Maryse Cournoyer

Person

Granby, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Direct bonded heterogeneous integration silicon bridge
- Patent number 11,791,270
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Kamal K Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics package with face-to-face bonding
- Patent number 11,209,598
- Issue date Dec 28, 2021
- International Business Machines Corporation
- Barnim Alexander Janta-Polczynski
- G02 - OPTICS
Information Patent Grant
Direct bonded heterogeneous integration packaging structures
- Patent number 11,177,217
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed under bump metallurgy (UBM) interconnect bridge structure
- Patent number 11,139,269
- Issue date Oct 5, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip bridge connector
- Patent number 10,991,635
- Issue date Apr 27, 2021
- International Business Machines Corporation
- Dale Curtis McHerron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density chip-to-chip interconnection with silicon bridge
- Patent number 10,784,202
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Francois Arguin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded heterogeneous integration packaging structures
- Patent number 10,580,738
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE
- Publication number 20220359401
- Publication date Nov 10, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixed Under Bump Metallurgy (UBM) Interconnect Bridge Structure
- Publication number 20210233892
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS PACKAGE WITH FACE-TO-FACE BONDING
- Publication number 20200279840
- Publication date Sep 3, 2020
- International Business Machines Corporation
- BARNIM ALEXANDER JANTA-POLCZYNSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES
- Publication number 20200144187
- Publication date May 7, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES
- Publication number 20190295952
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY CHIP-TO-CHIP INTERCONNECTION WITH SILICON BRIDGE
- Publication number 20190172787
- Publication date Jun 6, 2019
- International Business Machines Corporation
- Francois Arguin
- H01 - BASIC ELECTRIC ELEMENTS

Maryse Cournoyer

Person

Patents Grantslast 30 patents

Direct bonded heterogeneous integration silicon bridge

Photonics package with face-to-face bonding

Direct bonded heterogeneous integration packaging structures

Mixed under bump metallurgy (UBM) interconnect bridge structure

Multiple chip bridge connector

High-density chip-to-chip interconnection with silicon bridge

Direct bonded heterogeneous integration packaging structures

Patents Applicationslast 30 patents

DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE

Mixed Under Bump Metallurgy (UBM) Interconnect Bridge Structure

PHOTONICS PACKAGE WITH FACE-TO-FACE BONDING

DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES

DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES

HIGH-DENSITY CHIP-TO-CHIP INTERCONNECTION WITH SILICON BRIDGE