Masaaki Yasuda

Person

Ibaraki-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Photosensitive adhesive composition, and obtained using the same, a...
- Patent number 8,673,539
- Issue date Mar 18, 2014
- Hitachi Chemical Company, Ltd.
- Takashi Kawamori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photosensitive adhesive composition, and obtained using the same, a...
- Patent number 8,445,177
- Issue date May 21, 2013
- Hitachi Chemical Company, Ltd.
- Takashi Kawamori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photosensitive adhesive composition, and obtained using the same, a...
- Patent number 8,323,873
- Issue date Dec 4, 2012
- Hitachi Chemical Company, Ltd.
- Takashi Kawamori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photosensitive adhesive composition, and obtained using the same, a...
- Patent number 8,293,453
- Issue date Oct 23, 2012
- Hitachi Chemical Company, Ltd.
- Takashi Kawamori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photosensitive adhesive composition, and obtained using the same, a...
- Patent number 8,278,024
- Issue date Oct 2, 2012
- Hitachi Chemical Company, Ltd.
- Takashi Kawamori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Production method of semiconductor device and bonding film
- Patent number 8,034,659
- Issue date Oct 11, 2011
- Hitachi Chemical Company, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive adhesive composition, and obtained using the same, a...
- Patent number 7,851,131
- Issue date Dec 14, 2010
- Hitachi Chemical Company, Ltd.
- Takashi Kawamori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and multilayer substrate therefor
- Patent number 7,692,296
- Issue date Apr 6, 2010
- Hitachi Chemical Company, Ltd.
- Naotaka Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, heat-resistant resin paste and semiconductor dev...
- Patent number 7,560,307
- Issue date Jul 14, 2009
- Hitachi Chemical Company, Ltd.
- Yasuhiro Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, method for preparing the same, adhesive film...
- Patent number 7,070,670
- Issue date Jul 4, 2006
- Hitachi Chemical Co., Ltd.
- Takeo Tomiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, heat-resistant resin paste and semiconductor dev...
- Patent number 7,061,081
- Issue date Jun 13, 2006
- Hitachi Chemical Co., Ltd.
- Yasuhiro Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed semiconductor device, and die bonding material and sea...
- Patent number 6,774,501
- Issue date Aug 10, 2004
- Hitachi Chemical Co., Ltd.
- Kazuhiko Kurafuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,611,064
- Issue date Aug 26, 2003
- Hitachi Chemical Company, Ltd.
- Takashi Kousaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste composition, and protective film and semiconductor device bot...
- Patent number 6,404,068
- Issue date Jun 11, 2002
- Hitachi Chemical Company, Ltd.
- Toshiaki Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of production of semiconductor device
- Patent number 6,223,429
- Issue date May 1, 2001
- Hitachi Chemical Company, Ltd.
- Aizou Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unsaturated polyester resin composition and sheet-form molding mate...
- Patent number 5,445,877
- Issue date Aug 29, 1995
- Hitachi Chemical Co., Ltd.
- Hiroyuki Kawakami
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Unsaturated polyester resin composition and sheet-form molding mate...
- Patent number 5,408,013
- Issue date Apr 18, 1995
- Hitachi Chemical Co., Ltd.
- Hiroyuki Kawakami
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, A...
- Publication number 20130062787
- Publication date Mar 14, 2013
- Takashi Kawamori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, A...
- Publication number 20110079927
- Publication date Apr 7, 2011
- Takashi Kawamori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, A...
- Publication number 20110065260
- Publication date Mar 17, 2011
- Takashi Kawamori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, A...
- Publication number 20100314783
- Publication date Dec 16, 2010
- Takashi Kawamori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRODUCTION METHOD OF SEMICONDUCTOR DEVICE AND BONDING FILM
- Publication number 20100003771
- Publication date Jan 7, 2010
- Hitachi Chemical Company, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, A...
- Publication number 20080176167
- Publication date Jul 24, 2008
- Takashi Kawamori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Resin composition, heat-resistant resin paste and semiconductor dev...
- Publication number 20060180908
- Publication date Aug 17, 2006
- Yasuhiro Yano
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Semiconductor device and multilayer substrate therefor
- Publication number 20050230826
- Publication date Oct 20, 2005
- Naotaka Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-sealed semiconductor device, and die bonding material and sea...
- Publication number 20040000728
- Publication date Jan 1, 2004
- Kazuhiko Kurafuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition, method for preparing the same, adhesive film...
- Publication number 20030159773
- Publication date Aug 28, 2003
- Takeo Tomiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin composition, heat-resistant resin paste and semiconductor dev...
- Publication number 20030082925
- Publication date May 1, 2003
- Yasuhiro Yano
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Masaaki Yasuda

Person

Patents Grantslast 30 patents

Photosensitive adhesive composition, and obtained using the same, a...

Photosensitive adhesive composition, and obtained using the same, a...

Photosensitive adhesive composition, and obtained using the same, a...

Photosensitive adhesive composition, and obtained using the same, a...

Photosensitive adhesive composition, and obtained using the same, a...

Production method of semiconductor device and bonding film

Photosensitive adhesive composition, and obtained using the same, a...

Semiconductor device and multilayer substrate therefor

Resin composition, heat-resistant resin paste and semiconductor dev...

Adhesive composition, method for preparing the same, adhesive film...

Resin composition, heat-resistant resin paste and semiconductor dev...

Resin-sealed semiconductor device, and die bonding material and sea...

Semiconductor device and method for manufacturing the same

Paste composition, and protective film and semiconductor device bot...

Method of production of semiconductor device

Unsaturated polyester resin composition and sheet-form molding mate...

Unsaturated polyester resin composition and sheet-form molding mate...

Patents Applicationslast 30 patents

PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, A...

PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, A...

PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, A...

PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, A...

PRODUCTION METHOD OF SEMICONDUCTOR DEVICE AND BONDING FILM

PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, A...

Resin composition, heat-resistant resin paste and semiconductor dev...

Semiconductor device and multilayer substrate therefor

Resin-sealed semiconductor device, and die bonding material and sea...

Adhesive composition, method for preparing the same, adhesive film...

Resin composition, heat-resistant resin paste and semiconductor dev...