Masaaki Magari

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Kyoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate inspection apparatus and method
- Patent number 7,327,444
- Issue date Feb 5, 2008
- Horiba, Ltd.
- Nobuyuki Naka
- G01 - MEASURING TESTING
Information Patent Grant
Method of and apparatus for measuring stress of semiconductor material
- Patent number 7,295,307
- Issue date Nov 13, 2007
- Horiba, Ltd.
- Nobuyuki Naka
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Method of and apparatus for measuring stress of semiconductor material
- Publication number 20060049480
- Publication date Mar 9, 2006
- Nobuyuki Naka
- G01 - MEASURING TESTING
Information Patent Application
Substrate inspection apparatus and method
- Publication number 20060038980
- Publication date Feb 23, 2006
- Nobuyuki Naka
- G01 - MEASURING TESTING