Masaaki Abe

Person

Kumamoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
High frequency relay
- Patent number 11,170,958
- Issue date Nov 9, 2021
- Omron Corporation
- Tetsuro Tsurusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal connection structure and electromagnetic relay using same
- Patent number 10,643,811
- Issue date May 5, 2020
- Omron Corporation
- Seiki Shimoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 10,602,613
- Issue date Mar 24, 2020
- Omron Corporation
- Seiki Shimoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball-grid-array semiconductor device with protruding terminals
- Patent number 6,410,979
- Issue date Jun 25, 2002
- NEC Corporation
- Masaaki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with potting resin structures
- Patent number 6,028,368
- Issue date Feb 22, 2000
- NEC Corporation
- Masaaki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array semiconductor device
- Patent number 6,028,366
- Issue date Feb 22, 2000
- NEC Corporation
- Masaaki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device of lead-on-chip structure
- Patent number 5,988,707
- Issue date Nov 23, 1999
- NEC Corporation
- Masaaki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package
- Patent number 5,849,608
- Issue date Dec 15, 1998
- NEC Corporation
- Masaaki Abe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH FREQUENCY RELAY
- Publication number 20200020496
- Publication date Jan 16, 2020
- Omron Corporation
- Tetsuro Tsurusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC SHIELD STRUCTURE
- Publication number 20180144892
- Publication date May 24, 2018
- Omron Corporation
- Seiki Shimoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL CONNECTION STRUCTURE AND ELECTROMAGNETIC RELAY USING SAME
- Publication number 20180075993
- Publication date Mar 15, 2018
- Omron Corporation
- Seiki Shimoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20180070449
- Publication date Mar 8, 2018
- Omron Corporation
- Seiki Shimoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRINTING A METAL PASTE, METAL MASK, AND BUMP FORMING METHOD
- Publication number 20090239091
- Publication date Sep 24, 2009
- NEC ELECTRONICS CORPORATION
- Masaaki Abe
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTROMAGNET DEVICE
- Publication number 20090219120
- Publication date Sep 3, 2009
- Omron Corporation
- Masaaki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL-GRID-ARRAY SEMICONDUCTOR WITH PROTRUDING TERMINALS
- Publication number 20010013639
- Publication date Aug 16, 2001
- MASAAKI ABE
- H01 - BASIC ELECTRIC ELEMENTS

Masaaki Abe

Person

Patents Grantslast 30 patents

High frequency relay

Terminal connection structure and electromagnetic relay using same

Electronic device

Ball-grid-array semiconductor device with protruding terminals

Semiconductor device with potting resin structures

Ball grid array semiconductor device

Semiconductor device of lead-on-chip structure

Semiconductor chip package

Patents Applicationslast 30 patents

HIGH FREQUENCY RELAY

MAGNETIC SHIELD STRUCTURE

TERMINAL CONNECTION STRUCTURE AND ELECTROMAGNETIC RELAY USING SAME

ELECTRONIC DEVICE

METHOD FOR PRINTING A METAL PASTE, METAL MASK, AND BUMP FORMING METHOD

ELECTROMAGNET DEVICE

BALL-GRID-ARRAY SEMICONDUCTOR WITH PROTRUDING TERMINALS