Masafumi Hatsushika

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Omiya, JP

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Patents Grantslast 30 patents

Information Patent Grant
Ceramic circuit board with heat sink
- Patent number 6,033,787
- Issue date Mar 7, 2000
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- B32 - LAYERED PRODUCTS
Information Patent Grant
Highly heat-radiating ceramic package
- Patent number 5,675,474
- Issue date Oct 7, 1997
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- H01 - BASIC ELECTRIC ELEMENTS