Martin Mayer

Person

Nittendorf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Power module with metal substrate
- Patent number 12,002,724
- Issue date Jun 4, 2024
- Infineon Technologies Austria AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with barrier to contain thermal interface mat...
- Patent number 11,626,351
- Issue date Apr 11, 2023
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with metal substrate
- Patent number 11,404,336
- Issue date Aug 2, 2022
- Infineon Technologies Austria AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CARRIER STRUCTURE, PACKAGE ARRANGEMENT, METHOD OF FORMING A CARRIER...
- Publication number 20240297111
- Publication date Sep 5, 2024
- INFINEON TECHNOLOGIES AG
- Martin MAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED...
- Publication number 20240234227
- Publication date Jul 11, 2024
- INFINEON TECHNOLOGIES AG
- Martin MAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH ELECTRICAL INSULATION FEATURES AND ASSOC...
- Publication number 20240153885
- Publication date May 9, 2024
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED...
- Publication number 20240136240
- Publication date Apr 25, 2024
- INFINEON TECHNOLOGIES AG
- Martin MAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY DEVICES INCLUDING RADIO FREQUENCY ABSORBENT FEATURES
- Publication number 20240030092
- Publication date Jan 25, 2024
- INFINEON TECHNOLOGIES AG
- Tuncay ERDOEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE, CHIP PACKAGE SYSTEM, AND METHOD OF FORMING...
- Publication number 20230064442
- Publication date Mar 2, 2023
- INFINEON TECHNOLOGIES AG
- Chan Whai Augustine KAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Power Module with Two Different Potting Materials and...
- Publication number 20230014380
- Publication date Jan 19, 2023
- Hans Hartung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A SCRATCH PROTECTION LAYER AND METHOD OF...
- Publication number 20220359432
- Publication date Nov 10, 2022
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module With Metal Substrate
- Publication number 20220310465
- Publication date Sep 29, 2022
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Barrier to Contain Thermal Interface Mat...
- Publication number 20220238422
- Publication date Jul 28, 2022
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Comprising a Thermal Interface Materia...
- Publication number 20220013433
- Publication date Jan 13, 2022
- Infineon Technologies Austria AG
- Martin Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module with Metal Substrate
- Publication number 20210407873
- Publication date Dec 30, 2021
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ENCAPSULANT UNDER COMPRESSIVE STRESS
- Publication number 20210166986
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Alexander ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interface Material Having a Polymer Ceramic
- Publication number 20200227339
- Publication date Jul 16, 2020
- Stefan Schwab
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Martin Mayer

Person

Patents Grantslast 30 patents

Power module with metal substrate

Semiconductor package with barrier to contain thermal interface mat...

Power module with metal substrate

Patents Applicationslast 30 patents

CARRIER STRUCTURE, PACKAGE ARRANGEMENT, METHOD OF FORMING A CARRIER...

SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED...

SEMICONDUCTOR DEVICES WITH ELECTRICAL INSULATION FEATURES AND ASSOC...

SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED...

RADIO FREQUENCY DEVICES INCLUDING RADIO FREQUENCY ABSORBENT FEATURES

CHIP PACKAGE STRUCTURE, CHIP PACKAGE SYSTEM, AND METHOD OF FORMING...

Semiconductor Power Module with Two Different Potting Materials and...

SEMICONDUCTOR PACKAGE WITH A SCRATCH PROTECTION LAYER AND METHOD OF...

Power Module With Metal Substrate

Semiconductor Package with Barrier to Contain Thermal Interface Mat...

Semiconductor Device Package Comprising a Thermal Interface Materia...

Power Module with Metal Substrate

PACKAGE WITH ENCAPSULANT UNDER COMPRESSIVE STRESS

Interface Material Having a Polymer Ceramic