Marvin M. Kilgo, III

Person

Oakland, CA, US

People

Patents Applicationslast 30 patents

Information Patent Application
Methods and Apparatus for Forming Multi-Layer Structures Using Adhe...
- Publication number 20110315556
- Publication date Dec 29, 2011
- Microfabrica Inc.
- Adam L. Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrochemical Fabrication Process Including Process Monitoring, M...
- Publication number 20100065431
- Publication date Mar 18, 2010
- Microfabrica Inc.
- Adam L. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electrochemical Fabrication Process Including Process Monitoring, M...
- Publication number 20100065432
- Publication date Mar 18, 2010
- Microfabrica Inc.
- Adam L. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electrochemical Fabrication Method for Producing Compliant Beam-Lik...
- Publication number 20100006443
- Publication date Jan 14, 2010
- Microfabrica Inc.
- Adam L. Cohen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and Apparatus for Forming Multi-Layer Structures Using Adhe...
- Publication number 20090301893
- Publication date Dec 10, 2009
- Microfabrica Inc.
- Adam L. Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Integrated Circuit Packaging Using Electrochemically Fabricated Str...
- Publication number 20090197371
- Publication date Aug 6, 2009
- Microfabrica Inc.
- Adam L. Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Marvin M. Kilgo, III

Person

Patents Applicationslast 30 patents

Methods and Apparatus for Forming Multi-Layer Structures Using Adhe...

Electrochemical Fabrication Process Including Process Monitoring, M...

Electrochemical Fabrication Process Including Process Monitoring, M...

Electrochemical Fabrication Method for Producing Compliant Beam-Lik...

Methods and Apparatus for Forming Multi-Layer Structures Using Adhe...

Integrated Circuit Packaging Using Electrochemically Fabricated Str...