Marvin Gestole

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Cebu, PH

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Patents Grantslast 30 patents

Information Patent Grant
Robust leaded molded packages and methods for forming the same
- Patent number 7,906,837
- Issue date Mar 15, 2011
- Fairchild Semiconductor Corporation
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust leaded molded packages and methods for forming the same
- Patent number 7,560,311
- Issue date Jul 14, 2009
- Fairchild Semiconductor Corporation
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Folded frame carrier for MOSFET BGA
- Patent number 7,402,462
- Issue date Jul 22, 2008
- Fairchild Semiconductor Corporation
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust leaded molded packages and methods for forming the same
- Patent number 7,122,884
- Issue date Oct 17, 2006
- Fairchild Semiconductor Corporation
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a plurality of devices utilizing a plurality of...
- Patent number 6,762,067
- Issue date Jul 13, 2004
- Fairchild Semiconductor Corporation
- Maria Clemens Y. Quinones
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ROBUST LEADED MOLDED PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20090236714
- Publication date Sep 24, 2009
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES
- Publication number 20090057855
- Publication date Mar 5, 2009
- Maria Clemens Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Folded frame carrier for MOSFET BGA
- Publication number 20070015316
- Publication date Jan 18, 2007
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robust leaded molded packages and methods for forming the same
- Publication number 20060231933
- Publication date Oct 19, 2006
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robust leaded molded packages and methods for forming the same
- Publication number 20030193080
- Publication date Oct 16, 2003
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS