Martin NAVARRE

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Patents Grantslast 30 patents

Information Patent Grant
Convective wafer heating by impingement with hot gas
- Patent number 9,500,405
- Issue date Nov 22, 2016
- Lam Research AG
- Iztok Hace
- F26 - DRYING

Patents Applicationslast 30 patents

Information Patent Application
DIE EMBEDDED PACKAGE AND METHOD OF FORMING A DIE EMBEDDED PACKAGE
- Publication number 20250015008
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Mahadi-Ul HASSAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONVECTIVE WAFER HEATING BY IMPINGEMENT WITH HOT GAS
- Publication number 20160118274
- Publication date Apr 28, 2016
- LAM RESEARCH AG
- Iztok Joel HACE
- H01 - BASIC ELECTRIC ELEMENTS