Marvin Bernt

Person

Kalispell, MT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for shielding features of a workpiece during el...
- Patent number 11,987,897
- Issue date May 21, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Nanotwin copper materials in semiconductor devices
- Patent number 11,973,034
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Diffusion layers in metal interconnects
- Patent number 11,901,225
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming alignment marks
- Patent number 11,899,376
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Prayudi Lianto
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Methods for electrochemical deposition of isolated seed layer areas
- Patent number 11,875,996
- Issue date Jan 16, 2024
- Applied Materials, Inc.
- Marvin Louis Bernt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical depositions of nanotwin copper materials
- Patent number 11,634,830
- Issue date Apr 25, 2023
- Applied Materials, Inc.
- Jing Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating seed layer buildup and repair
- Patent number 11,203,816
- Issue date Dec 21, 2021
- Applied Materials, Inc.
- Marvin L. Bernt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating dynamic edge control
- Patent number 10,494,731
- Issue date Dec 3, 2019
- Applied Materials, Inc.
- Paul McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for wetting substrates
- Patent number 10,373,864
- Issue date Aug 6, 2019
- Applied Materials, Inc.
- Paul McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods of enhancing polymer adhesion to copper
- Patent number 9,922,874
- Issue date Mar 20, 2018
- Applied Materials, Inc.
- Prayudi Lianto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal and metal alloy features
- Patent number 9,359,683
- Issue date Jun 7, 2016
- Applied Materials, Inc.
- Bioh Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
End point detection in workpiece processing
- Patent number 7,420,690
- Issue date Sep 2, 2008
- Semitool, Inc.
- Daniel J. Woodruff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Centrifugal spray processor and retrofit kit
- Patent number 7,305,999
- Issue date Dec 11, 2007
- Semitool, Inc.
- Trevor Henke
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
AUTOMATED DIAL-IN OF ELECTROPLATING PROCESS PARAMETERS BASED ON WAF...
- Publication number 20240413011
- Publication date Dec 12, 2024
- Applied Materials, Inc.
- Jing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN ELECTROLESS DEPOSITION
- Publication number 20240355676
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Marvin L. Bernt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for collective dishing of singulated dies
- Publication number 20240170452
- Publication date May 23, 2024
- Anup PANCHOLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING ALIGNMENT MARKS
- Publication number 20240069448
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Prayudi LIANTO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
HYBRID BONDING OF SEMICONDUCTOR STRUCTURES TO ADVANCED SUBSTRATE PA...
- Publication number 20240021571
- Publication date Jan 18, 2024
- Anup PANCHOLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR ALTERING LITHOGRAPHIC PATTERNS TO ADJUST...
- Publication number 20230304183
- Publication date Sep 28, 2023
- Marvin Louis BERNT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SINGLE SIDE VIA FILL PROCESS FOR THROUGH-VIAS
- Publication number 20230307320
- Publication date Sep 28, 2023
- Marvin Louis BERNT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCHEMICAL DEPOSITIONS OF NANOTWIN COPPER MATERIALS
- Publication number 20230272547
- Publication date Aug 31, 2023
- Applied Materials, Inc.
- Jing Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR ELECTROCHEMICAL DEPOSITION OF ISOLATED SEED LAYER AREAS
- Publication number 20230086742
- Publication date Mar 23, 2023
- Marvin Louis BERNT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION LAYERS IN METAL INTERCONNECTS
- Publication number 20230077737
- Publication date Mar 16, 2023
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCHEMICAL DEPOSITIONS OF NANOTWIN COPPER MATERIALS
- Publication number 20230068074
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Jing Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NANOTWIN COPPER MATERIALS IN SEMICONDUCTOR DEVICES
- Publication number 20230065426
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING WITH TEMPORARY FEATURES
- Publication number 20220157655
- Publication date May 19, 2022
- Applied Materials, Inc.
- Marvin L. Bernt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS AND APPARATUS FOR REMOVING ABRASIVE PARTICLES
- Publication number 20200306931
- Publication date Oct 1, 2020
- Applied Materials, Inc.
- PRAYUDI LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REMOVING CONTAMINANTS IN ELECTROPLATING SYS...
- Publication number 20190345624
- Publication date Nov 14, 2019
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING DYNAMIC EDGE CONTROL
- Publication number 20190177869
- Publication date Jun 13, 2019
- Applied Materials, Inc.
- Paul McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR WETTING SUBSTRATES
- Publication number 20180182664
- Publication date Jun 28, 2018
- Applied Materials, Inc.
- Paul McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF ENHANCING POLYMER ADHESION TO COPPER
- Publication number 20180005881
- Publication date Jan 4, 2018
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SHIELDING FEATURES OF A WORKPIECE DURING EL...
- Publication number 20170191180
- Publication date Jul 6, 2017
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF FORMING METAL AND METAL ALLOY FEATURES
- Publication number 20160355941
- Publication date Dec 8, 2016
- Applied Materials, Inc.
- Bioh Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REDUCED TITANIUM UNDERCUT IN ETCH PROCESS
- Publication number 20150348925
- Publication date Dec 3, 2015
- Applied Materials, Inc.
- David P. Surdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ELECTROCHEMICAL DEPOSITION OF MULTI-COMPONENT SOLDER US...
- Publication number 20150247251
- Publication date Sep 3, 2015
- Applied Materials, Inc.
- Marvin L. Bernt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR ELECTROCHEMICAL DEPOSITION OF MULTI-COMPONENT SOLDER US...
- Publication number 20140246324
- Publication date Sep 4, 2014
- Applied Materials, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WORKPIECE WETTING AND CLEANING
- Publication number 20120052204
- Publication date Mar 1, 2012
- Applied Materials, Inc.
- Bryan Puch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DEPOSITING ALLOY COMPOSITION
- Publication number 20080067072
- Publication date Mar 20, 2008
- Semitool, Inc.
- Bioh Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR UNIFORMLY ETCHING FILMS ON A SEMICONDUCTOR WAFER
- Publication number 20080070411
- Publication date Mar 20, 2008
- John Ghekiere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for depositing alloy composition
- Publication number 20080041727
- Publication date Feb 21, 2008
- Semitool, Inc.
- Bioh Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
End point detection in workpiece processing
- Publication number 20070121123
- Publication date May 31, 2007
- Semitool, Inc.
- Daniel J. Woodruff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Centrifugal spray processor and retrofit kit
- Publication number 20030102019
- Publication date Jun 5, 2003
- Semitool, Inc.
- Trevor Henke
- B08 - CLEANING

Marvin Bernt

Person

Patents Grantslast 30 patents

Systems and methods for shielding features of a workpiece during el...

Nanotwin copper materials in semiconductor devices

Diffusion layers in metal interconnects

Methods for forming alignment marks

Methods for electrochemical deposition of isolated seed layer areas

Electrochemical depositions of nanotwin copper materials

Electroplating seed layer buildup and repair

Electroplating dynamic edge control

Systems and methods for wetting substrates

Methods of enhancing polymer adhesion to copper

Method of forming metal and metal alloy features

End point detection in workpiece processing

Centrifugal spray processor and retrofit kit

Patents Applicationslast 30 patents

AUTOMATED DIAL-IN OF ELECTROPLATING PROCESS PARAMETERS BASED ON WAF...

PROCESS FOR THIN ELECTROLESS DEPOSITION

Method for collective dishing of singulated dies

METHODS FOR FORMING ALIGNMENT MARKS

HYBRID BONDING OF SEMICONDUCTOR STRUCTURES TO ADVANCED SUBSTRATE PA...

METHODS AND APPARATUS FOR ALTERING LITHOGRAPHIC PATTERNS TO ADJUST...

SINGLE SIDE VIA FILL PROCESS FOR THROUGH-VIAS

ELECTROCHEMICAL DEPOSITIONS OF NANOTWIN COPPER MATERIALS

METHODS FOR ELECTROCHEMICAL DEPOSITION OF ISOLATED SEED LAYER AREAS

DIFFUSION LAYERS IN METAL INTERCONNECTS

ELECTROCHEMICAL DEPOSITIONS OF NANOTWIN COPPER MATERIALS

NANOTWIN COPPER MATERIALS IN SEMICONDUCTOR DEVICES

ELECTROPLATING WITH TEMPORARY FEATURES

METHODS AND APPARATUS FOR REMOVING ABRASIVE PARTICLES

SYSTEMS AND METHODS FOR REMOVING CONTAMINANTS IN ELECTROPLATING SYS...

ELECTROPLATING DYNAMIC EDGE CONTROL

SYSTEMS AND METHODS FOR WETTING SUBSTRATES

METHODS OF ENHANCING POLYMER ADHESION TO COPPER

SYSTEMS AND METHODS FOR SHIELDING FEATURES OF A WORKPIECE DURING EL...

METHOD OF FORMING METAL AND METAL ALLOY FEATURES

REDUCED TITANIUM UNDERCUT IN ETCH PROCESS

METHODS FOR ELECTROCHEMICAL DEPOSITION OF MULTI-COMPONENT SOLDER US...

METHODS FOR ELECTROCHEMICAL DEPOSITION OF MULTI-COMPONENT SOLDER US...

WORKPIECE WETTING AND CLEANING

METHOD AND SYSTEM FOR DEPOSITING ALLOY COMPOSITION

METHODS FOR UNIFORMLY ETCHING FILMS ON A SEMICONDUCTOR WAFER

Method and system for depositing alloy composition

End point detection in workpiece processing

Centrifugal spray processor and retrofit kit