Masafumi HIROSE

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Formulation and processing solution for dicing process, and method...
- Patent number 11,608,433
- Issue date Mar 21, 2023
- NIKKA SEIKO CO., LTD.
- Tsuyoshi Tadano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Protective film material for laser processing and wafer processing...
- Patent number 10,700,016
- Issue date Jun 30, 2020
- NIKKA SEIKO CO., LTD.
- Tsuyoshi Tadano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective film material for laser processing and wafer processing...
- Patent number 9,502,295
- Issue date Nov 22, 2016
- NIKKA SEIKO CO., LTD.
- Masaaki Shinjo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240088275
- Publication date Mar 14, 2024
- RENESAS ELECTRONICS CORPORATION
- Masafumi HIROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMULATION AND PROCESSING SOLUTION FOR DICING PROCESS, AND METHOD...
- Publication number 20200075413
- Publication date Mar 5, 2020
- NIKKA SEIKO CO., LTD.
- Tsuyoshi TADANO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PROTECTIVE FILM MATERIAL FOR LASER PROCESSING AND WAFER PROCESSING...
- Publication number 20190006295
- Publication date Jan 3, 2019
- NIKKA SEIKO CO., LTD.
- Tsuyoshi TADANO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE FILM MATERIAL FOR LASER PROCESSING AND WAFER PROCESSING...
- Publication number 20150179538
- Publication date Jun 25, 2015
- NIKKA SEIKO CO., LTD.
- Masaaki SHINJO
- H01 - BASIC ELECTRIC ELEMENTS