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MARY CLAIRE SILVESTRE

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  • Clifton Park, NY, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wrap-around projection liner for AI device
    • Patent number 12,010,930
    • Issue date Jun 11, 2024
    • International Business Machines Corporation
    • Injo Ok
  • Information Patent Grant

    RRAM with high work function cap
    • Patent number 12,004,436
    • Issue date Jun 4, 2024
    • International Business Machines Corporation
    • Soon-Cheon Seo
  • Information Patent Grant

    Subtractive via etch for MIMCAP
    • Patent number 11,670,580
    • Issue date Jun 6, 2023
    • International Business Machines Corporation
    • Yann Mignot
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Non volatile resistive memory logic device
    • Patent number 11,600,325
    • Issue date Mar 7, 2023
    • International Business Machines Corporation
    • Hsueh-Chung Chen
    • G11 - INFORMATION STORAGE
  • Information Patent Grant

    Wafer backside engineering for wafer stress control
    • Patent number 11,569,134
    • Issue date Jan 31, 2023
    • International Business Machines Corporation
    • Nikhil Jain
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Grant

    Large via buffer
    • Patent number 11,075,161
    • Issue date Jul 27, 2021
    • International Business Machines Corporation
    • Yann Mignot
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    RRAM WITH HIGH WORK FUNCTION CAP
    • Publication number 20240040940
    • Publication date Feb 1, 2024
    • International Business Machines Corporation
    • Soon-Cheon Seo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DUAL-METAL ULTRA THICK METAL (UTM) STRUCTURE
    • Publication number 20230187350
    • Publication date Jun 15, 2023
    • International Business Machines Corporation
    • Hsueh-Chung Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DUAL COLOR VIA PATTERNING
    • Publication number 20230100368
    • Publication date Mar 30, 2023
    • International Business Machines Corporation
    • Hsueh-Chung Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    X-RAY SHIELDING STRUCTURE FOR A CHIP
    • Publication number 20230088602
    • Publication date Mar 23, 2023
    • International Business Machines Corporation
    • Hsueh-Chung Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WRAP-AROUND PROJECTION LINER FOR AI DEVICE
    • Publication number 20230070462
    • Publication date Mar 9, 2023
    • International Business Machines Corporation
    • Injo Ok
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBTRACTIVE VIA ETCH FOR MIMCAP
    • Publication number 20230063908
    • Publication date Mar 2, 2023
    • International Business Machines Corporation
    • YANN MIGNOT
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    NON VOLATILE RESISTIVE MEMORY LOGIC DEVICE
    • Publication number 20220172776
    • Publication date Jun 2, 2022
    • International Business Machines Corporation
    • Hsueh-Chung Chen
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    WAFER BACKSIDE ENGINEERING FOR WAFER STRESS CONTROL
    • Publication number 20210320036
    • Publication date Oct 14, 2021
    • International Business Machines Corporation
    • Nikhil JAIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LARGE VIA BUFFER
    • Publication number 20200395293
    • Publication date Dec 17, 2020
    • International Business Machines Corporation
    • YANN MIGNOT
    • H01 - BASIC ELECTRIC ELEMENTS