Martin Sporn

Person

Melk, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer and method for processing a semiconductor wafer
- Patent number 10,325,803
- Issue date Jun 18, 2019
- Infineon Technologies AG
- Matthias Kuenle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor wafer and method for processing a semiconductor wafer
- Patent number 9,984,915
- Issue date May 29, 2018
- Infineon Technologies AG
- Matthias Kuenle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contacts for semiconductor devices and methods of forming thereof
- Patent number 9,824,972
- Issue date Nov 21, 2017
- Infineon Technologies AG
- Mark James Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts for semiconductor devices and methods of forming thereof
- Patent number 9,553,016
- Issue date Jan 24, 2017
- Infineon Technologies AG
- Mark James Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with structured sidewalls
- Patent number 9,496,193
- Issue date Nov 15, 2016
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer stack
- Patent number 9,006,899
- Issue date Apr 14, 2015
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method including a soldering process
- Patent number 8,710,678
- Issue date Apr 29, 2014
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method including a soldering process
- Patent number 8,211,752
- Issue date Jul 3, 2012
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
System for Monitoring the Surroundings of a Motor Vehicle
- Publication number 20220417448
- Publication date Dec 29, 2022
- ZKW GROUP GMBH
- Martin Brandstetter
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER
- Publication number 20180247857
- Publication date Aug 30, 2018
- INFINEON TECHNOLOGIES AG
- Matthias Kuenle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Contacts for Semiconductor Devices and Methods of Forming Thereof
- Publication number 20170098614
- Publication date Apr 6, 2017
- Mark James Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contacts for Semiconductor Devices and Methods of Forming Thereof
- Publication number 20160005647
- Publication date Jan 7, 2016
- INFINEON TECHNOLOGIES AG
- Mark James Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER
- Publication number 20150348824
- Publication date Dec 3, 2015
- INFINEON TECHNOLOGIES AG
- Matthias Kuenle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Fabricating a Layer Stack
- Publication number 20140167270
- Publication date Jun 19, 2014
- INFINEON TECHNOLOGIES AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD INCLUDING A SOLDERING PROCESS
- Publication number 20120267770
- Publication date Oct 25, 2012
- INFINEON TECHNOLOGIES AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sputter Deposition Method, Sputter Deposition System and Chip
- Publication number 20090220777
- Publication date Sep 3, 2009
- Martin Sporn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE AND METHOD INCLUDING A SOLDERING PROCESS
- Publication number 20090134501
- Publication date May 28, 2009
- INFINEON TECHNOLOGIES AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS

Martin Sporn

Person

Patents Grantslast 30 patents

Semiconductor wafer and method for processing a semiconductor wafer

Semiconductor wafer and method for processing a semiconductor wafer

Contacts for semiconductor devices and methods of forming thereof

Contacts for semiconductor devices and methods of forming thereof

Semiconductor chip with structured sidewalls

Layer stack

Device and method including a soldering process

Device and method including a soldering process

Patents Applicationslast 30 patents

System for Monitoring the Surroundings of a Motor Vehicle

SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER

Contacts for Semiconductor Devices and Methods of Forming Thereof

Contacts for Semiconductor Devices and Methods of Forming Thereof

SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER

Method of Fabricating a Layer Stack

DEVICE AND METHOD INCLUDING A SOLDERING PROCESS

Sputter Deposition Method, Sputter Deposition System and Chip

DEVICE AND METHOD INCLUDING A SOLDERING PROCESS