Martinus Bos

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electro-photonic network for machine learning
- Patent number 12,353,006
- Issue date Jul 8, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clock signal distribution using photonic fabric
- Patent number 12,339,490
- Issue date Jun 24, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electro-photonic network for machine learning
- Patent number 12,339,492
- Issue date Jun 24, 2025
- Celestial AI Inc.
- Martinus Bos
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optically bridged multicomponent package with extended temperature...
- Patent number 12,298,608
- Issue date May 13, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G01 - MEASURING TESTING
Information Patent Grant
Photonic memory fabric for system memory interconnection
- Patent number 12,271,595
- Issue date Apr 8, 2025
- Celestial AI Inc.
- David Lazovsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clock signal distribution using photonic fabric
- Patent number 12,259,575
- Issue date Mar 25, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multicomponent photonically intra-die bridged assembly
- Patent number 12,242,122
- Issue date Mar 4, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical bridging element for separately stacked electrical ICs
- Patent number 12,216,318
- Issue date Feb 4, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,164,161
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Multicomponent photonically bridged assembly
- Patent number 12,164,162
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,130,485
- Issue date Oct 29, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical multi-die interconnect bridge with optical interface
- Patent number 12,124,095
- Issue date Oct 22, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical multi-die interconnect bridge (OMIB)
- Patent number 11,835,777
- Issue date Dec 5, 2023
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Balanced photonic architectures for matrix computations
- Patent number 11,509,397
- Issue date Nov 22, 2022
- Celestial AI Inc.
- Yangjin Ma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Transporting out-of-band signals in distributed cable systems
- Patent number 10,237,587
- Issue date Mar 19, 2019
- Nokia of America Corporation
- Gino Pedro Enrique Rea Zanabria
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Optically Bridged Multicomponent Package with Extended Temperature...
- Publication number 20250231431
- Publication date Jul 17, 2025
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G01 - MEASURING TESTING
Information Patent Application
Optically Bridged Multicomponent Package with Extended Temperature...
- Publication number 20250231430
- Publication date Jul 17, 2025
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G01 - MEASURING TESTING
Information Patent Application
Optically Bridged Multicomponent Package with Extended Temperature...
- Publication number 20250231432
- Publication date Jul 17, 2025
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G01 - MEASURING TESTING
Information Patent Application
Optically Bridged Multicomponent Package with Extended Temperature...
- Publication number 20250231429
- Publication date Jul 17, 2025
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G01 - MEASURING TESTING
Information Patent Application
EMBEDDING A PHOTONIC INTEGRATED CIRCUIT IN A SEMICONDUCTOR PACKAGE...
- Publication number 20250216632
- Publication date Jul 3, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- G02 - OPTICS
Information Patent Application
EMBEDDING A PHOTONIC INTEGRATED CIRCUIT IN A SEMICONDUCTOR PACKAGE...
- Publication number 20250216598
- Publication date Jul 3, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALING CHIPS WITH OPTICAL MEMORY APPLIANCES
- Publication number 20250190357
- Publication date Jun 12, 2025
- Celestial AI Inc.
- Francisco José Maia Da Silva
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISAGGREGATED MEMORY ARCHITECTURE
- Publication number 20250076572
- Publication date Mar 6, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Application
CIRCUIT PACKAGE FOR CONNECTING TO AN ELECTRO-PHOTONIC MEMORY FABRIC
- Publication number 20240345316
- Publication date Oct 17, 2024
- Celestial AI Inc.
- Martinus Bos
- G02 - OPTICS
Information Patent Application
ELECTRO-PHOTONIC NETWORK FOR MACHINE LEARNING
- Publication number 20240280747
- Publication date Aug 22, 2024
- Celestial AI, Inc.
- Martinus Bos
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTICOMPONENT PHOTONICALLY BRIDGED ASSEMBLY
- Publication number 20240272392
- Publication date Aug 15, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
MULTICOMPONENT PHOTONICALLY INTRA-DIE BRIDGED ASSEMBLY
- Publication number 20240272393
- Publication date Aug 15, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
OPTICAL BRIDGING ELEMENT FOR SEPARATELY STACKED ELECTRICAL ICS
- Publication number 20240219664
- Publication date Jul 4, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
ELECTRO-PHOTONIC NETWORK FOR MACHINE LEARNING
- Publication number 20240201436
- Publication date Jun 20, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CLOCK SIGNAL DISTRIBUTION USING PHOTONIC FABRIC
- Publication number 20240201437
- Publication date Jun 20, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HYBRID ELECTRO-PHOTONIC NETWORK-ON-CHIP
- Publication number 20240111091
- Publication date Apr 4, 2024
- Celestial AI, Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH ELECTRICAL AND OPTICAL I...
- Publication number 20240027711
- Publication date Jan 25, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH OPTICAL INTERFACE
- Publication number 20230418010
- Publication date Dec 28, 2023
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
CIRCUIT PACKAGE FOR CONNECTING TO AN ELECTRO-PHOTONIC MEMORY FABRIC
- Publication number 20230296838
- Publication date Sep 21, 2023
- Celestial AI Inc.
- David LAZOVSKY
- G02 - OPTICS
Information Patent Application
OPTICAL MULTI-DIE INTERCONNECT BRIDGE (OMIB)
- Publication number 20230296854
- Publication date Sep 21, 2023
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
PHOTONIC MEMORY FABRIC FOR SYSTEM MEMORY INTERCONNECTION
- Publication number 20230297237
- Publication date Sep 21, 2023
- Celestial AI Inc.
- David LAZOVSKY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-CHIP ELECTRO-PHOTONIC NETWORK
- Publication number 20220405566
- Publication date Dec 22, 2022
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRO-PHOTONIC NETWORK FOR MACHINE LEARNING
- Publication number 20220405562
- Publication date Dec 22, 2022
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CLOCK SIGNAL DISTRIBUTION USING PHOTONIC FABRIC
- Publication number 20220404545
- Publication date Dec 22, 2022
- Celestial Al Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Application
DIGITAL NEURAL NETWORK
- Publication number 20220405056
- Publication date Dec 22, 2022
- Celestial Al Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HYBRID ELECTRO-PHOTONIC NETWORK-ON-CHIP
- Publication number 20220404544
- Publication date Dec 22, 2022
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Application
BALANCED PHOTONIC ARCHITECTURES FOR MATRIX COMPUTATIONS
- Publication number 20220263582
- Publication date Aug 18, 2022
- Celestial AI Inc.
- Yangjin Ma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYNCHRONIZING UPSTREAM SIGNALS IN DISTRIBUTED CABLE SYSTEMS
- Publication number 20170359602
- Publication date Dec 14, 2017
- Alcatel-Lucent USA Inc.
- Gino Pedro Enrique Rea Zanabria
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TRANSPORTING OUT-OF-BAND SIGNALS IN DISTRIBUTED CABLE SYSTEMS
- Publication number 20170359600
- Publication date Dec 14, 2017
- Alcatel-Lucent USA Inc.
- Gino Pedro Enrique Rea Zanabria
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Martinus Bos

Person

Patents Grantslast 30 patents

Electro-photonic network for machine learning

Clock signal distribution using photonic fabric

Electro-photonic network for machine learning

Optically bridged multicomponent package with extended temperature...

Photonic memory fabric for system memory interconnection

Clock signal distribution using photonic fabric

Multicomponent photonically intra-die bridged assembly

Optical bridging element for separately stacked electrical ICs

Stacked-dies optically bridged multicomponent package

Multicomponent photonically bridged assembly

Stacked-dies optically bridged multicomponent package

Optical multi-die interconnect bridge with optical interface

Optical multi-die interconnect bridge (OMIB)

Balanced photonic architectures for matrix computations

Transporting out-of-band signals in distributed cable systems

Patents Applicationslast 30 patents

Optically Bridged Multicomponent Package with Extended Temperature...

Optically Bridged Multicomponent Package with Extended Temperature...

Optically Bridged Multicomponent Package with Extended Temperature...

Optically Bridged Multicomponent Package with Extended Temperature...

EMBEDDING A PHOTONIC INTEGRATED CIRCUIT IN A SEMICONDUCTOR PACKAGE...

EMBEDDING A PHOTONIC INTEGRATED CIRCUIT IN A SEMICONDUCTOR PACKAGE...

SCALING CHIPS WITH OPTICAL MEMORY APPLIANCES

DISAGGREGATED MEMORY ARCHITECTURE

CIRCUIT PACKAGE FOR CONNECTING TO AN ELECTRO-PHOTONIC MEMORY FABRIC

ELECTRO-PHOTONIC NETWORK FOR MACHINE LEARNING

MULTICOMPONENT PHOTONICALLY BRIDGED ASSEMBLY

MULTICOMPONENT PHOTONICALLY INTRA-DIE BRIDGED ASSEMBLY

OPTICAL BRIDGING ELEMENT FOR SEPARATELY STACKED ELECTRICAL ICS

ELECTRO-PHOTONIC NETWORK FOR MACHINE LEARNING

CLOCK SIGNAL DISTRIBUTION USING PHOTONIC FABRIC

HYBRID ELECTRO-PHOTONIC NETWORK-ON-CHIP

OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH ELECTRICAL AND OPTICAL I...

OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH OPTICAL INTERFACE

CIRCUIT PACKAGE FOR CONNECTING TO AN ELECTRO-PHOTONIC MEMORY FABRIC

OPTICAL MULTI-DIE INTERCONNECT BRIDGE (OMIB)

PHOTONIC MEMORY FABRIC FOR SYSTEM MEMORY INTERCONNECTION

MULTI-CHIP ELECTRO-PHOTONIC NETWORK

ELECTRO-PHOTONIC NETWORK FOR MACHINE LEARNING

CLOCK SIGNAL DISTRIBUTION USING PHOTONIC FABRIC

DIGITAL NEURAL NETWORK

HYBRID ELECTRO-PHOTONIC NETWORK-ON-CHIP

BALANCED PHOTONIC ARCHITECTURES FOR MATRIX COMPUTATIONS

SYNCHRONIZING UPSTREAM SIGNALS IN DISTRIBUTED CABLE SYSTEMS

TRANSPORTING OUT-OF-BAND SIGNALS IN DISTRIBUTED CABLE SYSTEMS