Martin Mischitz

Person

Wernberg, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip device, method of manufacturing a multi-chip device, and...
- Patent number 11,488,921
- Issue date Nov 1, 2022
- Infineon Technologies AG
- Ali Roshanghias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device comprising a paste la...
- Patent number 11,329,021
- Issue date May 10, 2022
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices
- Patent number 10,580,753
- Issue date Mar 3, 2020
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a porous metal layer and an electronic...
- Patent number 10,515,910
- Issue date Dec 24, 2019
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a porous conductive structure in connection to...
- Patent number 10,373,868
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate having configurable circuit elements
- Patent number 10,340,197
- Issue date Jul 2, 2019
- Infineon Technologies AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate and method for manufacturing the same
- Patent number 10,269,635
- Issue date Apr 23, 2019
- Infineon Technologies AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a layer structure having partially sealed p...
- Patent number 9,929,111
- Issue date Mar 27, 2018
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source down semiconductor devices and methods of formation thereof
- Patent number 9,911,686
- Issue date Mar 6, 2018
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate and method for manufacturing the same
- Patent number 9,899,277
- Issue date Feb 20, 2018
- Infineon Technologies AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a metallization layer and method of manufacturing...
- Patent number 9,844,134
- Issue date Dec 12, 2017
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing a resin material on a semiconductor body with...
- Patent number 9,818,602
- Issue date Nov 14, 2017
- Infineon Technologies AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for structuring a substrate using a protection layer as a mask
- Patent number 9,793,119
- Issue date Oct 17, 2017
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated circuit substrate
- Patent number 9,786,568
- Issue date Oct 10, 2017
- Infineon Technologies AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for structuring a substrate
- Patent number 9,768,023
- Issue date Sep 19, 2017
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor substrate and a method for pr...
- Patent number 9,673,096
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier system for processing semiconductor substrates, and methods...
- Patent number 9,640,419
- Issue date May 2, 2017
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device having a contact pad w...
- Patent number 9,620,466
- Issue date Apr 11, 2017
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source down semiconductor devices and methods of formation thereof
- Patent number 9,368,436
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a copper layer on a semiconductor body using a...
- Patent number 9,190,322
- Issue date Nov 17, 2015
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet printing in a peripheral region of a substrate
- Patent number 9,177,790
- Issue date Nov 3, 2015
- Infineon Technologies Austria AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor including a sintered metal layer
- Patent number 8,704,514
- Issue date Apr 22, 2014
- Infineon Technologies AG
- Mario Motz
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Multi-Chip Device, Method of Manufacturing a Multi-Chip Device, and...
- Publication number 20210098410
- Publication date Apr 1, 2021
- INFINEON TECHNOLOGIES AG
- Ali Roshanghias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE COMPRISING A PASTE LA...
- Publication number 20200161269
- Publication date May 21, 2020
- INFINEON TECHNOLOGIES AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20190027464
- Publication date Jan 24, 2019
- INFINEON TECHNOLOGIES AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT SUBSTRATE
- Publication number 20170271216
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170243785
- Publication date Aug 24, 2017
- INFINEON TECHNOLOGIES AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT SUBSTRATE
- Publication number 20170243794
- Publication date Aug 24, 2017
- INFINEON TECHNOLOGIES AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170243795
- Publication date Aug 24, 2017
- INFINEON TECHNOLOGIES AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170242137
- Publication date Aug 24, 2017
- INFINEON TECHNOLOGIES AG
- Claudia Sgiarovello
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PROCESSING A SUBSTRATE AND AN ELECTRONIC DEVICE
- Publication number 20170207123
- Publication date Jul 20, 2017
- Infineon Technologies Austria AG
- Martin MISCHITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A LAYER STRUCTURE HAVING PARTIALLY SEALED P...
- Publication number 20170194272
- Publication date Jul 6, 2017
- INFINEON TECHNOLOGIES AG
- Martin MISCHITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STRUCTURING A SUBSTRATE
- Publication number 20170154767
- Publication date Jun 1, 2017
- INFINEON TECHNOLOGIES AG
- Martin MISCHITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source Down Semiconductor Devices and Methods of Formation Thereof
- Publication number 20160260658
- Publication date Sep 8, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING A METALLIZATION LAYER AND METHOD OF MANUFACTURING...
- Publication number 20160225718
- Publication date Aug 4, 2016
- INFINEON TECHNOLOGIES AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE AND A METHOD FOR PR...
- Publication number 20160141208
- Publication date May 19, 2016
- INFINEON TECHNOLOGIES AG
- Hirschler Joachim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND AN ELECTRONIC DEVICE
- Publication number 20160133584
- Publication date May 12, 2016
- INFINEON TECHNOLOGIES AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods with Inkjet Processes and Their Application
- Publication number 20160082718
- Publication date Mar 24, 2016
- Infineon Technologies Austria AG
- Stefan Schwab
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Carrier System For Processing Semiconductor Substrates, and Methods...
- Publication number 20160035560
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Copper Layer on a Semiconductor Body Using a...
- Publication number 20150214095
- Publication date Jul 30, 2015
- INFINEON TECHNOLOGIES AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inkjet Printing on Substrates
- Publication number 20150115415
- Publication date Apr 30, 2015
- Infineon Technologies Austria AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SENSOR INCLUDING A SINTERED METAL LAYER
- Publication number 20110193557
- Publication date Aug 11, 2011
- INFINEON TECHNOLOGIES AG
- Mario Motz
- G01 - MEASURING TESTING

Martin Mischitz

Person

Patents Grantslast 30 patents

Multi-chip device, method of manufacturing a multi-chip device, and...

Method for fabricating a semiconductor device comprising a paste la...

Method for manufacturing semiconductor devices

Semiconductor device having a porous metal layer and an electronic...

Method of processing a porous conductive structure in connection to...

Integrated circuit substrate having configurable circuit elements

Integrated circuit substrate and method for manufacturing the same

Method of manufacturing a layer structure having partially sealed p...

Source down semiconductor devices and methods of formation thereof

Integrated circuit substrate and method for manufacturing the same

Device including a metallization layer and method of manufacturing...

Method of depositing a resin material on a semiconductor body with...

Method for structuring a substrate using a protection layer as a mask

Method of manufacturing an integrated circuit substrate

Method for structuring a substrate

Method for processing a semiconductor substrate and a method for pr...

Carrier system for processing semiconductor substrates, and methods...

Method of manufacturing an electronic device having a contact pad w...

Source down semiconductor devices and methods of formation thereof

Method for producing a copper layer on a semiconductor body using a...

Inkjet printing in a peripheral region of a substrate

Current sensor including a sintered metal layer

Patents Applicationslast 30 patents

Multi-Chip Device, Method of Manufacturing a Multi-Chip Device, and...

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE COMPRISING A PASTE LA...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT SUBSTRATE

INTEGRATED CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT SUBSTRATE

INTEGRATED CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR PROCESSING A SUBSTRATE AND AN ELECTRONIC DEVICE

METHOD OF MANUFACTURING A LAYER STRUCTURE HAVING PARTIALLY SEALED P...

METHOD FOR STRUCTURING A SUBSTRATE

Source Down Semiconductor Devices and Methods of Formation Thereof

DEVICE INCLUDING A METALLIZATION LAYER AND METHOD OF MANUFACTURING...

METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE AND A METHOD FOR PR...

SEMICONDUCTOR DEVICE AND AN ELECTRONIC DEVICE

Methods with Inkjet Processes and Their Application

Carrier System For Processing Semiconductor Substrates, and Methods...

Method for Producing a Copper Layer on a Semiconductor Body Using a...

Inkjet Printing on Substrates

CURRENT SENSOR INCLUDING A SINTERED METAL LAYER