Martin W. Bayes

Person

Hopkinton, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metallic structure with desired combinations of mechanical and elec...
- Patent number 12,027,281
- Issue date Jul 2, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Martin W. Bayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printable non-curable thixotropic hot melt composition
- Patent number 11,859,093
- Issue date Jan 2, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Lei Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Printable non-curable thixotropic hot melt composition
- Patent number 11,859,092
- Issue date Jan 2, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Lei Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Use of enhanced performance ultraconductive copper materials in cyl...
- Patent number 11,843,153
- Issue date Dec 12, 2023
- TE CONNECTIVITY SOLUTIONS GmbH
- Martin W. Bayes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mezzanine power pin for an electrical connector system
- Patent number 11,355,872
- Issue date Jun 7, 2022
- TE CONNECTIVITY SERVICES GMBH
- David Patrick Orris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electroless metallization
- Patent number 9,863,044
- Issue date Jan 9, 2018
- Rohm and Haas Electronic Materials LLC
- Maria Anna Rzeznik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for electroless plating and a solution used for the same
- Patent number 9,783,890
- Issue date Oct 10, 2017
- Rohm and Haas Electronic Materials LLC
- Dennis Kwok-Wai Yee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for electroless plating and a solution used for the same
- Patent number 9,499,910
- Issue date Nov 22, 2016
- Rohm and Haas Electronic Materials LLC
- Dennis Kwok-Wai Yee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrochemically deposited indium composites
- Patent number 9,228,092
- Issue date Jan 5, 2016
- Rohm and Haas Electronic Materials LLC
- Nathaniel E. Brese
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods and compositions for removal of metal hardmasks
- Patent number 9,102,901
- Issue date Aug 11, 2015
- Rohm and Haas Electronic Materials LLC
- Deyan Wang
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Electrochemically deposited indium composites
- Patent number 8,585,885
- Issue date Nov 19, 2013
- Rohm and Haas Electronic Materials LLC
- Nathaniel E. Brese
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Seed layer
- Patent number 6,660,154
- Issue date Dec 9, 2003
- Shipley Company, L.L.C.
- David Merricks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Seed layer repair bath
- Patent number 6,660,153
- Issue date Dec 9, 2003
- Shipley Company, L.L.C.
- David Merricks
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Seed layer repair method
- Patent number 6,531,046
- Issue date Mar 11, 2003
- Shipley Company, L.L.C.
- Denis Morrissey
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for replenishing baths
- Patent number 6,372,055
- Issue date Apr 16, 2002
- Shipley Company, L.L.C.
- Joseph R. Montano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition for circuit board manufacture
- Patent number 6,261,466
- Issue date Jul 17, 2001
- Shipley Company, L.L.C.
- Martin W. Bayes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for manufacture of electronic devices
- Patent number 6,139,762
- Issue date Oct 31, 2000
- Shipley Company, L.L.C.
- Christopher P. Esposito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition for circuit board manufacture
- Patent number 6,054,061
- Issue date Apr 25, 2000
- Shipley Company, L.L.C.
- Martin Bayes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Layered Plating Stack for Improved Contact Resistance in Corrosive...
- Publication number 20230374688
- Publication date Nov 23, 2023
- TE Connectivity Solutions GmbH
- Suvrat BHARGAVA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTABLE NON-CURABLE THIXOTROPIC HOT MELT COMPOSITION
- Publication number 20220306883
- Publication date Sep 29, 2022
- TE Connectivity Services GmbH
- Lei Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Printable Non-Curable Thixotropic Hot Melt Composition
- Publication number 20220306884
- Publication date Sep 29, 2022
- TE Connectivity Solutions GMBH
- Lei WANG
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MEZZANINE POWER PIN FOR AN ELECTRICAL CONNECTOR SYSTEM
- Publication number 20220094087
- Publication date Mar 24, 2022
- TE Connectivity Services GmbH
- David Patrick Orris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED PERFORMANCE ULTRACONDUCTIVE COPPER AND PROCESS OF MAKING
- Publication number 20200294684
- Publication date Sep 17, 2020
- TE Connectivity Services GmbH
- Martin W. BAYES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF ENHANCED PERFORMANCE ULTRACONDUCTIVE COPPER MATERIALS IN CYL...
- Publication number 20200295427
- Publication date Sep 17, 2020
- TE Connectivity Services GmbH
- Martin W. BAYES
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METALLIC STRUCTURE WITH DESIRED COMBINATIONS OF MECHANICAL AND ELEC...
- Publication number 20200294685
- Publication date Sep 17, 2020
- Martin W. BAYES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Forming Nano-Particles in Additively-Manufact...
- Publication number 20180311736
- Publication date Nov 1, 2018
- TE Connectivity Corporation
- Gregory Thomas Pawlikowski
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Corrosion Protection System and Method for Use with Electrical Cont...
- Publication number 20180097325
- Publication date Apr 5, 2018
- Tyco Electronics Corporation
- Rodney Ivan Martens
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME
- Publication number 20150322574
- Publication date Nov 12, 2015
- Rohm and Haas Electronic Materials L.L.C.
- Dennis Kwok-Wai YEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND COMPOSITIONS FOR REMOVAL OF METAL HARDMASKS
- Publication number 20140179582
- Publication date Jun 26, 2014
- Rohm and Haas Electronic Materials L.L.C.
- Deyan Wang
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
ORGANIC SOLDERABILITY PRESERVATIVE AND METHOD
- Publication number 20140174322
- Publication date Jun 26, 2014
- Rohm and Haas Electronic Materials L.L.C.
- Qin TANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME
- Publication number 20140120263
- Publication date May 1, 2014
- Rohm and Haas Electronic Materials L.L.C.
- Dennis Kwok-Wai YEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR ELECTROLESS METALLIZATION
- Publication number 20140093647
- Publication date Apr 3, 2014
- Maria Anna RZEZNIK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROCHEMICALLY DEPOSITED INDIUM COMPOSITES
- Publication number 20140070399
- Publication date Mar 13, 2014
- Nathaniel E. BRESE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrochemically deposited indium composites
- Publication number 20090075102
- Publication date Mar 19, 2009
- Rohm and Haas Electronic Materials L.L.C.
- Nathaniel E. Brese
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cleaning composition
- Publication number 20050261152
- Publication date Nov 24, 2005
- Shipley Company, L.L.C.
- John G. Carter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of measuring component loss
- Publication number 20040258847
- Publication date Dec 23, 2004
- Shipley Company, L.L.C.
- Martin W. Bayes
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cleaning composition
- Publication number 20040112869
- Publication date Jun 17, 2004
- Shipley Company, L.L.C.
- John G. Carter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Treating metal surfaces with a modified oxide replacement composition
- Publication number 20040101624
- Publication date May 27, 2004
- Shipley Company, L.L.C.
- Martin W. Bayes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Process of producing printed circuit boards and the circuit boards...
- Publication number 20040084399
- Publication date May 6, 2004
- Shipley Company, L.L.C.
- Lee M. Cook
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrochemical co-deposition of metals for electronic device manuf...
- Publication number 20020127847
- Publication date Sep 12, 2002
- Shipley Company, L.L.C.
- Eric R. Alling
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Seed layer repair bath
- Publication number 20020088713
- Publication date Jul 11, 2002
- Shipley Company, L.L.C.
- David Merricks
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath
- Publication number 20020090484
- Publication date Jul 11, 2002
- Shipley Company, L.L.C.
- David Merricks
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Seed layer
- Publication number 20020084193
- Publication date Jul 4, 2002
- Shipley Company, L.L.C.
- David Merricks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Seed layer repair method
- Publication number 20020000382
- Publication date Jan 3, 2002
- Shipley Company, L.L.C. of Marlborough
- Denis Morrissey
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Martin W. Bayes

Person

Patents Grantslast 30 patents

Metallic structure with desired combinations of mechanical and elec...

Printable non-curable thixotropic hot melt composition

Printable non-curable thixotropic hot melt composition

Use of enhanced performance ultraconductive copper materials in cyl...

Mezzanine power pin for an electrical connector system

Method for electroless metallization

Process for electroless plating and a solution used for the same

Process for electroless plating and a solution used for the same

Electrochemically deposited indium composites

Methods and compositions for removal of metal hardmasks

Electrochemically deposited indium composites

Seed layer

Seed layer repair bath

Seed layer repair method

Method for replenishing baths

Composition for circuit board manufacture

Methods for manufacture of electronic devices

Composition for circuit board manufacture

Patents Applicationslast 30 patents

Layered Plating Stack for Improved Contact Resistance in Corrosive...

PRINTABLE NON-CURABLE THIXOTROPIC HOT MELT COMPOSITION

Printable Non-Curable Thixotropic Hot Melt Composition

MEZZANINE POWER PIN FOR AN ELECTRICAL CONNECTOR SYSTEM

ENHANCED PERFORMANCE ULTRACONDUCTIVE COPPER AND PROCESS OF MAKING

USE OF ENHANCED PERFORMANCE ULTRACONDUCTIVE COPPER MATERIALS IN CYL...

METALLIC STRUCTURE WITH DESIRED COMBINATIONS OF MECHANICAL AND ELEC...

System and Method for Forming Nano-Particles in Additively-Manufact...

Corrosion Protection System and Method for Use with Electrical Cont...

PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME

METHODS AND COMPOSITIONS FOR REMOVAL OF METAL HARDMASKS

ORGANIC SOLDERABILITY PRESERVATIVE AND METHOD

PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME

METHOD FOR ELECTROLESS METALLIZATION

ELECTROCHEMICALLY DEPOSITED INDIUM COMPOSITES

Electrochemically deposited indium composites

Cleaning composition

Method of measuring component loss

Cleaning composition

Treating metal surfaces with a modified oxide replacement composition

Process of producing printed circuit boards and the circuit boards...

Electrochemical co-deposition of metals for electronic device manuf...

Seed layer repair bath

Plating bath

Seed layer

Seed layer repair method