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Masafumi Hizukuri

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  • Tosu-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding device and bonding tool
    • Patent number 7,156,281
    • Issue date Jan 2, 2007
    • Matsushita Electric Industrial Co., Ltd.
    • Masafumi Hizukuri
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Component bonder and bonding tool
    • Patent number 6,743,331
    • Issue date Jun 1, 2004
    • Matsushita Electric Industrial Co., Ltd.
    • Seiji Takahashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    COMPONENT PLACEMENT MACHINE AND ATTACHMENT
    • Publication number 20170367227
    • Publication date Dec 21, 2017
    • Panasonic Intellectual Property Management Co., Ltd.
    • HIROKI KOBAYASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding device and bonding tool
    • Publication number 20040211812
    • Publication date Oct 28, 2004
    • MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    • Masafumi Hizukuri
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Component bonder and bonding tool
    • Publication number 20030136523
    • Publication date Jul 24, 2003
    • Seiji Takahashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR