Martin W. Weiser

Person

Liberty Lake, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of refining solder materials
- Patent number 9,666,547
- Issue date May 30, 2017
- Honeywell International Inc.
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of refining lead-containing materials
- Patent number 7,521,286
- Issue date Apr 21, 2009
- Honeywell International Inc.
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION...
- Publication number 20110038124
- Publication date Feb 17, 2011
- Honeywell International Inc.
- Kikue S. Burnham
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF REFINING SOLDER MATERIALS
- Publication number 20100206133
- Publication date Aug 19, 2010
- Honeywell International Inc.
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION...
- Publication number 20080291634
- Publication date Nov 27, 2008
- Martin W. Weiser
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MODIFIED SOLDER ALLOYS FOR ELECTRICAL INTERCONNECTS, METHODS OF PRO...
- Publication number 20080118761
- Publication date May 22, 2008
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal interconnect and interface materials, methods of production...
- Publication number 20080023665
- Publication date Jan 31, 2008
- Martin W. Weiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Synergistically-modified surfaces and surface profiles for use with...
- Publication number 20080026181
- Publication date Jan 31, 2008
- Ravi Rastogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modified and doped solder alloys for electrical interconnects, meth...
- Publication number 20070138442
- Publication date Jun 21, 2007
- Martin W. Weiser
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Lead-containing anodes
- Publication number 20070045838
- Publication date Mar 1, 2007
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-containing solder paste
- Publication number 20070045839
- Publication date Mar 1, 2007
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-containing solder bumps
- Publication number 20070045842
- Publication date Mar 1, 2007
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermally conductive materials, solder preform constructions, assem...
- Publication number 20070013054
- Publication date Jan 18, 2007
- Brian D. Ruchert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of refining lead-containing materials
- Publication number 20060201279
- Publication date Sep 14, 2006
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Doped alloys for electrical interconnects, methods of production an...
- Publication number 20060113683
- Publication date Jun 1, 2006
- Nancy Dean
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Thermal interface materials; and compositions comprising indium and...
- Publication number 20050040369
- Publication date Feb 24, 2005
- John N. Lalena
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Anodes for electroplating operations, and methods of forming materi...
- Publication number 20050000821
- Publication date Jan 6, 2005
- Tamara L White
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor packages; lead-containing solders and anodes; and met...
- Publication number 20040065954
- Publication date Apr 8, 2004
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Martin W. Weiser

Person

Patents Grantslast 30 patents

Method of refining solder materials

Methods of refining lead-containing materials

Patents Applicationslast 30 patents

THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION...

METHOD OF REFINING SOLDER MATERIALS

THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION...

MODIFIED SOLDER ALLOYS FOR ELECTRICAL INTERCONNECTS, METHODS OF PRO...

Thermal interconnect and interface materials, methods of production...

Synergistically-modified surfaces and surface profiles for use with...

Modified and doped solder alloys for electrical interconnects, meth...

Lead-containing anodes

Lead-containing solder paste

Lead-containing solder bumps

Thermally conductive materials, solder preform constructions, assem...

Methods of refining lead-containing materials

Doped alloys for electrical interconnects, methods of production an...

Thermal interface materials; and compositions comprising indium and...

Anodes for electroplating operations, and methods of forming materi...

Semiconductor packages; lead-containing solders and anodes; and met...