date Mar 11, 2010
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ming Chyi Liu
    • H01 - BASIC ELECTRIC ELEMENTS