Masaaki HARAZONO

Person

Kirishima-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 10,602,622
- Issue date Mar 24, 2020
- KYOCERA Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and manufacturing method for same
- Patent number 10,306,769
- Issue date May 28, 2019
- Kyocera Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 10,172,235
- Issue date Jan 1, 2019
- KYOCERA Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 9,913,372
- Issue date Mar 6, 2018
- KYOCERA Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, mount structure thereof, and methods of prod...
- Patent number 8,957,321
- Issue date Feb 17, 2015
- KYOCERA SLC Technologies Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and mounting structure using the same
- Patent number 8,890,001
- Issue date Nov 18, 2014
- KYOCERA SLC Technologies Corporation
- Takayuki Nejime
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board and method for manufacturing...
- Patent number 8,863,377
- Issue date Oct 21, 2014
- Kyocera Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and mounting structure using the same
- Patent number 8,735,741
- Issue date May 27, 2014
- Kyocera Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for manufacturing prepreg sheet and prepreg sheet
- Patent number 8,273,203
- Issue date Sep 25, 2012
- Kyocera Corporation
- Masaaki Harazono
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fiber-reinforced resin and method for manufacturing the same
- Patent number 8,012,561
- Issue date Sep 6, 2011
- Kyocera Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for manufacturing prepreg sheet and prepreg sheet
- Patent number 7,951,447
- Issue date May 31, 2011
- Kyocera Corporation
- Masaaki Harazono
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wiring board
- Patent number 6,207,259
- Issue date Mar 27, 2001
- Kyocera Corporation
- Yuji Iino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package for housing a photosemiconductor device
- Patent number 5,744,848
- Issue date Apr 28, 1998
- Kyocera Corporation
- Masaaki Harazono
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD
- Publication number 20190132962
- Publication date May 2, 2019
- Kyocera Corporation
- Masaaki Harazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180376589
- Publication date Dec 27, 2018
- Kyocera Corporation
- Masaaki HARAZONO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD FOR SAME
- Publication number 20180146558
- Publication date May 24, 2018
- Kyocera Corporation
- Masaaki HARAZONO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20170215277
- Publication date Jul 27, 2017
- Kyocera Corporation
- Masaaki HARAZONO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MOUNTING STRUCTURE USING THE SAME
- Publication number 20130192882
- Publication date Aug 1, 2013
- KYOCERA SLC TECHNOLOGIES CORPORATION
- Takayuki NEJIME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, MOUNT STRUCTURE THEREOF, AND METHODS OF PROD...
- Publication number 20130081861
- Publication date Apr 4, 2013
- KYOCERA SLC TECHNOLOGIES CORPORATION
- Masaaki HARAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MOUNTING STRUCTURE USING THE SAME
- Publication number 20120132462
- Publication date May 31, 2012
- Kyocera Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD AND METHOD FOR MANUFACTURING...
- Publication number 20110314666
- Publication date Dec 29, 2011
- Kyocera Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Manufacturing Prepreg Sheet and Prepreg Sheet
- Publication number 20110139348
- Publication date Jun 16, 2011
- Kyocera Corporation
- Masaaki HARAZONO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Fiber-Reinforced Resin and Method for Manufacturing the Same
- Publication number 20100136284
- Publication date Jun 3, 2010
- KYOCERA CORPORATION
- Masaaki Harazono
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method and Apparatus for Manufacturing Prepreg Sheet and Prepreg Sheet
- Publication number 20100062249
- Publication date Mar 11, 2010
- KYOCERA CORPORATION
- Masaaki Harazono
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Masaaki HARAZONO

Person

Patents Grantslast 30 patents

Wiring board

Wiring board and manufacturing method for same

Wiring board and method for manufacturing the same

Wiring board

Printed circuit board, mount structure thereof, and methods of prod...

Wiring board and mounting structure using the same

Method for manufacturing circuit board and method for manufacturing...

Circuit board and mounting structure using the same

Method and apparatus for manufacturing prepreg sheet and prepreg sheet

Fiber-reinforced resin and method for manufacturing the same

Method and apparatus for manufacturing prepreg sheet and prepreg sheet

Wiring board

Package for housing a photosemiconductor device

Patents Applicationslast 30 patents

WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND MANUFACTURING METHOD FOR SAME

WIRING BOARD

WIRING BOARD AND MOUNTING STRUCTURE USING THE SAME

PRINTED CIRCUIT BOARD, MOUNT STRUCTURE THEREOF, AND METHODS OF PROD...

CIRCUIT BOARD AND MOUNTING STRUCTURE USING THE SAME

METHOD FOR MANUFACTURING CIRCUIT BOARD AND METHOD FOR MANUFACTURING...

Method and Apparatus for Manufacturing Prepreg Sheet and Prepreg Sheet

Fiber-Reinforced Resin and Method for Manufacturing the Same

Method and Apparatus for Manufacturing Prepreg Sheet and Prepreg Sheet