Masaaki Kanae

Person

Otsu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component having a reinforced hollowed structure
- Patent number 10,593,861
- Issue date Mar 17, 2020
- Murata Manufacturing Co., Ltd.
- Masaaki Kanae
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for manufacturing electronic component module
- Patent number 10,312,880
- Issue date Jun 4, 2019
- Murata Manufacturing Co., Ltd.
- Masaaki Kanae
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component having a reinforced hollowed structure
- Patent number 9,711,708
- Issue date Jul 18, 2017
- Murata Manufacturing Co., Ltd.
- Masaaki Kanae
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component module
- Patent number 9,590,586
- Issue date Mar 7, 2017
- Murata Manufacturing Co., Ltd.
- Masaaki Kanae
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High-frequency module
- Patent number 8,687,378
- Issue date Apr 1, 2014
- Murata Manufacturing Co., Ltd.
- Nobuyoshi Okuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip production method and semiconductor wafer
- Patent number 6,621,149
- Issue date Sep 16, 2003
- Murata Manufacturing Co., Ltd.
- Masaaki Kanae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for making the same
- Patent number 6,501,182
- Issue date Dec 31, 2002
- Murata Manufacturing Co., Ltd.
- Atsushi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetoresistance element
- Patent number 5,432,494
- Issue date Jul 11, 1995
- Murata Manufacturing Co., Ltd.
- Keizou Inoue
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT HAVING A REINFORCED HOLLOWED STRUCTURE
- Publication number 20170279030
- Publication date Sep 28, 2017
- MURATA MANUFACTURING CO., LTD.
- Masaaki Kanae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...
- Publication number 20170133995
- Publication date May 11, 2017
- Murata Manufacturing Co., Ltd.
- Masaaki KANAE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...
- Publication number 20140015373
- Publication date Jan 16, 2014
- Murata Manufacturing Co., Ltd.
- Masaaki KANAE
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20130335938
- Publication date Dec 19, 2013
- Murata Manufacturing Co., Ltd.
- Nobuyoshi OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip production method and semiconductor wafer
- Publication number 20020115232
- Publication date Aug 22, 2002
- Murata Manufacturing Co., Ltd.
- Masaaki Kanae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for making the same
- Publication number 20020050650
- Publication date May 2, 2002
- Murata Manufacturing Co., Ltd.
- Atsushi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Masaaki Kanae

Person

Patents Grantslast 30 patents

Electronic component having a reinforced hollowed structure

Method for manufacturing electronic component module

Electronic component having a reinforced hollowed structure

Electronic component module

High-frequency module

Semiconductor chip production method and semiconductor wafer

Semiconductor device and method for making the same

Magnetoresistance element

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT HAVING A REINFORCED HOLLOWED STRUCTURE

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...

HIGH-FREQUENCY MODULE

Semiconductor chip production method and semiconductor wafer

Semiconductor device and method for making the same