Masaaki Taruya

Person

  • Tokyo, JP

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

    • Publication number 20220262761
    • Publication date Aug 18, 2022
    • Mitsubishi Electric Corporation
    • Tatsuya KITAGAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CURRENT DETECTION APPARATUS AND POWER CONVERSION APPARATUS

    • Publication number 20200096542
    • Publication date Mar 26, 2020
    • Mitsubishi Electric Corporation
    • Yosuke TSUZAKI
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    IDLE-STOP RESTART CONTROL SYSTEM

    • Publication number 20110049880
    • Publication date Mar 3, 2011
    • Mitsubishi Electric Corporation
    • Tetsushi WATANABE
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    BRIDGE RECTIFIER CIRCUIT

    • Publication number 20100301791
    • Publication date Dec 2, 2010
    • Mitsubishi Electric Corporation
    • Tetsushi WATANABE
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    WELDING METHOD AND WELDING APPARATUS FOR RESIN MEMBER

    • Publication number 20090126869
    • Publication date May 21, 2009
    • Mitsubishi Electric Corporation
    • Shinsuke ASADA
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    Resin welded body and manufacturing method thereof

    • Publication number 20080261065
    • Publication date Oct 23, 2008
    • MITSUBISHI ELECTRIC CORPORATION
    • Seizo Fujimoto
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    METHOD FOR PRODUCING WELDED RESIN MATERIAL AND WELDED RESIN MATERIAL

    • Publication number 20080254242
    • Publication date Oct 16, 2008
    • Mitsubishi Electric Corporation
    • Shinsuke ASADA
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    Semiconductor pressure sensor and die for molding the semiconductor...

    • Publication number 20080178681
    • Publication date Jul 31, 2008
    • MITSUBISHI ELECTRIC CORP.
    • Shinsuke Asada
    • G01 - MEASURING TESTING
  • Information Patent Application

    Semiconductor strain sensor

    • Publication number 20080094167
    • Publication date Apr 24, 2008
    • MITSUBISHI ELECTRIC CORPORATION
    • Eiji Yoshikawa
    • G01 - MEASURING TESTING
  • Information Patent Application

    Semiconductor pressure sensor and die for molding the one

    • Publication number 20070193359
    • Publication date Aug 23, 2007
    • MITSUBISHI ELECTRIC CORP.
    • Shinsuke Asada
    • G01 - MEASURING TESTING
  • Information Patent Application

    Semiconductor pressure sensor

    • Publication number 20070029657
    • Publication date Feb 8, 2007
    • Mitsubishi Denki Kabushiki Kaisha
    • Yoshimitsu Takahata
    • G01 - MEASURING TESTING
  • Information Patent Application

    Semiconductor pressure sensor

    • Publication number 20070017294
    • Publication date Jan 25, 2007
    • Mitsubishi Denki Kabushiki Kaisha
    • Shinsuke Asada
    • G01 - MEASURING TESTING
  • Information Patent Application

    Semiconductor pressure sensor

    • Publication number 20060278012
    • Publication date Dec 14, 2006
    • Mitsubishi Denki Kabushiki Kaisha
    • Seizo Fujimoto
    • G01 - MEASURING TESTING
  • Information Patent Application

    Pressure sensor

    • Publication number 20020177971
    • Publication date Nov 28, 2002
    • Mitsubishi Denki Kabushiki Kaisha
    • Masaaki Taruya
    • G01 - MEASURING TESTING