Mary Annie Cheong

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method of producing a semiconductor package
- Patent number 9,842,792
- Issue date Dec 12, 2017
- UTAC HEADQUARTERS PTE. LTD.
- Danny Retuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor package
- Patent number 9,281,218
- Issue date Mar 8, 2016
- United Test & Assembly Center Ltd.
- Danny Retuta
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor package with under bump metallization aligned with op...
- Patent number 8,030,768
- Issue date Oct 4, 2011
- United Test & Assembly Center Ltd.
- Roel Robles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die packages
- Patent number 7,723,833
- Issue date May 25, 2010
- United Test & Assembly Center Ltd.
- Gaurav Mehta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR PACKAGE
- Publication number 20160211196
- Publication date Jul 21, 2016
- United Test & Assembly Center Ltd.
- Danny RETUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP ON VIA-PACKAGING AND METHODOLOGIES
- Publication number 20080284015
- Publication date Nov 20, 2008
- United Test and Assembly Center, Ltd.
- Roel Robles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Producing a Semiconductor Package
- Publication number 20080061414
- Publication date Mar 13, 2008
- United Test & Assembly Center Ltd.
- Danny RETUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Die Packages
- Publication number 20080054435
- Publication date Mar 6, 2008
- United Test and Assembly Center, Ltd.
- Gaurav MEHTA
- H01 - BASIC ELECTRIC ELEMENTS