Masaaki Higashitani

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Three dimensional memory device containing resonant tunneling barri...
- Patent number 12,245,425
- Issue date Mar 4, 2025
- SanDisk Technologies, Inc.
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory device containing resonant tunneling barri...
- Patent number 12,219,756
- Issue date Feb 4, 2025
- SanDisk Technologies LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses for forming semiconductor devices containin...
- Patent number 12,217,965
- Issue date Feb 4, 2025
- SanDisk Technologies LLC
- Fei Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Three-dimensional memory array with dual-level peripheral circuits...
- Patent number 12,207,459
- Issue date Jan 21, 2025
- SanDisk Technologies LLC
- Yuki Mizutani
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods and apparatuses for forming semiconductor devices containin...
- Patent number 12,176,203
- Issue date Dec 24, 2024
- SanDisk Technologies LLC
- Fei Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Erase method for non-volatile memory with multiple tiers
- Patent number 12,148,478
- Issue date Nov 19, 2024
- SANDISK TECHNOLOGIES LLC
- Xiang Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Modelling and prediction of virtual inline quality control in the p...
- Patent number 12,135,542
- Issue date Nov 5, 2024
- SanDisk Technologies LLC
- Tsuyoshi Sendoda
- G05 - CONTROLLING REGULATING
Information Patent Grant
Memory device including a ferroelectric semiconductor channel and m...
- Patent number 12,127,410
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Virtual quality control interpolation and process feedback in the p...
- Patent number 12,105,137
- Issue date Oct 1, 2024
- SanDisk Technologies LLC
- Yusuke Ikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three dimensional memory device containing resonant tunneling barri...
- Patent number 12,016,179
- Issue date Jun 18, 2024
- SanDisk Technologies LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Virtual metrology for feature profile prediction in the production...
- Patent number 12,009,269
- Issue date Jun 11, 2024
- SANDISK TECHNOLOGIES LLC
- Cheng-Chung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory array with dual-level peripheral circuits...
- Patent number 12,004,348
- Issue date Jun 4, 2024
- SanDisk Technologies LLC
- Yuki Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with separated contact regions and...
- Patent number 11,996,153
- Issue date May 28, 2024
- SanDisk Technologies LLC
- James Kai
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device with vertical field effect transist...
- Patent number 11,963,352
- Issue date Apr 16, 2024
- SanDisk Technologies LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including an airgap containing bonding-level dielec...
- Patent number 11,948,902
- Issue date Apr 2, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of data latches for compression of soft bit data in non-volatil...
- Patent number 11,901,019
- Issue date Feb 13, 2024
- SanDisk Technologies LLC
- Hua-Ling Cynthia Hsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonded assembly including inter-die via structures and methods for...
- Patent number 11,869,877
- Issue date Jan 9, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including low-k drain-select-level...
- Patent number 11,871,580
- Issue date Jan 9, 2024
- SanDisk Technologies LLC
- Peng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including low-k drain-select-level...
- Patent number 11,856,765
- Issue date Dec 26, 2023
- SanDisk Technologies LLC
- Koichi Matsuno
Information Patent Grant
Three-dimensional memory device having support-die-assisted source...
- Patent number 11,791,327
- Issue date Oct 17, 2023
- SanDisk Technologies LLC
- Kwang-Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices with backside source power...
- Patent number 11,676,954
- Issue date Jun 13, 2023
- SanDisk Technologies LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor die assembly with metal alloy bonding pads and...
- Patent number 11,646,282
- Issue date May 9, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing low dielectric constant bonding dielectr...
- Patent number 11,646,283
- Issue date May 9, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition apparatus including an off-axis lift-and-rotation unit a...
- Patent number 11,598,005
- Issue date Mar 7, 2023
- SanDisk Technologies LLC
- Shoichi Murakami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Three-dimensional memory device with double-sided stepped surfaces...
- Patent number 11,569,259
- Issue date Jan 31, 2023
- SanDisk Technologies LLC
- Yuki Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly employing metal-semiconductor bonding and metal-met...
- Patent number 11,562,975
- Issue date Jan 24, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having on-pitch drain select gate e...
- Patent number 11,552,094
- Issue date Jan 10, 2023
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone plasma-enhanced chemical vapor deposition apparatus and...
- Patent number 11,551,961
- Issue date Jan 10, 2023
- SanDisk Technologies LLC
- Shoichi Murakami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-zone plasma-enhanced chemical vapor deposition apparatus and...
- Patent number 11,538,708
- Issue date Dec 27, 2022
- SanDisk Technologies LLC
- Shoichi Murakami
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODELLING AND PREDICTION OF VIRTUAL QUALITY CONTROL DATA INCORPORAT...
- Publication number 20240387295
- Publication date Nov 21, 2024
- SANDISK TECHNOLOGIES, INC.
- Tsuyoshi Sendoda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL NOR ARRAY AND METHOD OF MAKING THE SAME
- Publication number 20240206169
- Publication date Jun 20, 2024
- SANDISK TECHNOLOGIES LLC
- Masaaki HIGASHITANI
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL NOR ARRAY AND METHOD OF MAKING THE SAME
- Publication number 20240206171
- Publication date Jun 20, 2024
- SANDISK TECHNOLOGIES LLC
- Masaaki HIGASHITANI
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE LINES AND MET...
- Publication number 20240172431
- Publication date May 23, 2024
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY SEPARATED SOURC...
- Publication number 20240127864
- Publication date Apr 18, 2024
- SANDISK TECHNOLOGIES LLC
- Masaaki HIGASHITANI
- G11 - INFORMATION STORAGE
Information Patent Application
ERASE METHOD FOR NON-VOLATILE MEMORY WITH MULTIPLE TIERS
- Publication number 20240105265
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Xiang Yang
- G11 - INFORMATION STORAGE
Information Patent Application
HIGH DENSITY SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CONTROLLER,...
- Publication number 20240096850
- Publication date Mar 21, 2024
- SANDISK TECHNOLOGIES LLC
- Jayavel Pachamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITRY ARRANGEMENT IN A FLOORPLAN OF A MEMORY DEVICE
- Publication number 20230367944
- Publication date Nov 16, 2023
- SANDISK TECHNOLOGIES LLC
- Yuki Mizutani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY DEVICE INCLUDING COMPOSITE METAL OXIDE SEMICONDUCTOR CHANNEL...
- Publication number 20230363162
- Publication date Nov 9, 2023
- SANDISK TECHNOLOGIES LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING COMPOSITE METAL OXIDE SEMICONDUCTOR CHANNEL...
- Publication number 20230363158
- Publication date Nov 9, 2023
- SANDISK TECHNOLOGIES LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING COMPOSITE METAL OXIDE SEMICONDUCTOR CHANNEL...
- Publication number 20230363161
- Publication date Nov 9, 2023
- SANDISK TECHNOLOGIES LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...
- Publication number 20230253353
- Publication date Aug 10, 2023
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR FORMING SEMICONDUCTOR DEVICES CONTAININ...
- Publication number 20230223248
- Publication date Jul 13, 2023
- SANDISK TECHNOLOGIES LLC
- Fei ZHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUSES FOR FORMING SEMICONDUCTOR DEVICES CONTAININ...
- Publication number 20230223266
- Publication date Jul 13, 2023
- SANDISK TECHNOLOGIES LLC
- Fei ZHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE CONTAINING RESONANT TUNNELING BARRI...
- Publication number 20230164988
- Publication date May 25, 2023
- SANDISK TECHNOLOGIES LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE CONTAINING RESONANT TUNNELING BARRI...
- Publication number 20230164990
- Publication date May 25, 2023
- SANDISK TECHNOLOGIES LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE CONTAINING RESONANT TUNNELING BARRI...
- Publication number 20230164996
- Publication date May 25, 2023
- SANDISK TECHNOLOGIES LLC
- Peter RABKIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE CONTAINING RESONANT TUNNELING BARRI...
- Publication number 20230164997
- Publication date May 25, 2023
- SANDISK TECHNOLOGIES LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODELLING AND PREDICTION SYSTEM WITH AUTO MACHINE LEARNING IN THE...
- Publication number 20230142936
- Publication date May 11, 2023
- SANDISK TECHNOLOGIES LLC
- Tsuyoshi Sendoda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
USE OF DATA LATCHES FOR COMPRESSION OF SOFT BIT DATA IN NON-VOLATIL...
- Publication number 20230081623
- Publication date Mar 16, 2023
- SANDISK TECHNOLOGIES LLC
- Hua-Ling Cynthia Hsu
- G11 - INFORMATION STORAGE
Information Patent Application
MODELLING AND PREDICTION OF VIRTUAL INLINE QUALITY CONTROL IN THE P...
- Publication number 20230054342
- Publication date Feb 23, 2023
- SANDISK TECHNOLOGIES LLC
- Tsuyoshi Sendoda
- G05 - CONTROLLING REGULATING
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED CONTACT REGIONS AND...
- Publication number 20230044232
- Publication date Feb 9, 2023
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING INTER-DIE VIA STRUCTURES AND METHODS FOR...
- Publication number 20230042438
- Publication date Feb 9, 2023
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING AN AIRGAP CONTAINING BONDING-LEVEL DIELEC...
- Publication number 20230008286
- Publication date Jan 12, 2023
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIRTUAL METROLOGY FOR FEATURE PROFILE PREDICTION IN THE PRODUCTION...
- Publication number 20220415718
- Publication date Dec 29, 2022
- SANDISK TECHNOLOGIES LLC
- Cheng-Chung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIRTUAL QUALITY CONTROL INTERPOLATION AND PROCESS FEEDBACK IN THE P...
- Publication number 20220413036
- Publication date Dec 29, 2022
- SANDISK TECHNOLOGIES LLC
- Yusuke Ikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAY WITH DUAL-LEVEL PERIPHERAL CIRCUITS...
- Publication number 20220399362
- Publication date Dec 15, 2022
- SANDISK TECHNOLOGIES LLC
- Yuki MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAY WITH DUAL-LEVEL PERIPHERAL CIRCUITS...
- Publication number 20220399358
- Publication date Dec 15, 2022
- SANDISK TECHNOLOGIES LLC
- Yuki MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LOW-K DRAIN-SELECT-LEVEL...
- Publication number 20220367487
- Publication date Nov 17, 2022
- SANDISK TECHNOLOGIES LLC
- Peng ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LOW-K DRAIN-SELECT-LEVEL...
- Publication number 20220367499
- Publication date Nov 17, 2022
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS

Masaaki Higashitani

Person

Patents Grantslast 30 patents

Three dimensional memory device containing resonant tunneling barri...

Three dimensional memory device containing resonant tunneling barri...

Methods and apparatuses for forming semiconductor devices containin...

Three-dimensional memory array with dual-level peripheral circuits...

Methods and apparatuses for forming semiconductor devices containin...

Erase method for non-volatile memory with multiple tiers

Modelling and prediction of virtual inline quality control in the p...

Memory device including a ferroelectric semiconductor channel and m...

Bonded assembly containing different size opposing bonding pads and...

Virtual quality control interpolation and process feedback in the p...

Three dimensional memory device containing resonant tunneling barri...

Virtual metrology for feature profile prediction in the production...

Three-dimensional memory array with dual-level peripheral circuits...

Three-dimensional memory device with separated contact regions and...

Three-dimensional memory device with vertical field effect transist...

Bonded assembly including an airgap containing bonding-level dielec...

Use of data latches for compression of soft bit data in non-volatil...

Bonded assembly including inter-die via structures and methods for...

Three-dimensional memory device including low-k drain-select-level...

Three-dimensional memory device including low-k drain-select-level...

Three-dimensional memory device having support-die-assisted source...

Bonded three-dimensional memory devices with backside source power...

Bonded semiconductor die assembly with metal alloy bonding pads and...

Bonded assembly containing low dielectric constant bonding dielectr...

Deposition apparatus including an off-axis lift-and-rotation unit a...

Three-dimensional memory device with double-sided stepped surfaces...

Bonded assembly employing metal-semiconductor bonding and metal-met...

Three-dimensional memory device having on-pitch drain select gate e...

Multi-zone plasma-enhanced chemical vapor deposition apparatus and...

Multi-zone plasma-enhanced chemical vapor deposition apparatus and...

Patents Applicationslast 30 patents

MODELLING AND PREDICTION OF VIRTUAL QUALITY CONTROL DATA INCORPORAT...

THREE-DIMENSIONAL NOR ARRAY AND METHOD OF MAKING THE SAME

THREE-DIMENSIONAL NOR ARRAY AND METHOD OF MAKING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE LINES AND MET...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY SEPARATED SOURC...

ERASE METHOD FOR NON-VOLATILE MEMORY WITH MULTIPLE TIERS

HIGH DENSITY SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CONTROLLER,...

CIRCUITRY ARRANGEMENT IN A FLOORPLAN OF A MEMORY DEVICE

MEMORY DEVICE INCLUDING COMPOSITE METAL OXIDE SEMICONDUCTOR CHANNEL...

MEMORY DEVICE INCLUDING COMPOSITE METAL OXIDE SEMICONDUCTOR CHANNEL...

MEMORY DEVICE INCLUDING COMPOSITE METAL OXIDE SEMICONDUCTOR CHANNEL...

BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...

METHODS AND APPARATUSES FOR FORMING SEMICONDUCTOR DEVICES CONTAININ...

METHODS AND APPARATUSES FOR FORMING SEMICONDUCTOR DEVICES CONTAININ...

THREE DIMENSIONAL MEMORY DEVICE CONTAINING RESONANT TUNNELING BARRI...

THREE DIMENSIONAL MEMORY DEVICE CONTAINING RESONANT TUNNELING BARRI...

THREE DIMENSIONAL MEMORY DEVICE CONTAINING RESONANT TUNNELING BARRI...

THREE DIMENSIONAL MEMORY DEVICE CONTAINING RESONANT TUNNELING BARRI...

MODELLING AND PREDICTION SYSTEM WITH AUTO MACHINE LEARNING IN THE...

USE OF DATA LATCHES FOR COMPRESSION OF SOFT BIT DATA IN NON-VOLATIL...

MODELLING AND PREDICTION OF VIRTUAL INLINE QUALITY CONTROL IN THE P...

THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED CONTACT REGIONS AND...

BONDED ASSEMBLY INCLUDING INTER-DIE VIA STRUCTURES AND METHODS FOR...

BONDED ASSEMBLY INCLUDING AN AIRGAP CONTAINING BONDING-LEVEL DIELEC...

VIRTUAL METROLOGY FOR FEATURE PROFILE PREDICTION IN THE PRODUCTION...

VIRTUAL QUALITY CONTROL INTERPOLATION AND PROCESS FEEDBACK IN THE P...

THREE-DIMENSIONAL MEMORY ARRAY WITH DUAL-LEVEL PERIPHERAL CIRCUITS...

THREE-DIMENSIONAL MEMORY ARRAY WITH DUAL-LEVEL PERIPHERAL CIRCUITS...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LOW-K DRAIN-SELECT-LEVEL...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LOW-K DRAIN-SELECT-LEVEL...