Martin Thoms

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for increasing adhesion strength between a surface of copper...
- Patent number 11,963,308
- Issue date Apr 16, 2024
- Atotech Deutschland GmbH & Co. KG
- Norbert Lützow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Non-etching non-resist adhesion composition and method of preparing...
- Patent number 8,945,298
- Issue date Feb 3, 2015
- Atotech Deutschland GmbH
- Christian Sparing
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition and method for micro etching of copper and copper alloys
- Patent number 8,758,634
- Issue date Jun 24, 2014
- Atotech Deutschland GmbH
- Dirk Tews
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...
- Publication number 20240179851
- Publication date May 30, 2024
- Atotech Deutschland GmbH & Co. KG
- Valentina BELOVA-MAGRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A SURFACE OF COPP...
- Publication number 20210251085
- Publication date Aug 12, 2021
- Atotech Deutschland GmbH
- Norbert LÜTZOW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AQUEOUS COMPOSITION FOR ETCHING OF COPPER AND COPPER ALLOYS
- Publication number 20140262805
- Publication date Sep 18, 2014
- Norbert Lützow
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS
- Publication number 20130056438
- Publication date Mar 7, 2013
- Atotech Deutschland GmbH
- Dirk Tews
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Manufacturing a Circuit Carrier Layer and a Use of Said M...
- Publication number 20120118753
- Publication date May 17, 2012
- Atotech Deutschland GmbH
- Norbert Lützow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Non-Etching Non-Resist Adhesion Composition and Method of Preparing...
- Publication number 20100323099
- Publication date Dec 23, 2010
- Atotech Deutschland GmbH
- Christian Sparing
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Martin Thoms

Person

Patents Grantslast 30 patents

Method for increasing adhesion strength between a surface of copper...

Non-etching non-resist adhesion composition and method of preparing...

Composition and method for micro etching of copper and copper alloys

Patents Applicationslast 30 patents

MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...

A METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A SURFACE OF COPP...

AQUEOUS COMPOSITION FOR ETCHING OF COPPER AND COPPER ALLOYS

COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS

Method of Manufacturing a Circuit Carrier Layer and a Use of Said M...

Non-Etching Non-Resist Adhesion Composition and Method of Preparing...